JPS6220702B2 - - Google Patents

Info

Publication number
JPS6220702B2
JPS6220702B2 JP60086362A JP8636285A JPS6220702B2 JP S6220702 B2 JPS6220702 B2 JP S6220702B2 JP 60086362 A JP60086362 A JP 60086362A JP 8636285 A JP8636285 A JP 8636285A JP S6220702 B2 JPS6220702 B2 JP S6220702B2
Authority
JP
Japan
Prior art keywords
semiconductor element
package
wiring board
lid portion
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60086362A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60258932A (ja
Inventor
Kanji Ootsuka
Masao Sekihashi
Tamotsu Usami
Michiaki Furukawa
Fumyuki Kobayashi
Masakatsu Ishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60086362A priority Critical patent/JPS60258932A/ja
Publication of JPS60258932A publication Critical patent/JPS60258932A/ja
Publication of JPS6220702B2 publication Critical patent/JPS6220702B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H10W70/682—
    • H10W70/685—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07337—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP60086362A 1985-04-24 1985-04-24 半導体装置及びその回路装置 Granted JPS60258932A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60086362A JPS60258932A (ja) 1985-04-24 1985-04-24 半導体装置及びその回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60086362A JPS60258932A (ja) 1985-04-24 1985-04-24 半導体装置及びその回路装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP13163478A Division JPS5559746A (en) 1978-10-27 1978-10-27 Semiconductor device and its mounting circuit device

Publications (2)

Publication Number Publication Date
JPS60258932A JPS60258932A (ja) 1985-12-20
JPS6220702B2 true JPS6220702B2 (enExample) 1987-05-08

Family

ID=13884770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60086362A Granted JPS60258932A (ja) 1985-04-24 1985-04-24 半導体装置及びその回路装置

Country Status (1)

Country Link
JP (1) JPS60258932A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5223741A (en) * 1989-09-01 1993-06-29 Tactical Fabs, Inc. Package for an integrated circuit structure
JPH0536751A (ja) * 1991-07-26 1993-02-12 Nec Corp 半導体組立構造

Also Published As

Publication number Publication date
JPS60258932A (ja) 1985-12-20

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