JPS59154031A - 半導体リ−ドフレ−ムの自動供給・取出方法 - Google Patents

半導体リ−ドフレ−ムの自動供給・取出方法

Info

Publication number
JPS59154031A
JPS59154031A JP58029097A JP2909783A JPS59154031A JP S59154031 A JPS59154031 A JP S59154031A JP 58029097 A JP58029097 A JP 58029097A JP 2909783 A JP2909783 A JP 2909783A JP S59154031 A JPS59154031 A JP S59154031A
Authority
JP
Japan
Prior art keywords
lead frame
mold
chuck
semiconductor lead
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58029097A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0153501B2 (enExample
Inventor
Takeshi Amakawa
剛 天川
Michio Osada
道男 長田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP58029097A priority Critical patent/JPS59154031A/ja
Publication of JPS59154031A publication Critical patent/JPS59154031A/ja
Publication of JPH0153501B2 publication Critical patent/JPH0153501B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W95/00—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP58029097A 1983-02-22 1983-02-22 半導体リ−ドフレ−ムの自動供給・取出方法 Granted JPS59154031A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58029097A JPS59154031A (ja) 1983-02-22 1983-02-22 半導体リ−ドフレ−ムの自動供給・取出方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58029097A JPS59154031A (ja) 1983-02-22 1983-02-22 半導体リ−ドフレ−ムの自動供給・取出方法

Publications (2)

Publication Number Publication Date
JPS59154031A true JPS59154031A (ja) 1984-09-03
JPH0153501B2 JPH0153501B2 (enExample) 1989-11-14

Family

ID=12266845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58029097A Granted JPS59154031A (ja) 1983-02-22 1983-02-22 半導体リ−ドフレ−ムの自動供給・取出方法

Country Status (1)

Country Link
JP (1) JPS59154031A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01239944A (ja) * 1988-03-22 1989-09-25 Toshiba Seiki Kk 半導体フレームの供給方法
US4970253A (en) * 1984-08-10 1990-11-13 Hoechst Aktiengesellschaft Thermoplastic plasticized polyvinylbutyral molding composition
JP2018125356A (ja) * 2017-01-30 2018-08-09 第一精工株式会社 基材の搬送装置及び基材の搬送方法
CN113134923A (zh) * 2020-01-20 2021-07-20 东和株式会社 树脂成形品的制造方法以及树脂成形装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5287768A (en) * 1976-01-16 1977-07-22 Yamada Seisakusho Kk Automatic conveying frame body for work load frame
JPS5287767A (en) * 1976-01-16 1977-07-22 Yamada Seisakusho Kk Automatic loading device for work load frame

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5287768A (en) * 1976-01-16 1977-07-22 Yamada Seisakusho Kk Automatic conveying frame body for work load frame
JPS5287767A (en) * 1976-01-16 1977-07-22 Yamada Seisakusho Kk Automatic loading device for work load frame

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4970253A (en) * 1984-08-10 1990-11-13 Hoechst Aktiengesellschaft Thermoplastic plasticized polyvinylbutyral molding composition
JPH01239944A (ja) * 1988-03-22 1989-09-25 Toshiba Seiki Kk 半導体フレームの供給方法
JP2018125356A (ja) * 2017-01-30 2018-08-09 第一精工株式会社 基材の搬送装置及び基材の搬送方法
CN113134923A (zh) * 2020-01-20 2021-07-20 东和株式会社 树脂成形品的制造方法以及树脂成形装置

Also Published As

Publication number Publication date
JPH0153501B2 (enExample) 1989-11-14

Similar Documents

Publication Publication Date Title
JP2003507205A (ja) 同時に溶融可能コアおよびオーバーモールドアセンブリを形成する方法
JPH09155935A (ja) 射出成形装置における成形品のエジェクト方法
JPH11320626A (ja) 射出成形金型、その金型を用いた射出成形方法、その方法を用いた射出成形方法及びその方法に用いる射出成形装置
JPS59154031A (ja) 半導体リ−ドフレ−ムの自動供給・取出方法
JP2004235530A (ja) 封止成形装置及びそれを用いた封止成形体の製造方法
JP2567603B2 (ja) 連続自動樹脂封止方法
JP2009292132A (ja) 樹脂成形品の成形方法並びに成形金型
JP3419228B2 (ja) 二段離型方式射出成形金型
JP4104711B2 (ja) カード基材の成形用金型及びｉｃカード製造方法
JP3252146B1 (ja) プラスチックレンズの製造方法
JP2008230005A (ja) プラスチックレンズ成形方法およびレンズプリフォーム
JP4193298B2 (ja) 射出成形用金型装置
CN221819395U (zh) 一种保证注塑产品边缘锐利的注塑模具
KR100641857B1 (ko) 향상된 컬 제거에 특징이 있는 이동성형장치
CN112659480B (zh) 一种手机后盖带火山口的二次压缩模具
JPH0637129A (ja) モールド金型、リードフレーム及び半導体装置の製造方法
JPH11296919A (ja) 光ディスク用金型
JP3252593B2 (ja) 射出成形用金型装置
JP2004179283A (ja) 樹脂成形用金型への供給方法と取出方法及び供給機構と取出機構
JPS59222324A (ja) アウトサ−ト成型用金型
JP3897961B2 (ja) 樹脂成形装置
JP3179224B2 (ja) エージング装置
JP4070833B2 (ja) 中空成形品の射出成形方法および射出成形用金型
JPH0511531B2 (enExample)
KR940002858Y1 (ko) 사출금형의 이형불량 방지를 위한 비디오 테이프용 릴 다운구조