JPS58194382A - 発光装置用電極構体 - Google Patents

発光装置用電極構体

Info

Publication number
JPS58194382A
JPS58194382A JP57076857A JP7685782A JPS58194382A JP S58194382 A JPS58194382 A JP S58194382A JP 57076857 A JP57076857 A JP 57076857A JP 7685782 A JP7685782 A JP 7685782A JP S58194382 A JPS58194382 A JP S58194382A
Authority
JP
Japan
Prior art keywords
semiconductor device
electrode assembly
insulating frame
electrode structure
metal electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57076857A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0451991B2 (enrdf_load_stackoverflow
Inventor
Yuji Kawasaki
川崎　有二
Takeshi Haneda
羽根田　武志
Tsugio Kawamichi
川路　次男
Hitoshi Haga
均 芳賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57076857A priority Critical patent/JPS58194382A/ja
Publication of JPS58194382A publication Critical patent/JPS58194382A/ja
Publication of JPH0451991B2 publication Critical patent/JPH0451991B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Led Device Packages (AREA)
JP57076857A 1982-05-08 1982-05-08 発光装置用電極構体 Granted JPS58194382A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57076857A JPS58194382A (ja) 1982-05-08 1982-05-08 発光装置用電極構体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57076857A JPS58194382A (ja) 1982-05-08 1982-05-08 発光装置用電極構体

Publications (2)

Publication Number Publication Date
JPS58194382A true JPS58194382A (ja) 1983-11-12
JPH0451991B2 JPH0451991B2 (enrdf_load_stackoverflow) 1992-08-20

Family

ID=13617318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57076857A Granted JPS58194382A (ja) 1982-05-08 1982-05-08 発光装置用電極構体

Country Status (1)

Country Link
JP (1) JPS58194382A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4937654A (en) * 1986-12-26 1990-06-26 Idec Izumi Corporation Electronic part carrying strip and method of manufacturing the same
US7005311B2 (en) 1993-09-30 2006-02-28 Osram Gmbh Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
US7102215B2 (en) 1997-07-29 2006-09-05 Osram Gmbh Surface-mountable light-emitting diode structural element
JP5338900B2 (ja) * 2009-03-30 2013-11-13 株式会社オートネットワーク技術研究所 光通信モジュール及び光通信モジュールの製造方法
JP5338899B2 (ja) * 2009-03-30 2013-11-13 株式会社オートネットワーク技術研究所 光通信モジュール及び光通信モジュールの製造方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50104565U (enrdf_load_stackoverflow) * 1974-02-01 1975-08-28
US3914786A (en) * 1974-04-19 1975-10-21 Hewlett Packard Co In-line reflective lead-pair for light-emitting diodes
JPS5338973A (en) * 1976-09-22 1978-04-10 Hitachi Ltd Lead frame
JPS5388575A (en) * 1977-01-13 1978-08-04 Nec Corp Production of lead frame for semiconductor device
JPS53108880U (enrdf_load_stackoverflow) * 1977-02-08 1978-08-31
JPS54165174U (enrdf_load_stackoverflow) * 1978-05-11 1979-11-20
JPS55105388A (en) * 1979-02-07 1980-08-12 Toshiba Corp Manufacture of light emission display device
JPS5776856A (en) * 1980-10-30 1982-05-14 Toshiba Corp Manufacture of semiconductor device
JPS582079A (ja) * 1981-06-29 1983-01-07 Nippon Denyo Kk Ｌｅｄランプ及びその製法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50104565U (enrdf_load_stackoverflow) * 1974-02-01 1975-08-28
US3914786A (en) * 1974-04-19 1975-10-21 Hewlett Packard Co In-line reflective lead-pair for light-emitting diodes
JPS5338973A (en) * 1976-09-22 1978-04-10 Hitachi Ltd Lead frame
JPS5388575A (en) * 1977-01-13 1978-08-04 Nec Corp Production of lead frame for semiconductor device
JPS53108880U (enrdf_load_stackoverflow) * 1977-02-08 1978-08-31
JPS54165174U (enrdf_load_stackoverflow) * 1978-05-11 1979-11-20
JPS55105388A (en) * 1979-02-07 1980-08-12 Toshiba Corp Manufacture of light emission display device
JPS5776856A (en) * 1980-10-30 1982-05-14 Toshiba Corp Manufacture of semiconductor device
JPS582079A (ja) * 1981-06-29 1983-01-07 Nippon Denyo Kk Ｌｅｄランプ及びその製法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4937654A (en) * 1986-12-26 1990-06-26 Idec Izumi Corporation Electronic part carrying strip and method of manufacturing the same
US5059373A (en) * 1986-12-26 1991-10-22 Idec Izumi Corporation Method of manufacturing continuous strip of electronic devices
US7005311B2 (en) 1993-09-30 2006-02-28 Osram Gmbh Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
US7102212B2 (en) 1993-09-30 2006-09-05 Osram Gmbh Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
US7288831B2 (en) 1993-09-30 2007-10-30 Osram Gmbh Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
US7102215B2 (en) 1997-07-29 2006-09-05 Osram Gmbh Surface-mountable light-emitting diode structural element
US7183632B2 (en) 1997-07-29 2007-02-27 Osram Gmbh Surface-mountable light-emitting diode structural element
US7508002B2 (en) 1997-07-29 2009-03-24 Osram Gmbh Surface-mountable light-emitting diode structural element
JP5338900B2 (ja) * 2009-03-30 2013-11-13 株式会社オートネットワーク技術研究所 光通信モジュール及び光通信モジュールの製造方法
JP5338899B2 (ja) * 2009-03-30 2013-11-13 株式会社オートネットワーク技術研究所 光通信モジュール及び光通信モジュールの製造方法

Also Published As

Publication number Publication date
JPH0451991B2 (enrdf_load_stackoverflow) 1992-08-20

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