JPS59145552A - 複合物品 - Google Patents

複合物品

Info

Publication number
JPS59145552A
JPS59145552A JP59004654A JP465484A JPS59145552A JP S59145552 A JPS59145552 A JP S59145552A JP 59004654 A JP59004654 A JP 59004654A JP 465484 A JP465484 A JP 465484A JP S59145552 A JPS59145552 A JP S59145552A
Authority
JP
Japan
Prior art keywords
nickel
offshore
aluminum
alloy
steel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59004654A
Other languages
English (en)
Inventor
ジヨン・エフ・ブリ−デイス
ジユリウス・シ−・フイスタ−
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of JPS59145552A publication Critical patent/JPS59145552A/ja
Pending legal-status Critical Current

Links

Classifications

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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/002—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of light metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 本発明は電気的用途に特別の有用性を有する睦Ｊニッケ
ル合金に関するものである。
数多くの電子装置はシリコンチップ上に半辞体坂積回ｒ
６を含むパッケージをオ］１用している。一般的には、
＾１［記回路はリードフレーム乃ＭＨ’Ｊ−ド碑体のよ
うな別の′眠気部品へと１っ父ばそれより多いリードワ
イヤ２介して′山気的に接続されている。
往々にして、前記リードワイヤは金から形成されている
。何故ならば金は電気伝尋度及び結合部に１−ぐれてい
るからである。しかしながら、金は高１出であるため、
リードワイヤとしてアルミニウム及びその合金のような
代替物質ケ用いようとする傾向がある。
リードフレームとカップの間に゛ル、気的徽続をもたら
′１−のに％　ＭｉＪ記リードワイヤは一般的には該チ
ップの表面上の金属パッドに結合される。前記パッドは
チッソ０上に７％＞、　イ”ｆさＪしる金又はアルミニ
ウムのスポットから形成１−ることが出来る。
当業界においては釜リードワイヤのような余部相かアル
ミニウムパッドのようなアルミニウム部。
相に結合される時に、適七゛件の間融があることか９・
］］られている。高温度にさらされた時アルミニウムと
金の組合せはある檎の金属間化合物を形成し、この化合
物が両部相間の冶金学的結合部の強度及び信頼性χ劣丁
させる可能性がある。この現象は紫疫（ｐｕｒｐｌｅｐ
ｌａｇｕｅ　）と呼はれている。
この問題を防止するために多くの異なるアプローチか試
みられてきた。１つのアブローナにおいて、アルミニウ
ム・リードワイヤのみがアルミニウムパッド又はストラ
イプに結合され、金のリードワイヤのみがメッキされた
金パッド又ｑ金ストライフ″′に結合される。場合によ
ってはワイヤタイツ０のものはリードフレーム金属乃至
合金には結合されない。
望ましくない金属間化合物の形ｈｌｖケ防止１−るため
のよりありふれた技法は結合されるへき部品の少なくと
も一方ンニッケル又はニッケルーωカ素のような逆当な
バリア物ノ員で被惨コーティングすることであった。前
記バリア物質は結合さハた怖朴間の拡散の結果とし℃金
属間化合物か形成さノ′シることｑ　ｖｒ　Ｊ）ニーａ
−る。ギャリ氏盾による木国和許ｍ３，７８１．５９６
号はそのよウナニツケルパリア層がアルミニウムパッド
及び金托間に弾入されているのケｆ１１示している、そ
のようなバリアｊｖは望ずしくない金属間化合物ｌの形
成を防止するのに有効であるが、互いに結合さ！しるへ
き部材の一つ又はそれ以上に保護コーティング’ｌ　１
１ｔＳ加するのに関連する伺カロ的費用が高いためにこ
のアノ０ローチは実用的ではない。加えるに、コーチイ
ンクの非−様性及びメンキされたコーティング内に少量
のメッキ溶液がとりこまれてこれが後にあぶく及び他の
欠陥２生ずるという間馳が存在する。史には、バリア物
質としてニッケルが用いられる時には、核ニッケルが高
温度にさらされた時にニッケル酸化物か形成され、これ
がきわめて除去しにくぐ、γ１ｉＩａ足にろつｆ□Ｊけ
されないとい５問題が生ずる。
別のアプローチはリードワイヤ、リードフレーム、バ′
ツド及びその類いに用いる物質として金及びアルミニウ
ム以外の物質７探イことであった。
Ｊ穎もひんはんにｈ及される上記ｌｌ勿質の中にはニッ
ケル及びその合金、鈷及びその合金、コバルト及びその
合金部ひに鋼及びその合金が含まれろ、例えは、ホワイ
ト氏による米国ｌ（す計第３．２１７．４０１号ＶＣお
いては、ニッケル又は銅リードワイヤかアルミニウムで
被援され次に半導体装置のシリコン層に対して（′ＩＩ
＋圧されている。ペイライン民等による米国〕持ｆ？＋
′第４．ＣＩ　９６．９８３号においては、アルミナセ
ラミック基紙体上の金膜に銅ワイヤリードン結合する方
法か開示されている。
リードフレーム又はリード導体及び他の電気部品Ｙコパ
ールのようなニッケル、鉄及び／又はコバルトの合金部
びに釦ｊ合金ｃ７２５００及びニッケル銀のようなリン
青砲、赤黄外１、駅銅及び鋼ニッケルを含む鉋の合金か
ら形成せしめることが提案されている、シバタ氏の米国
特許第３．！：１６８．３０１号、コックスジュニア氏
のｉ　３．６８９，６８４　号、オリファントジュニア
氏の第３．８３２．７６９号及びアリタ氏の第４，３６
７．０’８９号並びにＮｌｃｋｅｌＴｏｐｉｃｓ誌（第
８頁）の記事「ストライプ状σ）ＯＡ７２５（９％ニッ
ケル）は金の代りになり仕事の貿用馨〃１」約する」に
はこノｔらの眠気部品ＶＣ用いられた種々の物質が例示
さハている。
不幸なことに、銘１及び銅合金部材をアルミニウム含有
部′４ソに結合才ると銅−アルはニウム金属間化合物を
形成することになる。こ１１らの鯖−アルミニウム金属
間化合物は脆ｆヒし易く、部材間Ｑ〕結合の一体性ン劣
下せしめろ。こｉｔらの化合物は又結合された部材の電
気伝導度特性にも悪影Ｎ乞与える。これら□の望ましく
ない金属間化合物のプレ欣を防止するために、半嗜体寮
造業者はリードワイヤ＋７）　ヨ５７．Ｃアルミニウム
部相がリードフレームのようン、Ｃ卸１１部拐に結合さ
ノしる領域に欽メッキされたストライフ’　Ｙ　ｆ、＞
力１１シてきた。蝉（メツキスドライブの代りにニッケ
ルメッキ表面も又用いられてきた。
本発明の１つの目的はアルミニウム官有部材に結合１−
ることの出来る剰１リベース合金部相であってｅｌｌ−
アルミニウム全１ｆ＋５間化合物の形成か少ない銅ベー
ス合金部朴ンＪ８供することである。
本ヴへ明の別の目的はアルばニウム倉有部拐に結合さｉ
ｔｊる劇ベース合金部枳であって、改−倶された９Ｄｒ
度及び一体（９Ｅを特命とする結合１ｑミ乞有する用ベ
ース合金ｆ１１３徊を提供１〜ることである。
本発明の別の目的はアルミニウム含有部相に結合出来る
前述の附ベース合金であって、！侍に串、気Ｂ’ｉ　Ｊ
ｆＪ途に有用性７有マろ物品を形成出来るような釦ｊベ
ース合金Ｚ提供することである。
これらの目的及び史に別の目的は以下の説明及び付図か
ら明らかになるであろう。
本発明によれば、アルミニウム官有部材に結合され、得
る鋼ベース合金であって形成される鋼−アルミニウム金
属間化合物のレベルがｌ」・さい帽ベース合金が開示さ
れている。約１ｂ％又はそれ以上のニッケルを格５力！
、＋−ｆること（（より望茹しぐないシーーアルミニウ
ム金属１’、Ａｊ化合物の核発生靭１度及びその後の成
長速度か抑？ｔｉｌｊされるというごとか４−１１明し
ている。
アルミニウム￥！ｉ！ｌＩに結合さ！しるへ゛き鋼部相
か約１５％から約３０弼のニッケルケ含む卸すベース合
金から形成される時′に良好な結果が得られることが判
明している。丙−ましい実施例においては、地部材は約
１９係から約２６％のニッケルン含む矩ベース合金から
形成される。
本発明は畔］部和かアルミニウム含有部わＶこ結合され
るよ５な集積回路組立体にお℃・て特別の有用性を備え
ていることか伯１明した。例えは、Ｒ１Ｉ記鋼部側はア
ルミニウムリードワイヤに結合されるリードフレームと
することが出来ろ。ここｖｃ　Ｍ　Ｉ＃」されろニッケ
ル含有鋼ベース合金は生碑体パッケージのためのリード
フレーム、リードワイヤ及び／又はビームリードテーラ
０ン形成するのに用いることが出ンＳろ。
アルミニウム部相に結合されるｈ１ｆ記釦１部林はニッ
ケル含有銀合金単体から形成しても良いし、ニッケル“
含有胎合金ン含む沖合材から形成１−ることも出来る。
沖合宿迄体の一部として用いらゎ、る時ｔＬは、１Ｖｊ
Ｉ記ニッケル自有剣１合金はクラッチゝイング牧）質又
はコア物質のいづれとしても用いろことが出来る。
以下句図をｈ照して本発明のより具体的７ｆ祝明を行な
う。
本発明［よｆ’Ｌは、前述の目的及びオリ点は容易に達
成びｔｊる。
次に第１図ン参照′″′４−ると、集積回路組立体１゜
がレリ示さＪｌて（・る、、前記ボ目立体１ｏは金〃゛
蝋ベース１４上に装着さえした集積１回路チップ１２ン
１．（ｍえてイル。前記チップ１２けシリコン５！、は
ケ８ルマニウムのような洒当な１勿質から形成１−るこ
とが出来、例えは凄着剤の如き適酒な方法によってベー
ス１４に鋲７！ｉｒ１〜ることか出来る。ソー１フレー
ム１８からの一枕数個のり−ド１６も又ベース１４に装
着さ］する。前記リード１６はそれらン訪電体物質１５
に結合することにより４−スに装着することが可能であ
り、当該物質１５はベース１４ｖｃｕ合される。
抑数個のリードワイヤ２０かチップ１２及びリード１６
に結合され、これらの間に重気的徽続部を形成している
。前記リードワイヤ２ｏは例えはサーモンニックボンヂ
イング、熱圧縮ボンディング、超旨鼓ボンディング等の
〕加当な慣用技法を用いて前記チップ１２及びリード１
６に結合することか出来る。一般的には、ｈ；Ｊ記す−
　ドヮイヤ２゜はチップ１２の表面２４上の複数イ向の
パッド２２に結合さり、る。
集積回路＝ｎ立体の棹々の部品には多ぐの異なる物質か
月４いられている。例えは、前Ｓピ１）−１’ｉ６及び
リードフレーム１８は刻］り及び銅合金から形５Ｖされ
てセリ、リードワイヤ２υはアルミニウムンイヤであり
、パッド２２は表面２４上にメッキされた金のスポット
であった。これらの物質で組立体ビ刑成１〜る時の生鰻
なｊ■」趙点はφ１（リーアルｄニウム金如聞化合物及
び金−アルミニウム金属間化合物のような＝　−ｔ　Ｌ
−＜ない金属間化合物の形成であり、こねらの化合物は
前配袖々の部品間の冶金学的結合部σ）Ｔｉ気伝褥〃（
、ろうイｑけ悦１、延性、一体す１三及　びイ３　累Ｉ
Ｊ１≦トにｐ基ζ力七シり叶　３七・ツクは−１−。
少／、ｃくとも約１５％のニッヶルン含む餉ベース台ぐ
かアルミニウムリッチを花材に矛古合されると、酒ｄ（
合金か者しく低いレベルの餉−アルミニウム金属間化合
物しか形成しないと（ミう拐〈べきη、実が判ゆ」した
。この結果、前述の；ｉ：ｈ合性の１４Ｊ題？７版少さ
ゼる明がＤＪ能であり、とえ金ＭＹメッキしたり金の部
ａｉ’＋　’（用いるという方法がいらなくなる。例え
ば、集積［ｑ１路組立体の前記リードフレーム及び／ン
は＋７−ドワイヤはここに説ゆ４さとるニッケル含有゛
卸合金から形成’−ｔろことか出来る。カｅえろに、チ
ツフ′上の金リードワイヤ及び／父は金パツドはアルミ
ニウムリードワイヤ〃び／又はパッド装置４翼大ろこと
が出来る。
少なくとも約１５％のニッケル蔭加物な含む姉す合金は
アルミニウムリッチな金属１…化合物形成作用ケ抑制′
ｆることが出来ろ。＾１１訃：合金内のニッケルは銅の
拡散速度ケ碌連せしめることによりこれらの望ましく／
Ｘい金属間化合物の杉発生迭１１４″及び成長速度ン判
＋　１）１１−１−ろものと力えら尤；る。そσ）結果
、９ｉｂ・１とアルミニウム含有ｉη（≦Ｈ間に形成さ
れる結合部には改−＋−？き、ｆ７た弘贋、市気的伝痔
１ｙ、ろ５ｒＪヒ）性及び１幾樫１均一１本性が借られ
４）。
本発明に脩るｔ：ｏ、ｊ　＠金は約１５％から約３０％
の節回のニラクル含有率馨有しているべきである。
好ましぐは、部１ｈピニッケル含有率は約１９％から約
２６％σ）ｎ・１囲にある。前記七省内には１つ又はそ
れ以」二の４＋　７−＋ｐ　＋的ｊ九プζか存在してい
てもＲいか、゛　当該元素（・まニッケル添力１］元素
の役割ンＤ害ぜ１°、（１ｊｌの望ましい和性に危く＃
勧乞及丙さないことが前十是粂注である。門トカ１］す
ることσ）出来るう己素には」乙釦、・マンガン、鉄、
錫、クローム及びモリブチ８ンか含まれろ。こ１１もの
元素は以下のレベルにおいて存在していても良い。ｊｉ
’１．ｌちＭｉ＋嚢書ま約２５係速いマンガンは約６％
迄、鉄は約１％迄、炬・は約１％迄、クロームは約５雀
迄及びモリブデンは約２雀迄である。力１１えるに、ア
ルミニウム及び／又はケイ素ンハ１■紀ニッケル含有台
金に添力１ｊ　して１ＩＩＩＩ酸化性ン改善し、より商
度の強黒及び剛曲げ疲労強度乞提伊−イーることが出来
る。ｑ＋、ｌ　Ｎｆ金合金約１雀迄のアルεニウム及び
／又は約１雀迄のケイ素を含むことが出来る。ここでは
、表示の自分率は也漏・自分イ・（％）ケ示している。
説明されたニッケル１０ｉ４ｊ合金は任かの１ハ用の方
法で錫Ｊ造１−ることか出来る。棺ボの勧進方法はり身
に決力！的／工都１月では７ｊぐ、１θ接チル父は理絖
納造のような泊Ｉ当な方法ン採用１−ること力）出来ろ
。
１造の後、Ｍｉ＋記合金合金当な処理手順に従って加工
することが出来る。用いられる加工プロセスは当該合金
に句与すべき特性とその用途に依存１−る。
例えは、ｎｉｌ記ニッケル含有銅合金は適当な開始温度
を以って熱間圧延することか出来る。熱間圧姑の後、前
記合金は少なくとも一回の中間ｙｔ、釜ψン施１−か施
さないで１つ父ばそれ以上のステップで最終の板塊迄冷
間圧処−４−ろことか出来る・宵を終機厚に仕上げられ
た後Ｍｉ記全合金それにハｒ望の調質カＩ果に与えるた
めにｉβ１当な熱射８！ンＭＩＪりす手が出来る。
種々の処理段階を当業界周知の態様で゛実施１−ること
か出来る。
所望の和゛性及び／又はル４躍、川を・晦えるよう処理
された供前記ニッケル包有矩合金は所望の壊・１品に製
作１″ることか出来る。例えは前記＠金はリードフレー
ム１８、リードワイヤ２０、リードフームテーフ０２６
又は１０シの物品へと形成することか出来る。こ才′シ
らσ）Ｄｔ望の物ノ品’ｒ　Ｊ＋；成１−ろのに当粟界
で周矢ＩＪ　Ｏ）弘当な製作ナヌ法を用いることか出え
ろ。
Ｑ＋望とあらば、前記ニッケル含有拒合釜（・エアルミ
ニウム剖拐ン結合１−べき抄・合構造体の一梢として月
１℃・ることが出来ろ。前記ケ合惚ん体はクラツディン
グ又はコア物質乞）し欣１−るニッケル含有チ５合金に
より二車又は二車にクラッドされることか可能である。
もしも０１丁記麹合偵造体か、リードフレーム父はビー
ムリードテープとして月・いらハろ時にはｎＪ記ニッケ
ル含有デ凹合金はｙすましくはクラツディング物質とし
て用いらハ、一方前討コア物黄は蜘１合金０１５１００
、（３６３８００゜０６３８１０、Ｃ１１０Ｌｌ［Ｊ及
び０１９４００のような適当な金属又は合金から形成寸
ゐことが出来る。ハ１［記ニッケル含有銅合金火りラツ
ディングｑ勿）ｆ荘として月１いることにより、アルシ
ミニウム音１３拐にＦｉ’ｉ合１−ろことの出来る溺足
な表面が提イμされろ。
本発明を例示１−るために５つの秩合拐か用急された。
これらのれ金相はアルミニウム合金１１００のストリッ
プを次のコア物質にクラッド結合させたものからなって
いる。　ＣＩＩＺｉＪ合ＫＯ１１０Ｃｊ［Ｊのストリン
ツブ、（２）基本Ｈ′−Ｊに約１０％のニッケルと残余
θ）基本１」９に制用とからなる鎗合金のストリップ、
（３）基本的に１．ｉ　２　［］％のニッケル及び残余
の基本的に餉とからなる卸１合金のストリップ、（４１
基本的に約６０％のニッケル及び残余の基本的にｔｌ「
；とから／ｆる静す合金のストリップ０、並びに（５）
ニッケル合金２００のストリレツブである。前記ネル合
相は登録Ｈｙ標ＰＯ８工Ｔ−ＢＯＮＤボンディング方法
乞用（・て形成された。
各松合わの試料は２００℃、３．００℃及び４００℃に
おいて焼鈍された。炉、銚時間は６２時間迄にわたって
いた。その後前記試料は金属間化合物があるかどうか金
属組織学的に吟味された〇各焼鈍条件において各桐相試
片内に峰められたん太の金属間化合物ノリ賭が表１に要
約されている。
表　１ 最大の金属間化合物Ｊ卑吐（μｍ） 時　　間　　（ｈ） 初台徊　γ品度　２　　４　　８　　１６　　３２ＡＬ
Ｖｃ１１００　　　２００　　［Ｊ、３９　０．３９　
０．７８　　ｔＪ、７８　０．７８んＭＯｕ、ｔ−１Ｏ
Ｎｉ　　　２００　　　［Ｊ　　　Ｕ、３９　０．７８
　　（３，６９［Ｊ、７８Ａ、ＶＣ！ｕ＋２ＯＮｉ　　
　　２００　　　　ｆＪ　　　　　　ＯＯＯｏろ９　　
０．３９Ａｉ／Ｃｕ＋３ＯＮｉ　　　　　２０口　　　
　０［Ｊ［Ｊ［Ｊ［ＪＡｉ２１Ｎ１２［ＪＯＯ０００Ｌ
Ｉ Ｑ、５　　　１　　　２　　４　　　Ｂ　　　’＋６Ａ
ＪＶＣＩＩＯ３０［Ｊ　　１．６１．６　　２．３　３
．１　３．１３．ソＡＪ！／１０ｕ＋ＩＱＮｉ　　　　
３００　　１．６　　１．６　　　２．３　　２．３　
　　ろ、１　４．７Ａｉ／１０ｕ＋２ＱＮｉ　　　　　
ろ００　　　　　［Ｊ　　　　　　ＩＪ、７８　　　１
．６　　　２．３　　　２．３３．１Ａ４１０ｕ＋３Ｏ
Ｎｉ　　　　　３００　　　　　０　　　　　　　　Ｃ
１１１口　　　　　　０　　　　　ＵＡ」少イＮｉ　　
　　　　　　　　　　３０ｏｏｃｉａｕｏ。
Ｑ、ｂ１２４８１６ Ａｋ／ｃ１１０　　　　４００　　６．２　　７　　　
　シ、３１０．９　１６　２１．８Ａ４／ｃｕ＋１０ｔ
ｖｉ　　　４００　　５．４　　７　　１１．７　１６
　２０．２２７．２Ａ７／Ｃｕ＋２ＯＮｉ　　　４００
　　３−９　５．４　　７．８１０．１　１４．４　１
６ＡｊｖＣｕ＋３ＯＮｉ　　　　４００　　１．６　０
．７８　　２．３　　２．３　　５．４　　６．２Ｍハ
ｉ　　　　　　４００　　０−３９［Ｊ、７８　　Ｌ６
　２．３　２．３　４．７このデータは不発１力に従う
ニッケル添力ｌｌ！ｌ勿か餉用−アルミニウム金漢間化
合物形成速１ｊ３’：　Ｙ　１目的に抑１１ｉｌＩ　し
ていろということケ示して（・ろ。
［）ｔＪ　Ｍ１２ニッケル含有合金は集積回路組立体の
ための部品用として部門されてきたが、当該合金はｌｉ
ａ部拐かアルミニウム部セに結合され、銅−アルミニウ
ム金が、間化合物のｊｐ　Ｉｉンｉｐｉ小に押えたいと
いう１］１シの用途にも用いることか出来る。
炉１図においては制別のタイプの１１−積［Ｉ−１］路
糾立体が例示さＪｔだか、本発明の銅合金部イソはイ１
１フのタイプ０の片４１″（回路組や体にも用いる事か
出来る。例えは、本会１１１合金部わば１つ又はそれ以
上のアルミニウム又はアルミニウム合金ワイヤによって
チップに’ｆ’ｊ：気的に接続される支柱電気部品又は
佃の電気部品ケ構成するｑ」が出来る、 本発明によれは、不明細刊において述べた目８す、手段
及び第１」カン十分満足する、銅−アルミニウム金属間
化合物の成長ケ抑制出沫る動・１合金か提供されている
ことは明白でル）る。本発明はその特定の実施ｆ１４と
１ｌｉｌｉ合せて酸１明されてきたが、ｔｅｉｌ址の説
明より当業渚には多くの代替例、イレ整例及び変史例が
汁んでくることは明らかて゛ある。従って、そのような
全ての代替例、（ｌ、＋」タイプ１１及び亥史例（ま徒
Ｗ「誼求の筋」四のね神に含まれろものと理′Ｍされた
い。
【図面の簡単な説明】
第１図は年積回路組泣体の１！１）Ｔ面図であり、外積
回路チップの表面上のパッド’Ｙ　ＩＪ−ドフレームの
ＤＪ　？３１Ｓと連結しているワイヤ溶体７示して℃・
る、第２図はリードフレームの平ｒａＪ図、第６図はビ
ームリードテープの平面図である。 １８・・リードフレーム、２０・・リードワイヤ、１２
・半導体チップ、２２・・パッド 代理人　浅　村　　　皓

Claims (1)

  1. 【特許請求の範囲】 （１）　　アルミニウム含有物買から形成された第１の
    部材（２０）と、銅含有ｑ９／Ｊ質から形成された第２
    の部材（１８，２２）とを有し、前記第１及び第２の部
    材は互いに結合されている沖合物品において、前記第２
    の部材（１８，２２）は少なくとも１５％のニッケル及
    び残余の基本的に鋤とからなる銅ベース合金によって形
    成されており、ｉｊｉ記紳リベすス合金は側ｒｊ−アル
    ミニウム金属間化合物のルｙ長乞抑制していることン特
    普とする沖合物品。 （２）　　特許請求の範囲第１項に記載の沖合物品にお
    いて、前記鋼ベース合金か４本的に約１５％から約３０
    ％σ）ニッケルと残余の基本的に鋼とからなっているこ
    とを特徴とする沖合物品。 （３）特許請求の範囲第１項に記載の沖合物品［おいて
    、前記鋼ベース合金は基本的に約１９％から約２６％の
    ニッケル及び残余の基本的［納とからなっていること乞
    ％徴とする沖合物品。 （４）特許請求の範囲第１項に記載の沖合物品において
    、該物品は集積回路組立体ケ有しており、前記第２の部
    材はυ〜ドフレームＣ１Ｃ１３）しており、前記第１の
    部材は前記リードフレームに結合されたリードワイヤ（
    ２０）ｖ有していることを％徴とてる沖合物品、 （５）Ｉｌｌ′８１′許請求の範囲第１項に記載の沖合
    物品において、該物品は半導体チップ（１２）’Ｙ備え
    た集積回路組や体を臀しており、前記第１の部材は前記
    チップ０の表面上にパッド（２２）ｖ有しており、前記
    第２の部材は前記パッドに結合されたリードワイヤ（２
    ０）Ｙ有していること乞特徴とする沖合物品。 （６）　　％計請求の範囲第１項に記載の初台物１品に
    おいて、該沖合物品は半導体チップ（１２）を備えた年
    積回路組立体を有しており、前記第２の部υは電気的に
    導電性の部材（１８，２２）を有しており、前記第１の
    部材は前記チップ及び前記第２の部材間に接続部を形成
    でる少なくとも１本のワイヤ（２０）２有していること
    乞特徴とてるネぷ合勺勿品。 （７）特許請求の範囲第１項に８１載の沖合物品におい
    て、前記第２の部徊はクラツディング物質としての前記
    銅ベース合金と金属又は合金のコアと乞備えた沖合構造
    体ケ有していることを％葎と１−るネ〃合物品。 （８）特許請求の」リシ囲第１項に１戦の初合物品にお
    いてｔｑＩＪ記剰１」ベース合金は約１％迄のアルミニ
    ウムを含んでいること乞特徴とする伏合物ノ晶。 （９＋　　ｔ＋＞　ｇ’ｒ　ｇ青水の！ｉ）　ｌａ」ｍ
    　１　ｍに記載の初会９勿品において、１４ｉｌ記鋼ベ
    一ス合金は約１％迄のケイ系を含んでいることン斗寺り
    と才る初＠９勿品。 ０（））　　アルミニウム含有部Ｎ４　（２０）　［結
    合された銅含有部拐（１８，２２）を備えた物品におけ
    ろ胎−アルミニウム金属１出化合物の成長を用ノ制する
    方法であって、該方法は前記附含有部相（１８゜２２）
    Ｙ基本１」９に少なくとも約１５係のニッケルと残余の
    基本的に鋼とからなる鉋ベース合金から形成する段１竹
    と、前記鋼ベース合金娶前記アルミニウム含有部材に結
    合１−る段階とを有イろことン特徴とする沖合物品。 θ１）特許請求の範囲第１０項に記載の方法において、
    前記銅ベース合金が基本的に約１５係から約６０％のニ
    ッケル及び残余の基本的に銅とからなることン特徴とす
    る方法。 （１２）　　特許請求の範囲第１０項に記載の方法にお
    いて、前記鋼ベース合金か基本的に約１９％から約２６
    ％のニッケル及び）Ａ金の基本的に蛸とからなること乞
    特徴とする方法。
JP59004654A 1983-01-13 1984-01-13 複合物品 Pending JPS59145552A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US457605 1983-01-13
US06/457,605 US4498121A (en) 1983-01-13 1983-01-13 Copper alloys for suppressing growth of Cu-Al intermetallic compounds

Publications (1)

Publication Number Publication Date
JPS59145552A true JPS59145552A (ja) 1984-08-21

Family

ID=23817391

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59004654A Pending JPS59145552A (ja) 1983-01-13 1984-01-13 複合物品

Country Status (4)

Country Link
US (1) US4498121A (ja)
EP (1) EP0116844A3 (ja)
JP (1) JPS59145552A (ja)
CA (1) CA1219104A (ja)

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Also Published As

Publication number Publication date
EP0116844A3 (en) 1985-01-30
CA1219104A (en) 1987-03-17
US4498121A (en) 1985-02-05
EP0116844A2 (en) 1984-08-29

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