JPS6236385B2 - - Google Patents
Info
- Publication number
- JPS6236385B2 JPS6236385B2 JP56133959A JP13395981A JPS6236385B2 JP S6236385 B2 JPS6236385 B2 JP S6236385B2 JP 56133959 A JP56133959 A JP 56133959A JP 13395981 A JP13395981 A JP 13395981A JP S6236385 B2 JPS6236385 B2 JP S6236385B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- frame
- circuit chip
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/479—
-
- H10W72/701—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56133959A JPS5835952A (ja) | 1981-08-28 | 1981-08-28 | 半導体集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56133959A JPS5835952A (ja) | 1981-08-28 | 1981-08-28 | 半導体集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5835952A JPS5835952A (ja) | 1983-03-02 |
| JPS6236385B2 true JPS6236385B2 (enExample) | 1987-08-06 |
Family
ID=15117075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56133959A Granted JPS5835952A (ja) | 1981-08-28 | 1981-08-28 | 半導体集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5835952A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6437042A (en) * | 1987-07-31 | 1989-02-07 | Ibiden Co Ltd | Substrate for carrying electronic component |
| CN103733484B (zh) * | 2011-11-09 | 2016-03-02 | 三菱电机株式会社 | 旋转电机 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4728441U (enExample) * | 1971-04-14 | 1972-12-01 | ||
| JPS5718345B2 (enExample) * | 1972-10-04 | 1982-04-16 | ||
| JPS5117667A (en) * | 1974-08-05 | 1976-02-12 | Matsushita Electric Industrial Co Ltd | Handotaisochino seizohoho |
| JPS5341177A (en) * | 1976-09-28 | 1978-04-14 | Nec Corp | Mounting method of electronic parts |
| JPS605223B2 (ja) * | 1978-05-15 | 1985-02-08 | 日本特殊陶業株式会社 | 半導体チツプ装着用リ−ドレスパツケ−ジ |
| JPS5669897A (en) * | 1979-11-09 | 1981-06-11 | Nippon Electric Co | High density package structure |
-
1981
- 1981-08-28 JP JP56133959A patent/JPS5835952A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5835952A (ja) | 1983-03-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2664754B2 (ja) | 高密度電子パッケージ及びその製造方法 | |
| US4891687A (en) | Multi-layer molded plastic IC package | |
| US5637828A (en) | High density semiconductor package | |
| EP0594395B1 (en) | Semiconductor power module | |
| KR101505551B1 (ko) | 온도 감지소자가 장착된 반도체 파워 모듈 패키지 및 그제조방법 | |
| US5563446A (en) | Surface mount peripheral leaded and ball grid array package | |
| JPS6324647A (ja) | 半導体パッケ−ジ | |
| US5309322A (en) | Leadframe strip for semiconductor packages and method | |
| US5548087A (en) | Molded plastic packaging of electronic devices | |
| JPH09326450A (ja) | 半導体装置およびその製造方法 | |
| TW200933868A (en) | Stacked chip package structure | |
| KR100207902B1 (ko) | 리드 프레임을 이용한 멀티 칩 패키지 | |
| EP0081419A2 (en) | High lead count hermetic mass bond integrated circuit carrier | |
| JPS6236385B2 (enExample) | ||
| EP0474224B1 (en) | Semiconductor device comprising a plurality of semiconductor chips | |
| JPH03109760A (ja) | 半導体装置 | |
| KR0173932B1 (ko) | 내부리드와 기판 본딩패드가 직접 전기적 연결된 멀티칩 패키지 | |
| JPH06216492A (ja) | 電子装置 | |
| KR200225040Y1 (ko) | 적층형 반도체 패키지 | |
| JPH11145379A (ja) | 半導体装置の実装構造体およびその製造方法 | |
| JPS63122131A (ja) | 半導体装置用キヤリアテ−プ | |
| KR100308393B1 (ko) | 반도체패키지및그제조방법 | |
| KR20240166184A (ko) | 반도체 패키지 및 이의 제조방법 | |
| JPH0287635A (ja) | セラミック・パッケージ型半導体装置 | |
| JPH04159767A (ja) | 混成集積回路 |