JPS58125834A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS58125834A
JPS58125834A JP57008431A JP843182A JPS58125834A JP S58125834 A JPS58125834 A JP S58125834A JP 57008431 A JP57008431 A JP 57008431A JP 843182 A JP843182 A JP 843182A JP S58125834 A JPS58125834 A JP S58125834A
Authority
JP
Japan
Prior art keywords
film
wiring
heat treatment
cracks
silica film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57008431A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6342408B2 (enrdf_load_stackoverflow
Inventor
Kenji Okamura
健司 岡村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57008431A priority Critical patent/JPS58125834A/ja
Publication of JPS58125834A publication Critical patent/JPS58125834A/ja
Publication of JPS6342408B2 publication Critical patent/JPS6342408B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP57008431A 1982-01-22 1982-01-22 半導体装置の製造方法 Granted JPS58125834A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57008431A JPS58125834A (ja) 1982-01-22 1982-01-22 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57008431A JPS58125834A (ja) 1982-01-22 1982-01-22 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS58125834A true JPS58125834A (ja) 1983-07-27
JPS6342408B2 JPS6342408B2 (enrdf_load_stackoverflow) 1988-08-23

Family

ID=11692930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57008431A Granted JPS58125834A (ja) 1982-01-22 1982-01-22 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS58125834A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6230335A (ja) * 1985-07-31 1987-02-09 Fujitsu Ltd 半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6230335A (ja) * 1985-07-31 1987-02-09 Fujitsu Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS6342408B2 (enrdf_load_stackoverflow) 1988-08-23

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