JPS6125248Y2 - - Google Patents

Info

Publication number
JPS6125248Y2
JPS6125248Y2 JP1980119231U JP11923180U JPS6125248Y2 JP S6125248 Y2 JPS6125248 Y2 JP S6125248Y2 JP 1980119231 U JP1980119231 U JP 1980119231U JP 11923180 U JP11923180 U JP 11923180U JP S6125248 Y2 JPS6125248 Y2 JP S6125248Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
foil
mount plate
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980119231U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5741656U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980119231U priority Critical patent/JPS6125248Y2/ja
Publication of JPS5741656U publication Critical patent/JPS5741656U/ja
Application granted granted Critical
Publication of JPS6125248Y2 publication Critical patent/JPS6125248Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/5363—
    • H10W72/5445—
    • H10W72/5524—
    • H10W72/884—
    • H10W74/00—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1980119231U 1980-08-21 1980-08-21 Expired JPS6125248Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980119231U JPS6125248Y2 (enExample) 1980-08-21 1980-08-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980119231U JPS6125248Y2 (enExample) 1980-08-21 1980-08-21

Publications (2)

Publication Number Publication Date
JPS5741656U JPS5741656U (enExample) 1982-03-06
JPS6125248Y2 true JPS6125248Y2 (enExample) 1986-07-29

Family

ID=29479880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980119231U Expired JPS6125248Y2 (enExample) 1980-08-21 1980-08-21

Country Status (1)

Country Link
JP (1) JPS6125248Y2 (enExample)

Also Published As

Publication number Publication date
JPS5741656U (enExample) 1982-03-06

Similar Documents

Publication Publication Date Title
JP3230348B2 (ja) 樹脂封止型半導体装置及びその製造方法
JPH01166543A (ja) Ｖｌｓｉのパッケージ
JP2560974B2 (ja) 半導体装置
JPS63246851A (ja) 半導体装置の保持器および集積回路をプラスチック・パッケージの内部に収納する方法
JPS6125248Y2 (enExample)
JPH08186284A (ja) 表面実装型フォトカプラ及びその製造方法
JPS6125247Y2 (enExample)
JPS6227544B2 (enExample)
JPH0451064B2 (enExample)
JP2668995B2 (ja) 半導体装置
JPS6120760Y2 (enExample)
JPS6120757Y2 (enExample)
JPS6250063B2 (enExample)
JPS6112678Y2 (enExample)
JPH03238852A (ja) モールド型半導体集積回路
JPS6240443Y2 (enExample)
JP3295987B2 (ja) 半導体装置の製造方法
JP2788011B2 (ja) 半導体集積回路装置
JP2001250887A (ja) 回路装置の製造方法
JPS6350853Y2 (enExample)
JPH0357619B2 (enExample)
JPH065717B2 (ja) 固 体 撮 像 装 置
JPS63141355A (ja) 高出力混成集積回路組立方法
JPH0451488Y2 (enExample)
JPS5823469A (ja) 複合パワ−トランジスタ