JPS59208741A - 半導体ウエ−ハ用吸着チヤツク装置 - Google Patents

半導体ウエ−ハ用吸着チヤツク装置

Info

Publication number
JPS59208741A
JPS59208741A JP8430983A JP8430983A JPS59208741A JP S59208741 A JPS59208741 A JP S59208741A JP 8430983 A JP8430983 A JP 8430983A JP 8430983 A JP8430983 A JP 8430983A JP S59208741 A JPS59208741 A JP S59208741A
Authority
JP
Japan
Prior art keywords
suction
semiconductor wafer
semiconductor wafers
light beam
angle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8430983A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6311776B2 (enExample
Inventor
Sunao Nishioka
西岡　直
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8430983A priority Critical patent/JPS59208741A/ja
Publication of JPS59208741A publication Critical patent/JPS59208741A/ja
Publication of JPS6311776B2 publication Critical patent/JPS6311776B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP8430983A 1983-05-12 1983-05-12 半導体ウエ−ハ用吸着チヤツク装置 Granted JPS59208741A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8430983A JPS59208741A (ja) 1983-05-12 1983-05-12 半導体ウエ−ハ用吸着チヤツク装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8430983A JPS59208741A (ja) 1983-05-12 1983-05-12 半導体ウエ−ハ用吸着チヤツク装置

Publications (2)

Publication Number Publication Date
JPS59208741A true JPS59208741A (ja) 1984-11-27
JPS6311776B2 JPS6311776B2 (enExample) 1988-03-16

Family

ID=13826890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8430983A Granted JPS59208741A (ja) 1983-05-12 1983-05-12 半導体ウエ−ハ用吸着チヤツク装置

Country Status (1)

Country Link
JP (1) JPS59208741A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6484728A (en) * 1987-09-28 1989-03-30 Tokyo Electron Ltd Alignment
JPH0989997A (ja) * 1995-09-20 1997-04-04 Hioki Ee Corp 基板検査装置用吸引式基板固定具
EP0926708A3 (en) * 1997-12-23 2003-08-20 Siemens Aktiengesellschaft Method and apparatus for processing semiconductor wafers
JP2008053302A (ja) * 2006-08-22 2008-03-06 Tokyo Electron Ltd 基板検知機構および基板収容容器
JP2010029929A (ja) * 2008-07-31 2010-02-12 Disco Abrasive Syst Ltd レーザ加工装置及びレーザ加工方法
JP2014033057A (ja) * 2012-08-02 2014-02-20 Murata Mfg Co Ltd 基板吸着装置
JP2019016714A (ja) * 2017-07-07 2019-01-31 東京エレクトロン株式会社 基板反り検出装置及び基板反り検出方法、並びにこれらを用いた基板処理装置及び基板処理方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6484728A (en) * 1987-09-28 1989-03-30 Tokyo Electron Ltd Alignment
JPH0989997A (ja) * 1995-09-20 1997-04-04 Hioki Ee Corp 基板検査装置用吸引式基板固定具
EP0926708A3 (en) * 1997-12-23 2003-08-20 Siemens Aktiengesellschaft Method and apparatus for processing semiconductor wafers
JP2008053302A (ja) * 2006-08-22 2008-03-06 Tokyo Electron Ltd 基板検知機構および基板収容容器
JP2010029929A (ja) * 2008-07-31 2010-02-12 Disco Abrasive Syst Ltd レーザ加工装置及びレーザ加工方法
JP2014033057A (ja) * 2012-08-02 2014-02-20 Murata Mfg Co Ltd 基板吸着装置
JP2019016714A (ja) * 2017-07-07 2019-01-31 東京エレクトロン株式会社 基板反り検出装置及び基板反り検出方法、並びにこれらを用いた基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
JPS6311776B2 (enExample) 1988-03-16

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