JPS6061740U - 混成集積回路装置 - Google Patents
混成集積回路装置Info
- Publication number
- JPS6061740U JPS6061740U JP1983155763U JP15576383U JPS6061740U JP S6061740 U JPS6061740 U JP S6061740U JP 1983155763 U JP1983155763 U JP 1983155763U JP 15576383 U JP15576383 U JP 15576383U JP S6061740 U JPS6061740 U JP S6061740U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid integrated
- heat sink
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/07351—
-
- H10W72/30—
-
- H10W72/387—
-
- H10W74/15—
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983155763U JPS6061740U (ja) | 1983-10-04 | 1983-10-04 | 混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983155763U JPS6061740U (ja) | 1983-10-04 | 1983-10-04 | 混成集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6061740U true JPS6061740U (ja) | 1985-04-30 |
| JPS6350853Y2 JPS6350853Y2 (enExample) | 1988-12-27 |
Family
ID=30343911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983155763U Granted JPS6061740U (ja) | 1983-10-04 | 1983-10-04 | 混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6061740U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015072957A (ja) * | 2013-10-02 | 2015-04-16 | 日産自動車株式会社 | 絶縁基板と冷却器の接合構造体、その製造方法、パワー半導体モジュール、及びその製造方法 |
-
1983
- 1983-10-04 JP JP1983155763U patent/JPS6061740U/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015072957A (ja) * | 2013-10-02 | 2015-04-16 | 日産自動車株式会社 | 絶縁基板と冷却器の接合構造体、その製造方法、パワー半導体モジュール、及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6350853Y2 (enExample) | 1988-12-27 |
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