JPS6350853Y2 - - Google Patents
Info
- Publication number
- JPS6350853Y2 JPS6350853Y2 JP1983155763U JP15576383U JPS6350853Y2 JP S6350853 Y2 JPS6350853 Y2 JP S6350853Y2 JP 1983155763 U JP1983155763 U JP 1983155763U JP 15576383 U JP15576383 U JP 15576383U JP S6350853 Y2 JPS6350853 Y2 JP S6350853Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- ceramic substrate
- integrated circuit
- hybrid integrated
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/07351—
-
- H10W72/30—
-
- H10W72/387—
-
- H10W74/15—
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983155763U JPS6061740U (ja) | 1983-10-04 | 1983-10-04 | 混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983155763U JPS6061740U (ja) | 1983-10-04 | 1983-10-04 | 混成集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6061740U JPS6061740U (ja) | 1985-04-30 |
| JPS6350853Y2 true JPS6350853Y2 (enExample) | 1988-12-27 |
Family
ID=30343911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983155763U Granted JPS6061740U (ja) | 1983-10-04 | 1983-10-04 | 混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6061740U (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6221590B2 (ja) * | 2013-10-02 | 2017-11-01 | 日産自動車株式会社 | 絶縁基板と冷却器の接合構造体、その製造方法、パワー半導体モジュール、及びその製造方法 |
-
1983
- 1983-10-04 JP JP1983155763U patent/JPS6061740U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6061740U (ja) | 1985-04-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6350853Y2 (enExample) | ||
| JPH0331092Y2 (enExample) | ||
| JPS60129136U (ja) | 半導体装置 | |
| JPS58189565U (ja) | プリント配線基板 | |
| JPS61207038U (enExample) | ||
| JPH04159799A (ja) | 混成集積回路 | |
| JPS6125248Y2 (enExample) | ||
| JPS5910790Y2 (ja) | パッケ−ジ構造 | |
| JPS602841U (ja) | 半導体取付基板 | |
| JPH043503Y2 (enExample) | ||
| JPS60106375U (ja) | 外部リ−ド端子の取付構造 | |
| JPS5929048U (ja) | 半導体部品の放熱器取付構造 | |
| JPS59185843U (ja) | 電気素子用放熱器 | |
| JPS6022841U (ja) | 放熱器 | |
| JPH01146548U (enExample) | ||
| JPS6078142U (ja) | 集積回路装置 | |
| JPS5895656U (ja) | 混成集積回路装置 | |
| JPS5944051U (ja) | 半導体装置 | |
| JPS59158336U (ja) | 半導体装置 | |
| JPS6324841U (enExample) | ||
| JPS6022879U (ja) | 絶縁基板の取付け構造 | |
| JPS60103846U (ja) | 半導体取付構造 | |
| JPS63105331U (enExample) | ||
| JPS60146349U (ja) | 半導体装置の放熱板半田付け構造 | |
| JPS58170847U (ja) | 放熱フイン付き混成集積回路の構造 |