JPS5896756A - マルチチップパッケージ - Google Patents

マルチチップパッケージ

Info

Publication number
JPS5896756A
JPS5896756A JP56194428A JP19442881A JPS5896756A JP S5896756 A JPS5896756 A JP S5896756A JP 56194428 A JP56194428 A JP 56194428A JP 19442881 A JP19442881 A JP 19442881A JP S5896756 A JPS5896756 A JP S5896756A
Authority
JP
Japan
Prior art keywords
wiring board
chip package
chip
base
nth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56194428A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0316785B2 (enExample
Inventor
Yoshitaka Fukuoka
義孝 福岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56194428A priority Critical patent/JPS5896756A/ja
Publication of JPS5896756A publication Critical patent/JPS5896756A/ja
Publication of JPH0316785B2 publication Critical patent/JPH0316785B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
JP56194428A 1981-12-04 1981-12-04 マルチチップパッケージ Granted JPS5896756A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56194428A JPS5896756A (ja) 1981-12-04 1981-12-04 マルチチップパッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56194428A JPS5896756A (ja) 1981-12-04 1981-12-04 マルチチップパッケージ

Publications (2)

Publication Number Publication Date
JPS5896756A true JPS5896756A (ja) 1983-06-08
JPH0316785B2 JPH0316785B2 (enExample) 1991-03-06

Family

ID=16324430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56194428A Granted JPS5896756A (ja) 1981-12-04 1981-12-04 マルチチップパッケージ

Country Status (1)

Country Link
JP (1) JPS5896756A (enExample)

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60208851A (ja) * 1984-03-31 1985-10-21 Toshiba Corp マルチチツプ形記憶回路装置
JPS60187543U (ja) * 1984-05-21 1985-12-12 セイコーエプソン株式会社 半導体集積回路素子の高密度実装方式
JPS63299256A (ja) * 1987-05-29 1988-12-06 Toshiba Corp 電気部品
WO1992003035A1 (en) * 1990-08-01 1992-02-20 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
US5367766A (en) * 1990-08-01 1994-11-29 Staktek Corporation Ultra high density integrated circuit packages method
US5369056A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5446620A (en) * 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
US5455740A (en) * 1994-03-07 1995-10-03 Staktek Corporation Bus communication system for stacked high density integrated circuit packages
US5475920A (en) * 1990-08-01 1995-12-19 Burns; Carmen D. Method of assembling ultra high density integrated circuit packages
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US5499160A (en) * 1990-08-01 1996-03-12 Staktek Corporation High density integrated circuit module with snap-on rail assemblies
US5541812A (en) * 1995-05-22 1996-07-30 Burns; Carmen D. Bus communication system for stacked high density integrated circuit packages having an intermediate lead frame
US5572065A (en) * 1992-06-26 1996-11-05 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package
US5585668A (en) * 1995-01-30 1996-12-17 Staktek Corporation Integrated circuit package with overlapped die on a common lead frame
US5588205A (en) * 1995-01-24 1996-12-31 Staktek Corporation Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails
US5644161A (en) * 1993-03-29 1997-07-01 Staktek Corporation Ultra-high density warp-resistant memory module
US5783464A (en) * 1992-06-26 1998-07-21 Staktek Corporation Method of forming a hermetically sealed circuit lead-on package
US5801437A (en) * 1993-03-29 1998-09-01 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5945732A (en) * 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
US6025642A (en) * 1995-08-17 2000-02-15 Staktek Corporation Ultra high density integrated circuit packages
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US6576992B1 (en) 2001-10-26 2003-06-10 Staktek Group L.P. Chip scale stacking system and method
US6914324B2 (en) 2001-10-26 2005-07-05 Staktek Group L.P. Memory expansion and chip scale stacking system and method
US6940729B2 (en) 2001-10-26 2005-09-06 Staktek Group L.P. Integrated circuit stacking system and method
US6956284B2 (en) 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
US7289327B2 (en) 2006-02-27 2007-10-30 Stakick Group L.P. Active cooling methods and apparatus for modules
US7324352B2 (en) 2004-09-03 2008-01-29 Staktek Group L.P. High capacity thin module system and method
US7371609B2 (en) 2001-10-26 2008-05-13 Staktek Group L.P. Stacked module systems and methods
US7443023B2 (en) 2004-09-03 2008-10-28 Entorian Technologies, Lp High capacity thin module system
US7446410B2 (en) 2004-09-03 2008-11-04 Entorian Technologies, Lp Circuit module with thermal casing systems
US7468893B2 (en) 2004-09-03 2008-12-23 Entorian Technologies, Lp Thin module system and method
US7485951B2 (en) 2001-10-26 2009-02-03 Entorian Technologies, Lp Modularized die stacking system and method
US7511969B2 (en) 2006-02-02 2009-03-31 Entorian Technologies, Lp Composite core circuit module system and method
US7522421B2 (en) 2004-09-03 2009-04-21 Entorian Technologies, Lp Split core circuit module
US7606050B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Compact module system and method

Cited By (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60208851A (ja) * 1984-03-31 1985-10-21 Toshiba Corp マルチチツプ形記憶回路装置
JPS60187543U (ja) * 1984-05-21 1985-12-12 セイコーエプソン株式会社 半導体集積回路素子の高密度実装方式
JPS63299256A (ja) * 1987-05-29 1988-12-06 Toshiba Corp 電気部品
US5499160A (en) * 1990-08-01 1996-03-12 Staktek Corporation High density integrated circuit module with snap-on rail assemblies
US6168970B1 (en) 1990-08-01 2001-01-02 Staktek Group L.P. Ultra high density integrated circuit packages
US6049123A (en) * 1990-08-01 2000-04-11 Staktek Corporation Ultra high density integrated circuit packages
US5566051A (en) * 1990-08-01 1996-10-15 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5377077A (en) * 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5420751A (en) * 1990-08-01 1995-05-30 Staktek Corporation Ultra high density modular integrated circuit package
US5446620A (en) * 1990-08-01 1995-08-29 Staktek Corporation Ultra high density integrated circuit packages
US5561591A (en) * 1990-08-01 1996-10-01 Staktek Corporation Multi-signal rail assembly with impedance control for a three-dimensional high density integrated circuit package
US5550711A (en) * 1990-08-01 1996-08-27 Staktek Corporation Ultra high density integrated circuit packages
US5475920A (en) * 1990-08-01 1995-12-19 Burns; Carmen D. Method of assembling ultra high density integrated circuit packages
US5543664A (en) * 1990-08-01 1996-08-06 Staktek Corporation Ultra high density integrated circuit package
US5367766A (en) * 1990-08-01 1994-11-29 Staktek Corporation Ultra high density integrated circuit packages method
WO1992003035A1 (en) * 1990-08-01 1992-02-20 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
US5783464A (en) * 1992-06-26 1998-07-21 Staktek Corporation Method of forming a hermetically sealed circuit lead-on package
US5702985A (en) * 1992-06-26 1997-12-30 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
US5572065A (en) * 1992-06-26 1996-11-05 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package
US5631193A (en) * 1992-12-11 1997-05-20 Staktek Corporation High density lead-on-package fabrication method
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5484959A (en) * 1992-12-11 1996-01-16 Staktek Corporation High density lead-on-package fabrication method and apparatus
US6919626B2 (en) 1992-12-11 2005-07-19 Staktek Group L.P. High density integrated circuit module
US5369056A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5895232A (en) * 1993-03-29 1999-04-20 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5978227A (en) * 1993-03-29 1999-11-02 Staktek Corporation Integrated circuit packages having an externally mounted lead frame having bifurcated distal lead ends
US5864175A (en) * 1993-03-29 1999-01-26 Staktek Corporation Wrap-resistant ultra-thin integrated circuit package fabrication method
US5581121A (en) * 1993-03-29 1996-12-03 Staktek Corporation Warp-resistant ultra-thin integrated circuit package
US5644161A (en) * 1993-03-29 1997-07-01 Staktek Corporation Ultra-high density warp-resistant memory module
US6194247B1 (en) 1993-03-29 2001-02-27 Staktek Group L.P. Warp-resistent ultra-thin integrated circuit package fabrication method
US5369058A (en) * 1993-03-29 1994-11-29 Staktek Corporation Warp-resistent ultra-thin integrated circuit package fabrication method
US5801437A (en) * 1993-03-29 1998-09-01 Staktek Corporation Three-dimensional warp-resistant integrated circuit module method and apparatus
US5828125A (en) * 1993-03-29 1998-10-27 Staktek Corporation Ultra-high density warp-resistant memory module
US5843807A (en) * 1993-03-29 1998-12-01 Staktek Corporation Method of manufacturing an ultra-high density warp-resistant memory module
US5493476A (en) * 1994-03-07 1996-02-20 Staktek Corporation Bus communication system for stacked high density integrated circuit packages with bifurcated distal lead ends
US5455740A (en) * 1994-03-07 1995-10-03 Staktek Corporation Bus communication system for stacked high density integrated circuit packages
US5552963A (en) * 1994-03-07 1996-09-03 Staktek Corporation Bus communication system for stacked high density integrated circuit packages
US5479318A (en) * 1994-03-07 1995-12-26 Staktek Corporation Bus communication system for stacked high density integrated circuit packages with trifurcated distal lead ends
US5588205A (en) * 1995-01-24 1996-12-31 Staktek Corporation Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails
US5585668A (en) * 1995-01-30 1996-12-17 Staktek Corporation Integrated circuit package with overlapped die on a common lead frame
US5615475A (en) * 1995-01-30 1997-04-01 Staktek Corporation Method of manufacturing an integrated package having a pair of die on a common lead frame
US5541812A (en) * 1995-05-22 1996-07-30 Burns; Carmen D. Bus communication system for stacked high density integrated circuit packages having an intermediate lead frame
US6025642A (en) * 1995-08-17 2000-02-15 Staktek Corporation Ultra high density integrated circuit packages
US5945732A (en) * 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
US6190939B1 (en) 1997-03-12 2001-02-20 Staktek Group L.P. Method of manufacturing a warp resistant thermally conductive circuit package
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US7066741B2 (en) 1999-09-24 2006-06-27 Staktek Group L.P. Flexible circuit connector for stacked chip module
US6956284B2 (en) 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
US7371609B2 (en) 2001-10-26 2008-05-13 Staktek Group L.P. Stacked module systems and methods
US6914324B2 (en) 2001-10-26 2005-07-05 Staktek Group L.P. Memory expansion and chip scale stacking system and method
US6576992B1 (en) 2001-10-26 2003-06-10 Staktek Group L.P. Chip scale stacking system and method
US7485951B2 (en) 2001-10-26 2009-02-03 Entorian Technologies, Lp Modularized die stacking system and method
US6940729B2 (en) 2001-10-26 2005-09-06 Staktek Group L.P. Integrated circuit stacking system and method
US7459784B2 (en) 2004-09-03 2008-12-02 Entorian Technologies, Lp High capacity thin module system
US7443023B2 (en) 2004-09-03 2008-10-28 Entorian Technologies, Lp High capacity thin module system
US7446410B2 (en) 2004-09-03 2008-11-04 Entorian Technologies, Lp Circuit module with thermal casing systems
US7324352B2 (en) 2004-09-03 2008-01-29 Staktek Group L.P. High capacity thin module system and method
US7468893B2 (en) 2004-09-03 2008-12-23 Entorian Technologies, Lp Thin module system and method
US7522421B2 (en) 2004-09-03 2009-04-21 Entorian Technologies, Lp Split core circuit module
US7606042B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp High capacity thin module system and method
US7606050B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Compact module system and method
US7626259B2 (en) 2004-09-03 2009-12-01 Entorian Technologies, Lp Heat sink for a high capacity thin module system
US7511969B2 (en) 2006-02-02 2009-03-31 Entorian Technologies, Lp Composite core circuit module system and method
US7289327B2 (en) 2006-02-27 2007-10-30 Stakick Group L.P. Active cooling methods and apparatus for modules

Also Published As

Publication number Publication date
JPH0316785B2 (enExample) 1991-03-06

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