JPS6120760Y2 - - Google Patents
Info
- Publication number
- JPS6120760Y2 JPS6120760Y2 JP1980085158U JP8515880U JPS6120760Y2 JP S6120760 Y2 JPS6120760 Y2 JP S6120760Y2 JP 1980085158 U JP1980085158 U JP 1980085158U JP 8515880 U JP8515880 U JP 8515880U JP S6120760 Y2 JPS6120760 Y2 JP S6120760Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- lead frame
- foil lead
- foil
- external connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/5363—
-
- H10W72/884—
-
- H10W74/00—
-
- H10W90/734—
-
- H10W90/754—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980085158U JPS6120760Y2 (enExample) | 1980-06-17 | 1980-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980085158U JPS6120760Y2 (enExample) | 1980-06-17 | 1980-06-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS578756U JPS578756U (enExample) | 1982-01-18 |
| JPS6120760Y2 true JPS6120760Y2 (enExample) | 1986-06-21 |
Family
ID=29447427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980085158U Expired JPS6120760Y2 (enExample) | 1980-06-17 | 1980-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6120760Y2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH022277Y2 (enExample) * | 1985-03-29 | 1990-01-19 | ||
| JP4661645B2 (ja) | 2005-03-23 | 2011-03-30 | トヨタ自動車株式会社 | パワー半導体モジュール |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52117551A (en) * | 1976-03-29 | 1977-10-03 | Mitsubishi Electric Corp | Semiconductor device |
-
1980
- 1980-06-17 JP JP1980085158U patent/JPS6120760Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS578756U (enExample) | 1982-01-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2592308B2 (ja) | 半導体パッケージ及びそれを用いたコンピュータ | |
| JPS6370498A (ja) | セラミック基板と熱放散器の組合せ | |
| JPH04207061A (ja) | 半導体装置 | |
| JPS6120760Y2 (enExample) | ||
| JPH0773122B2 (ja) | 封止型半導体装置 | |
| JP2620611B2 (ja) | 電子部品搭載用基板 | |
| JPH0669119B2 (ja) | 電子部品の熱放散装置 | |
| JPS6112678Y2 (enExample) | ||
| JPS6125247Y2 (enExample) | ||
| JP3295987B2 (ja) | 半導体装置の製造方法 | |
| JP3238906B2 (ja) | 半導体装置 | |
| JPH0574985A (ja) | 半導体素子の実装構造 | |
| JPS6125248Y2 (enExample) | ||
| JPS6220701B2 (enExample) | ||
| JPS6120757Y2 (enExample) | ||
| JP3127149B2 (ja) | 半導体装置 | |
| JPH0878616A (ja) | マルチチップ・モジュール | |
| JP3206545B2 (ja) | 積層可能な半導体装置およびモジュール | |
| JP2736155B2 (ja) | ハイブリッドモジュール回路装置 | |
| KR900001744B1 (ko) | 반도체장치 | |
| JP2671424B2 (ja) | 半導体装置 | |
| JPH0514514Y2 (enExample) | ||
| JPS60200545A (ja) | 実装基板 | |
| JPS61203700A (ja) | 電子回路装置 | |
| JPH0348661B2 (enExample) |