JPH0287635A - セラミック・パッケージ型半導体装置 - Google Patents
セラミック・パッケージ型半導体装置Info
- Publication number
- JPH0287635A JPH0287635A JP63241479A JP24147988A JPH0287635A JP H0287635 A JPH0287635 A JP H0287635A JP 63241479 A JP63241479 A JP 63241479A JP 24147988 A JP24147988 A JP 24147988A JP H0287635 A JPH0287635 A JP H0287635A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chips
- semiconductor device
- ceramic package
- package
- stacked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 239000000919 ceramic Substances 0.000 title claims description 13
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 4
- 230000005496 eutectics Effects 0.000 abstract description 2
- 229910015365 Au—Si Inorganic materials 0.000 abstract 1
- 239000007767 bonding agent Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/29144—Gold [Au] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/325—Material
- H01L2224/32505—Material outside the bonding interface, e.g. in the bulk of the layer connector
- H01L2224/32506—Material outside the bonding interface, e.g. in the bulk of the layer connector comprising an eutectic alloy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4943—Connecting portions the connecting portions being staggered
- H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はセラミック・パッケージ型半導体装置に関し、
特に半導体チップの搭載構造に関する。
特に半導体チップの搭載構造に関する。
第4図および第5図はそれぞれ従来のセラミック・パッ
ケージ型半導体装置の部分断面図およびボンディング部
の部分平面図で、従来の半導体装置は、通常、パッケー
ジ2のキャビティ上に半導体チップ1が一個のみ搭載さ
れて、パッケージのリード端子6とボンディング・ワイ
ヤ5によって接続されている。ここで、3はマウント材
、7および8はキャップおよび外部リードをそれぞれ示
す。
ケージ型半導体装置の部分断面図およびボンディング部
の部分平面図で、従来の半導体装置は、通常、パッケー
ジ2のキャビティ上に半導体チップ1が一個のみ搭載さ
れて、パッケージのリード端子6とボンディング・ワイ
ヤ5によって接続されている。ここで、3はマウント材
、7および8はキャップおよび外部リードをそれぞれ示
す。
しかしながら、最近急速に進展するLSI素子の高集積
化に伴い、半導体チップは面積が増加し、またワイヤ・
ボンディング数も増加して来ている。従って、上述した
従来の半導体装置では、限られたスペース内で半導体チ
ップの専有面積を増加させ、またボンディング・ワイヤ
数を増やさなければならなくなって来ている。この結果
、ボンディング・ワイヤ間のショートの危険性が増し、
半導体素子を保護するパッケージ設計にますます困難度
が高まっている。
化に伴い、半導体チップは面積が増加し、またワイヤ・
ボンディング数も増加して来ている。従って、上述した
従来の半導体装置では、限られたスペース内で半導体チ
ップの専有面積を増加させ、またボンディング・ワイヤ
数を増やさなければならなくなって来ている。この結果
、ボンディング・ワイヤ間のショートの危険性が増し、
半導体素子を保護するパッケージ設計にますます困難度
が高まっている。
本発明の目的は、上記の情況に鑑み、半導体チツブの高
密度実装を可能としたセラミック・パッケージ型半導体
装置を提供することである。
密度実装を可能としたセラミック・パッケージ型半導体
装置を提供することである。
本発明によれば、セラミック・パッケージ型半導体装置
は、複数個のリード端子をキャビティ内に段階状に形成
するセラミック・パッケージと、前記セラミック・パッ
ケージのキャビティ内に段重ねで搭載される複数個の半
導体チップと、前記半導体チップと段階状のリード端子
をそれぞれ接続する複数個のボンディング・ワイヤとを
含んで構成される。
は、複数個のリード端子をキャビティ内に段階状に形成
するセラミック・パッケージと、前記セラミック・パッ
ケージのキャビティ内に段重ねで搭載される複数個の半
導体チップと、前記半導体チップと段階状のリード端子
をそれぞれ接続する複数個のボンディング・ワイヤとを
含んで構成される。
次に、本発明について図面を参照して説゛明する。
第1図および第2図はそれぞれ本発明の一実施例を示す
セラミック・パッケージ型半導体装置の部分断面図およ
びボンディング部の部分平面図である。本実施例によれ
ば、2つの半導体チップla、lbがパッケージ2のキ
ャビティ部に2段重ねに搭載され、階段状に設けられた
それぞれのパッケージのリード端子6とボンディング・
ワイヤ5で接続される。この際、下段のチップ1aはA
u−8i共共晶台や樹脂ペースト接着などのマウント材
3でマウントされ、また、上段のチップ1bは下段のチ
ップla上に樹脂などの非導電性接着剤4で固着される
。ここで、7および8はそれぞれキャップおよび外部リ
ードである。
セラミック・パッケージ型半導体装置の部分断面図およ
びボンディング部の部分平面図である。本実施例によれ
ば、2つの半導体チップla、lbがパッケージ2のキ
ャビティ部に2段重ねに搭載され、階段状に設けられた
それぞれのパッケージのリード端子6とボンディング・
ワイヤ5で接続される。この際、下段のチップ1aはA
u−8i共共晶台や樹脂ペースト接着などのマウント材
3でマウントされ、また、上段のチップ1bは下段のチ
ップla上に樹脂などの非導電性接着剤4で固着される
。ここで、7および8はそれぞれキャップおよび外部リ
ードである。
第3図は本発明の他の実施例を示すセラミック・パッケ
ージ型半導体装置のボンディング部の部分平面図である
。本実施例によれば、2段重ねされた2つの半導体チッ
プla、lb同志がボンディング・ワイヤ5で接続され
るにれによると、2個のチップが互いに接続されるため
回路設計上の応用が拡がるという利点がある。
ージ型半導体装置のボンディング部の部分平面図である
。本実施例によれば、2段重ねされた2つの半導体チッ
プla、lb同志がボンディング・ワイヤ5で接続され
るにれによると、2個のチップが互いに接続されるため
回路設計上の応用が拡がるという利点がある。
以上説明したように、本発明によれば、半導体チップを
段重ねにしてそれぞれをワイヤ・ボンディングするので
、特に二段ボンディングの場合では従来構造と比べると
、ボンディング・ワイヤの高低差が広くなり、ワイヤ・
ショートの危険性が減少する。また、−個のチップの場
合と比べてチップそれぞれのパッド・ピッチは2倍に拡
がり、隣り合うパッドとの間隔も広くなるので、多ピン
、高密度のワイヤ・ボンディングに有効である。またチ
ップを縦方向に重ねるので、チップの専有面積を小さく
することができ、余裕のあるパッケージ設計を可能とす
る効果を有する。
段重ねにしてそれぞれをワイヤ・ボンディングするので
、特に二段ボンディングの場合では従来構造と比べると
、ボンディング・ワイヤの高低差が広くなり、ワイヤ・
ショートの危険性が減少する。また、−個のチップの場
合と比べてチップそれぞれのパッド・ピッチは2倍に拡
がり、隣り合うパッドとの間隔も広くなるので、多ピン
、高密度のワイヤ・ボンディングに有効である。またチ
ップを縦方向に重ねるので、チップの専有面積を小さく
することができ、余裕のあるパッケージ設計を可能とす
る効果を有する。
材、5・・・ボンディング・ワイヤ、6・・・リード端
子、7・・・キャップ、8・・・外部リード。
子、7・・・キャップ、8・・・外部リード。
Claims (1)
- 複数個のリード端子をキャビティ内に段階状に形成する
セラミック・パッケージと、前記セラミック・パッケー
ジのキャビティ内に段重ねで搭載される複数個の半導体
チップと、前記半導体チップと段階状のリード端子をそ
れぞれ接続する複数個のボンディング・ワイヤとを備え
ることを特徴とするセラミック・パッケージ型半導体装
置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63241479A JPH0287635A (ja) | 1988-09-26 | 1988-09-26 | セラミック・パッケージ型半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63241479A JPH0287635A (ja) | 1988-09-26 | 1988-09-26 | セラミック・パッケージ型半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0287635A true JPH0287635A (ja) | 1990-03-28 |
Family
ID=17074926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63241479A Pending JPH0287635A (ja) | 1988-09-26 | 1988-09-26 | セラミック・パッケージ型半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0287635A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990056764A (ko) * | 1997-12-29 | 1999-07-15 | 김영환 | 볼 그리드 어레이 패키지 |
KR19990061323A (ko) * | 1997-12-31 | 1999-07-26 | 윤종용 | 반도체 패키지 |
CN117038646A (zh) * | 2023-10-08 | 2023-11-10 | 之江实验室 | 陶瓷封装结构及其设计方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5731166A (en) * | 1980-07-31 | 1982-02-19 | Fujitsu Ltd | Semiconductor device |
JPS6370532A (ja) * | 1986-09-12 | 1988-03-30 | Hitachi Ltd | 半導体装置 |
-
1988
- 1988-09-26 JP JP63241479A patent/JPH0287635A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5731166A (en) * | 1980-07-31 | 1982-02-19 | Fujitsu Ltd | Semiconductor device |
JPS6370532A (ja) * | 1986-09-12 | 1988-03-30 | Hitachi Ltd | 半導体装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990056764A (ko) * | 1997-12-29 | 1999-07-15 | 김영환 | 볼 그리드 어레이 패키지 |
KR19990061323A (ko) * | 1997-12-31 | 1999-07-26 | 윤종용 | 반도체 패키지 |
CN117038646A (zh) * | 2023-10-08 | 2023-11-10 | 之江实验室 | 陶瓷封装结构及其设计方法 |
CN117038646B (zh) * | 2023-10-08 | 2024-01-26 | 之江实验室 | 陶瓷封装结构及其设计方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100260997B1 (ko) | 반도체패키지 | |
KR20040011348A (ko) | 반도체장치 | |
US6791166B1 (en) | Stackable lead frame package using exposed internal lead traces | |
KR100652106B1 (ko) | 회로 장치 | |
JP2001156251A (ja) | 半導体装置 | |
KR100780691B1 (ko) | 폴딩 칩 플래나 스택 패키지 | |
JPH0287635A (ja) | セラミック・パッケージ型半導体装置 | |
KR20010037246A (ko) | 리드프레임 및 이를 이용한 반도체패키지 | |
JPH0461152A (ja) | 半導体装置 | |
KR20010062929A (ko) | 적층 칩 패키지 | |
KR970005719B1 (ko) | 이중 어태치된 메모리 장치용 반도체 패키지 | |
JPS6370532A (ja) | 半導体装置 | |
JPS60150660A (ja) | 半導体装置 | |
JPH04144269A (ja) | 混成集積回路装置 | |
US6924557B2 (en) | Semiconductor package | |
KR100891649B1 (ko) | 반도체 패키지 제조방법 | |
JPS617657A (ja) | マルチチツプパツケ−ジ | |
JP2913858B2 (ja) | 混成集積回路 | |
KR100507131B1 (ko) | 엠씨엠 볼 그리드 어레이 패키지 형성 방법 | |
KR100258607B1 (ko) | 리드 온 칩 타입의 칩 스케일 반도체 패키지 구조 및 제조방법 | |
JPH03163858A (ja) | 樹脂封止型半導体装置 | |
KR20030054066A (ko) | 적층 패키지 및 그 제조 방법 | |
KR20060133800A (ko) | 칩 스택 패키지 | |
KR20000040218A (ko) | 멀티 칩 패키지 | |
KR200313831Y1 (ko) | 바텀리드패키지 |