JPS6220701B2 - - Google Patents

Info

Publication number
JPS6220701B2
JPS6220701B2 JP53131634A JP13163478A JPS6220701B2 JP S6220701 B2 JPS6220701 B2 JP S6220701B2 JP 53131634 A JP53131634 A JP 53131634A JP 13163478 A JP13163478 A JP 13163478A JP S6220701 B2 JPS6220701 B2 JP S6220701B2
Authority
JP
Japan
Prior art keywords
wiring board
lid portion
semiconductor
external connection
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53131634A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5559746A (en
Inventor
Kanji Ootsuka
Masao Sekihashi
Tamotsu Usami
Michiaki Furukawa
Fumyuki Kobayashi
Masakatsu Ishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13163478A priority Critical patent/JPS5559746A/ja
Publication of JPS5559746A publication Critical patent/JPS5559746A/ja
Publication of JPS6220701B2 publication Critical patent/JPS6220701B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/5363—
    • H10W72/5522—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP13163478A 1978-10-27 1978-10-27 Semiconductor device and its mounting circuit device Granted JPS5559746A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13163478A JPS5559746A (en) 1978-10-27 1978-10-27 Semiconductor device and its mounting circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13163478A JPS5559746A (en) 1978-10-27 1978-10-27 Semiconductor device and its mounting circuit device

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP60086362A Division JPS60258932A (ja) 1985-04-24 1985-04-24 半導体装置及びその回路装置
JP62292005A Division JPS63146455A (ja) 1987-11-20 1987-11-20 半導体装置

Publications (2)

Publication Number Publication Date
JPS5559746A JPS5559746A (en) 1980-05-06
JPS6220701B2 true JPS6220701B2 (enExample) 1987-05-08

Family

ID=15062629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13163478A Granted JPS5559746A (en) 1978-10-27 1978-10-27 Semiconductor device and its mounting circuit device

Country Status (1)

Country Link
JP (1) JPS5559746A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5745262A (en) * 1980-09-01 1982-03-15 Fujitsu Ltd Sealing and fitting structure of semiconductor device
JPS59151443A (ja) * 1983-02-17 1984-08-29 Fujitsu Ltd 半導体装置
JPS59198739A (ja) * 1983-04-26 1984-11-10 Nec Corp チツプキヤリア
JPH0536275Y2 (enExample) * 1988-12-08 1993-09-14
CA2266158C (en) 1999-03-18 2003-05-20 Ibm Canada Limited-Ibm Canada Limitee Connecting devices and method for interconnecting circuit components

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS605223B2 (ja) * 1978-05-15 1985-02-08 日本特殊陶業株式会社 半導体チツプ装着用リ−ドレスパツケ−ジ
JPS5914894B2 (ja) * 1978-08-03 1984-04-06 日本碍子株式会社 セラミツクパツケ−ジ

Also Published As

Publication number Publication date
JPS5559746A (en) 1980-05-06

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