JPS62120053A - 樹脂封止半導体装置の製造方法 - Google Patents

樹脂封止半導体装置の製造方法

Info

Publication number
JPS62120053A
JPS62120053A JP60260231A JP26023185A JPS62120053A JP S62120053 A JPS62120053 A JP S62120053A JP 60260231 A JP60260231 A JP 60260231A JP 26023185 A JP26023185 A JP 26023185A JP S62120053 A JPS62120053 A JP S62120053A
Authority
JP
Japan
Prior art keywords
resin
molding
semiconductor device
wirings
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60260231A
Other languages
English (en)
Inventor
Nobuo Sato
信男 佐藤
Yukio Takigawa
幸雄 瀧川
Yoshihiro Nakada
義弘 中田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP60260231A priority Critical patent/JPS62120053A/ja
Publication of JPS62120053A publication Critical patent/JPS62120053A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114—Single butt joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/128—Stepped joint cross-sections
    • B29C66/1282—Stepped joint cross-sections comprising at least one overlap joint-segment
    • B29C66/12821—Stepped joint cross-sections comprising at least one overlap joint-segment comprising at least two overlap joint-segments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/128—Stepped joint cross-sections
    • B29C66/1284—Stepped joint cross-sections comprising at least one butt joint-segment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B29C66/542—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles joining hollow covers or hollow bottoms to open ends of container bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔概要〕 熱可塑性樹脂または熱硬化性樹脂成形の収納筐体（パッ
ケージとも云う）内に空間を保持してＥＰＲＯ？Ｉ等の
半導体装置を気密封止することを提示したものである。
〔産業上の利用分野〕
本発明は、所謂フラット型パッケージ及びデュアルイン
ライン型パッケージと呼ばれる樹脂封止半導体装置の製
造方法に関す。
〔従来の技術〕
従来、半導体装置のパンケージ方法にはセラミックとか
樹脂ケース内に気密封止することが行われているが、近
年は安価なプラスチックパッケージが主流となっている
。
〔発明が解決しようとする問題点〕
ところで前記のプラスチックパッケージ方法はダイレク
トモールドで有るため、成形圧力や樹脂収縮によって、
半導体装置の割れ、アルミ配線の断線や配線ずれなどの
問題が生ずる。
また一般的に、モールド成形用の樹脂は、樹脂中に含ま
れる離形剤によってリードフレーム（外部導出端子を予
成形した金属薄板）との密着性が阻害されることが知ら
れており、成形パッケージは耐湿性等が期待されず、装
置の信頼性に問題が残る。
本発明は、予モールド成形筐体あるいは同等の樹脂封止
に際して、パッケージ内部における配線の断線とかずれ
が生ずる懸念がないような封止手段として２例えば、Ｅ
Ｐ　−ＲＯＭ　（Ｅｒａｓａｂｌｅ　Ｐｒｏｇｒａｍｍ
ａｂｌｅ　Ｒｅｅｄ　０ｎｌｙ　Ｍｅｍｏｒｙ）などを
安定に封止するを目的とする。
〔問題点を解決するための手段〕
半導体パンケージに係る第１図実施例図に示す如く、リ
ードフレーム１の中央ステージ部２が凹みのある半導体
装着部１とされたモールド成形体３に半導体４を装着し
、所要なボンディング配線をした後、レーザ溶接法で上
蓋５を冠着封止７することである。
更に必要に応じて、前記冠着封止７に続いて。
樹脂モールド成形層８による封止がされる（第２図参照
）。然し、第２図モールド成形層８は熱硬化性樹脂で行
うことも可能である。
〔作　用〕 筺体内部が中空であることから、内部半導体装置をはじ
め、これと接続するアルミボンディングワイヤ６への悪
影響がなくなり極めて高信頬性の封止が出来る。
〔実施例〕
第１図の（ａｌ　（ｂ）及び（Ｃ）図は１本発明半導体
装置の封止実施例とする装置断面図である。
Ｃ８１図は、リードフレーム１をインサート成形してな
る熱可塑性樹脂よりなるモールド成形体３である。
（ｂ）図は、モールド成形体３の央部ステージ２に半導
体装置４をグイ接着した後、細アルミ線などによるボン
ディング接続６をなし、リードフレーム１の外部導出端
子と接続がされる。
（Ｃ）図はレーザ加工による熱可塑性樹脂よりなる上蓋
５を冠着封止７とした図、同ｆｃ１図の矢印１０は。
レーザ照射による上蓋５の溶接封止個所である。
係るレーザ加工時の溶接条件の一例を次に示す。
発振源：ＹＡＧ（λ−１．０６μｍ　）　、出力１００
Ｗａｔｔ焦点外し量：　＋１０ｎｖ＋、パルス幅＝４麺
Ｓ。
パルスレート：　２０ｐｐ３．溶接速度：１０−ｍ／Ｓ
第２図の（ａｌ　（ｂ）　（Ｃ）及び（ｄ）図は、他の
半導体装置封止実施例とする装置断面図である。
同図（ａｌと（′ｂ）それぞれは第１図と同じく半導体
装置の電気的接続工程である。
同（Ｃ１図は上蓋５を前述したレーザ光照射による封止
、もしくはエポキシ樹脂などの接着剤による上蓋５の冠
着封止７エ程である。
同（ｄ１図は、前記封止のパッケージ周辺に対して。
熱可塑性又は熱硬化性の何れか樹脂モールド成形法によ
り、樹脂成形層８を外装した図である。
本発明の前記フラット型パッケージ実施例による半導体
封止パッケージは、各種の温湿度サイクル試験、温度サ
イクル試験において高い気密性を示すことが確認されて
いる。
〔発明の効果〕
前記説明の如く本発明によれば、従来のグイレフト樹脂
モールド封止に比べて半導体装置とそのボンディング配
線体は筐体内の自由空間に配置されることから配線ずれ
やワイヤ断線がなくなり。
信頼性の高い封止が可能となる。
【図面の簡単な説明】
第１図（ａｌ　（ｂ）及び（Ｃ１図は本発明の半導体装
置の封止実施例とする装置断面図。 第２図ｆａｔ　（ｂ）　（ｃ）及びｆｄ１図は他の半導
体装置封止実施例とする装置断面図である。 図中、２はステージ、３は樹脂モールド成形体。 ４は半導体装置、５は上蓋。 ７は上蓋封止の半導体装置。 及び８はモールド樹脂成形層である。

Claims (2)

    【特許請求の範囲】
  1. （１）半導体（４）が装着されるステージ（２）を具え
    るモールド成形体（３）に半導体（４）を装着した後、
    上蓋（５）をレーザ溶接して封止することを特徴とする
    樹脂封止半導体装置の製造方法。
  2. （２）上蓋（５）をレーザ溶接又は接着封止（７）した
    後、樹脂モールド成形（８）したことを特徴とする特許
    請求の範囲第１項記載の樹脂封止半導体装置の製造方法
    。
JP60260231A 1985-11-20 1985-11-20 樹脂封止半導体装置の製造方法 Pending JPS62120053A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60260231A JPS62120053A (ja) 1985-11-20 1985-11-20 樹脂封止半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60260231A JPS62120053A (ja) 1985-11-20 1985-11-20 樹脂封止半導体装置の製造方法

Publications (1)

Publication Number Publication Date
JPS62120053A true JPS62120053A (ja) 1987-06-01

Family

ID=17345172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60260231A Pending JPS62120053A (ja) 1985-11-20 1985-11-20 樹脂封止半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS62120053A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02170556A (ja) * 1988-12-23 1990-07-02 Polyplastics Co プレモールドパッケージとその製造方法
US5451550A (en) * 1991-02-20 1995-09-19 Texas Instruments Incorporated Method of laser CVD seal a die edge

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02170556A (ja) * 1988-12-23 1990-07-02 Polyplastics Co プレモールドパッケージとその製造方法
US5451550A (en) * 1991-02-20 1995-09-19 Texas Instruments Incorporated Method of laser CVD seal a die edge
US6355973B1 (en) 1991-02-20 2002-03-12 Texas Instruments Incorporated Integrated circuit having a sealed edge

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