JPS6227544B2 - - Google Patents

Info

Publication number
JPS6227544B2
JPS6227544B2 JP53070078A JP7007878A JPS6227544B2 JP S6227544 B2 JPS6227544 B2 JP S6227544B2 JP 53070078 A JP53070078 A JP 53070078A JP 7007878 A JP7007878 A JP 7007878A JP S6227544 B2 JPS6227544 B2 JP S6227544B2
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
frame
base ribbon
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53070078A
Other languages
English (en)
Japanese (ja)
Other versions
JPS54161270A (en
Inventor
Yoshihiko Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP7007878A priority Critical patent/JPS54161270A/ja
Publication of JPS54161270A publication Critical patent/JPS54161270A/ja
Publication of JPS6227544B2 publication Critical patent/JPS6227544B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/5449—
    • H10W72/5524—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP7007878A 1978-06-09 1978-06-09 Lead frame for integrated-circuit device Granted JPS54161270A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7007878A JPS54161270A (en) 1978-06-09 1978-06-09 Lead frame for integrated-circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7007878A JPS54161270A (en) 1978-06-09 1978-06-09 Lead frame for integrated-circuit device

Publications (2)

Publication Number Publication Date
JPS54161270A JPS54161270A (en) 1979-12-20
JPS6227544B2 true JPS6227544B2 (enExample) 1987-06-15

Family

ID=13421138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7007878A Granted JPS54161270A (en) 1978-06-09 1978-06-09 Lead frame for integrated-circuit device

Country Status (1)

Country Link
JP (1) JPS54161270A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58178544A (ja) * 1982-04-12 1983-10-19 Matsushita Electronics Corp リ−ドフレ−ム
JPS58209146A (ja) * 1982-05-31 1983-12-06 Nec Corp 半導体装置
JPS60141125U (ja) * 1984-02-27 1985-09-18 エルメック株式会社 電子部品装置
JPS63311748A (ja) * 1987-06-12 1988-12-20 Matsushita Electronics Corp 樹脂封止型マルチチップパッケ−ジ
JPH02148758A (ja) * 1988-11-29 1990-06-07 Matsushita Electron Corp 半導体装置用リードフレーム
US5084753A (en) * 1989-01-23 1992-01-28 Analog Devices, Inc. Packaging for multiple chips on a single leadframe
JPH0828463B2 (ja) * 1991-06-11 1996-03-21 株式会社三井ハイテック リードフレームおよびこれを用いた半導体装置
JP4743675B2 (ja) * 2001-02-05 2011-08-10 平岩 榮次 折り畳み傘

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4989157A (enExample) * 1972-12-29 1974-08-26
JPS5174758U (enExample) * 1974-12-06 1976-06-11
JPS534868U (enExample) * 1976-06-29 1978-01-17
JPS538572U (enExample) * 1976-07-07 1978-01-25
JPS5245056A (en) * 1976-09-27 1977-04-08 Gen Corp Integrated circuit and method of producing same

Also Published As

Publication number Publication date
JPS54161270A (en) 1979-12-20

Similar Documents

Publication Publication Date Title
US5521429A (en) Surface-mount flat package semiconductor device
US3885304A (en) Electric circuit arrangement and method of making the same
US6548328B1 (en) Circuit device and manufacturing method of circuit device
US7091606B2 (en) Circuit device and manufacturing method of circuit device and semiconductor module
US3919602A (en) Electric circuit arrangement and method of making the same
JPS6227544B2 (enExample)
JP3099382B2 (ja) 小型発振器
JP2524482B2 (ja) Ｑｆｐ構造半導体装置
JPH0382060A (ja) 半導体装置
JP2705408B2 (ja) 混成集積回路装置
JP2541532B2 (ja) 半導体モジュ―ル
JPS6250063B2 (enExample)
JP3048707B2 (ja) 混成集積回路
JPH0458189B2 (enExample)
JPH06821Y2 (ja) 半導体装置の実装構造
JPS63146453A (ja) 半導体パツケ−ジおよびその製造方法
JP2879503B2 (ja) 面実装型電子回路装置
JP2737332B2 (ja) 集積回路装置
JPH0793402B2 (ja) 半導体装置
JPH0661404A (ja) 半導体装置
JPH04137739A (ja) 混成集積回路
JP2999930B2 (ja) 混成集積回路装置およびその製造方法
JP2822446B2 (ja) 混成集積回路装置
JPH06112337A (ja) 半導体装置用パッケージ
JPH0739244Y2 (ja) 混成集積回路装置