JPS58127338A - 電子部品の構造 - Google Patents

電子部品の構造

Info

Publication number
JPS58127338A
JPS58127338A JP57010534A JP1053482A JPS58127338A JP S58127338 A JPS58127338 A JP S58127338A JP 57010534 A JP57010534 A JP 57010534A JP 1053482 A JP1053482 A JP 1053482A JP S58127338 A JPS58127338 A JP S58127338A
Authority
JP
Japan
Prior art keywords
electrode pattern
electronic component
substrate
lsi chip
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57010534A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6364899B2 (enExample
Inventor
Toru Yamashita
徹 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP57010534A priority Critical patent/JPS58127338A/ja
Publication of JPS58127338A publication Critical patent/JPS58127338A/ja
Publication of JPS6364899B2 publication Critical patent/JPS6364899B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP57010534A 1982-01-25 1982-01-25 電子部品の構造 Granted JPS58127338A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57010534A JPS58127338A (ja) 1982-01-25 1982-01-25 電子部品の構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57010534A JPS58127338A (ja) 1982-01-25 1982-01-25 電子部品の構造

Publications (2)

Publication Number Publication Date
JPS58127338A true JPS58127338A (ja) 1983-07-29
JPS6364899B2 JPS6364899B2 (enExample) 1988-12-14

Family

ID=11752924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57010534A Granted JPS58127338A (ja) 1982-01-25 1982-01-25 電子部品の構造

Country Status (1)

Country Link
JP (1) JPS58127338A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60147140A (ja) * 1984-01-11 1985-08-03 Hitachi Ltd 半導体素子チツプの実装方法
EP1246241A3 (en) * 2001-03-30 2005-05-18 Kabushiki Kaisha Toshiba Semiconductor package

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519681A (enExample) * 1974-07-15 1976-01-26 Seiko Instr & Electronics
JPS53112061A (en) * 1977-03-11 1978-09-30 Sharp Corp Wiring substrate of semiconductor chip
JPS5474369A (en) * 1977-11-26 1979-06-14 Fujitsu Ltd Semiconductor device
JPS56110292A (en) * 1980-02-06 1981-09-01 Hitachi Ltd Semiconductor device
JPS56148840A (en) * 1980-04-22 1981-11-18 Citizen Watch Co Ltd Mounting structure for ic
JPS5827935U (ja) * 1981-08-18 1983-02-23 株式会社村田製作所 混成集積回路装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519681A (enExample) * 1974-07-15 1976-01-26 Seiko Instr & Electronics
JPS53112061A (en) * 1977-03-11 1978-09-30 Sharp Corp Wiring substrate of semiconductor chip
JPS5474369A (en) * 1977-11-26 1979-06-14 Fujitsu Ltd Semiconductor device
JPS56110292A (en) * 1980-02-06 1981-09-01 Hitachi Ltd Semiconductor device
JPS56148840A (en) * 1980-04-22 1981-11-18 Citizen Watch Co Ltd Mounting structure for ic
JPS5827935U (ja) * 1981-08-18 1983-02-23 株式会社村田製作所 混成集積回路装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60147140A (ja) * 1984-01-11 1985-08-03 Hitachi Ltd 半導体素子チツプの実装方法
EP1246241A3 (en) * 2001-03-30 2005-05-18 Kabushiki Kaisha Toshiba Semiconductor package
US7148529B2 (en) 2001-03-30 2006-12-12 Kabushiki Kaisha Toshiba Semiconductor package

Also Published As

Publication number Publication date
JPS6364899B2 (enExample) 1988-12-14

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