JPS59133365A - 真空装置 - Google Patents
真空装置Info
- Publication number
- JPS59133365A JPS59133365A JP22202383A JP22202383A JPS59133365A JP S59133365 A JPS59133365 A JP S59133365A JP 22202383 A JP22202383 A JP 22202383A JP 22202383 A JP22202383 A JP 22202383A JP S59133365 A JPS59133365 A JP S59133365A
- Authority
- JP
- Japan
- Prior art keywords
- vacuum
- valve
- deposition chamber
- vapor deposition
- slow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22202383A JPS59133365A (ja) | 1983-11-28 | 1983-11-28 | 真空装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22202383A JPS59133365A (ja) | 1983-11-28 | 1983-11-28 | 真空装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP594177A Division JPS5913587B2 (ja) | 1977-01-24 | 1977-01-24 | 真空蒸着装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6573286A Division JPS61217572A (ja) | 1986-03-26 | 1986-03-26 | 真空装置による処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59133365A true JPS59133365A (ja) | 1984-07-31 |
| JPH0124224B2 JPH0124224B2 (enrdf_load_stackoverflow) | 1989-05-10 |
Family
ID=16775885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22202383A Granted JPS59133365A (ja) | 1983-11-28 | 1983-11-28 | 真空装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59133365A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6191375A (ja) * | 1984-10-11 | 1986-05-09 | Hitachi Electronics Eng Co Ltd | プラズマエツチング装置の排気ベント機構 |
| FR2606426A1 (fr) * | 1986-11-10 | 1988-05-13 | Stoltenberg Kevin | Procede et systeme de traitement de pieces sous vide |
| WO2011102405A1 (ja) * | 2010-02-18 | 2011-08-25 | 株式会社アルバック | 縦型真空装置及び処理方法 |
| JP2020095513A (ja) * | 2018-12-13 | 2020-06-18 | 株式会社アルバック | ベント装置 |
| CN112609044A (zh) * | 2020-12-11 | 2021-04-06 | 北京首钢股份有限公司 | 一种rh预抽真空装置与方法 |
| CN117305801A (zh) * | 2023-11-29 | 2023-12-29 | 龙焱能源科技(杭州)有限公司 | 用于基板镀膜的传动装置及镀膜传动系统 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0430627U (enrdf_load_stackoverflow) * | 1990-07-09 | 1992-03-12 |
-
1983
- 1983-11-28 JP JP22202383A patent/JPS59133365A/ja active Granted
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6191375A (ja) * | 1984-10-11 | 1986-05-09 | Hitachi Electronics Eng Co Ltd | プラズマエツチング装置の排気ベント機構 |
| FR2606426A1 (fr) * | 1986-11-10 | 1988-05-13 | Stoltenberg Kevin | Procede et systeme de traitement de pieces sous vide |
| WO2011102405A1 (ja) * | 2010-02-18 | 2011-08-25 | 株式会社アルバック | 縦型真空装置及び処理方法 |
| JP2020095513A (ja) * | 2018-12-13 | 2020-06-18 | 株式会社アルバック | ベント装置 |
| CN112609044A (zh) * | 2020-12-11 | 2021-04-06 | 北京首钢股份有限公司 | 一种rh预抽真空装置与方法 |
| CN112609044B (zh) * | 2020-12-11 | 2022-07-19 | 北京首钢股份有限公司 | 一种rh预抽真空装置与方法 |
| CN117305801A (zh) * | 2023-11-29 | 2023-12-29 | 龙焱能源科技(杭州)有限公司 | 用于基板镀膜的传动装置及镀膜传动系统 |
| CN117305801B (zh) * | 2023-11-29 | 2024-03-08 | 龙焱能源科技(杭州)有限公司 | 用于基板镀膜的传动装置及镀膜传动系统 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0124224B2 (enrdf_load_stackoverflow) | 1989-05-10 |
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