JPS5742164A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5742164A JPS5742164A JP55117093A JP11709380A JPS5742164A JP S5742164 A JPS5742164 A JP S5742164A JP 55117093 A JP55117093 A JP 55117093A JP 11709380 A JP11709380 A JP 11709380A JP S5742164 A JPS5742164 A JP S5742164A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- type
- concentration
- region
- impurity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000012535 impurity Substances 0.000 abstract 4
- 238000010276 construction Methods 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 238000005468 ion implantation Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0873—Drain regions
- H01L29/0878—Impurity concentration or distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55117093A JPS5742164A (en) | 1980-08-27 | 1980-08-27 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55117093A JPS5742164A (en) | 1980-08-27 | 1980-08-27 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5742164A true JPS5742164A (en) | 1982-03-09 |
JPH0330310B2 JPH0330310B2 (ja) | 1991-04-26 |
Family
ID=14703215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55117093A Granted JPS5742164A (en) | 1980-08-27 | 1980-08-27 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5742164A (ja) |
Cited By (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS628571A (ja) * | 1985-07-04 | 1987-01-16 | Nec Corp | 半導体装置 |
JPS62155567A (ja) * | 1985-11-12 | 1987-07-10 | ゼネラル・エレクトリツク・カンパニイ | 絶縁ゲ−ト型半導体装置の製造方法 |
US4680604A (en) * | 1984-03-19 | 1987-07-14 | Kabushiki Kaisha Toshiba | Conductivity modulated MOS transistor device |
US4686551A (en) * | 1982-11-27 | 1987-08-11 | Nissan Motor Co., Ltd. | MOS transistor |
JPS62213166A (ja) * | 1986-03-13 | 1987-09-19 | Nec Corp | 縦型高耐圧mosfet |
JPS63133678A (ja) * | 1986-11-26 | 1988-06-06 | Nec Corp | 縦型電界効果トランジスタの製造方法 |
JPS63157477A (ja) * | 1986-12-22 | 1988-06-30 | Nissan Motor Co Ltd | 電導度変調形mosfet |
JPS63177566A (ja) * | 1987-01-19 | 1988-07-21 | Nec Corp | 電界効果トランジスタ |
US4803532A (en) * | 1982-11-27 | 1989-02-07 | Nissan Motor Co., Ltd. | Vertical MOSFET having a proof structure against puncture due to breakdown |
JPS6482565A (en) * | 1987-09-24 | 1989-03-28 | Mitsubishi Electric Corp | Field-effect semiconductor device |
JPS6482567A (en) * | 1987-09-24 | 1989-03-28 | Mitsubishi Electric Corp | Field-effect semiconductor device |
JPS6482566A (en) * | 1987-09-24 | 1989-03-28 | Mitsubishi Electric Corp | Field-effect semiconductor device |
JPS6482564A (en) * | 1987-09-24 | 1989-03-28 | Mitsubishi Electric Corp | Field-effect semiconductor device |
US4879584A (en) * | 1987-02-13 | 1989-11-07 | Kabushiki Kaisha Toshiba | Semiconductor device with isolation between MOSFET and control circuit |
JPH0247874A (ja) * | 1988-08-10 | 1990-02-16 | Fuji Electric Co Ltd | Mos型半導体装置の製造方法 |
US4902636A (en) * | 1988-01-18 | 1990-02-20 | Matsushita Electric Works, Ltd. | Method for manufacturing a depletion type double-diffused metal-oxide semiconductor field effect transistor device |
US4974059A (en) * | 1982-12-21 | 1990-11-27 | International Rectifier Corporation | Semiconductor high-power mosfet device |
JPH0494576A (ja) * | 1990-08-11 | 1992-03-26 | Sharp Corp | 縦型パワーmos fet |
USRE34025E (en) * | 1987-02-13 | 1992-08-11 | Kabushiki Kaisha Toshiba | Semiconductor device with isolation between MOSFET and control circuit |
US5191396A (en) * | 1978-10-13 | 1993-03-02 | International Rectifier Corp. | High power mosfet with low on-resistance and high breakdown voltage |
US5338961A (en) * | 1978-10-13 | 1994-08-16 | International Rectifier Corporation | High power MOSFET with low on-resistance and high breakdown voltage |
US5545908A (en) * | 1991-12-09 | 1996-08-13 | Nippondenso Co., Ltd. | Vertical type insulated-gate semiconductor device |
JPH08213615A (ja) * | 1995-08-18 | 1996-08-20 | Matsushita Electron Corp | 縦型mos電界効果トランジスタ |
JPH08250731A (ja) * | 1994-12-30 | 1996-09-27 | Siliconix Inc | 高いブレークダウン電圧と低いオン抵抗を兼ね備えたトレンチ型mosfet |
US5631487A (en) * | 1993-07-30 | 1997-05-20 | Nec Corporation | Semiconductor device and motor driver circuit using the same |
US5701023A (en) * | 1994-08-03 | 1997-12-23 | National Semiconductor Corporation | Insulated gate semiconductor device typically having subsurface-peaked portion of body region for improved ruggedness |
US5869371A (en) * | 1995-06-07 | 1999-02-09 | Stmicroelectronics, Inc. | Structure and process for reducing the on-resistance of mos-gated power devices |
JP2001210823A (ja) * | 2000-01-21 | 2001-08-03 | Denso Corp | 半導体装置 |
JP2002176176A (ja) * | 2000-12-08 | 2002-06-21 | Denso Corp | 半導体装置 |
US6703665B1 (en) * | 1999-08-20 | 2004-03-09 | Shindengen Electric Manufacturing Co., Ltd. | Transistor |
WO2005034246A1 (ja) * | 2003-10-03 | 2005-04-14 | National Institute Of Advanced Industrial Science And Technology | 炭化ケイ素半導体装置 |
JP2006059916A (ja) * | 2004-08-18 | 2006-03-02 | Matsushita Electric Ind Co Ltd | 半導体装置 |
WO2007070050A1 (en) * | 2005-12-14 | 2007-06-21 | Freescale Semiconductor, Inc. | Power mosfet and method of making the same |
US7482285B2 (en) | 1999-06-09 | 2009-01-27 | International Rectifier Corporation | Dual epitaxial layer for high voltage vertical conduction power MOSFET devices |
US8327822B2 (en) | 2007-09-21 | 2012-12-11 | Yanmar Co., Ltd. | Diesel engine |
JP2013239554A (ja) * | 2012-05-15 | 2013-11-28 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
JP2015115375A (ja) * | 2013-12-09 | 2015-06-22 | 国立研究開発法人産業技術総合研究所 | 炭化珪素半導体装置 |
JP2018060985A (ja) * | 2016-10-07 | 2018-04-12 | トヨタ自動車株式会社 | 半導体装置 |
JP2018125544A (ja) * | 2013-08-08 | 2018-08-09 | クリー インコーポレイテッドCree Inc. | 縦型パワートランジスタデバイス |
US10600903B2 (en) | 2013-09-20 | 2020-03-24 | Cree, Inc. | Semiconductor device including a power transistor device and bypass diode |
WO2020193169A1 (de) * | 2019-03-26 | 2020-10-01 | Robert Bosch Gmbh | Leistungstransistorzelle für batteriesysteme |
US10868169B2 (en) | 2013-09-20 | 2020-12-15 | Cree, Inc. | Monolithically integrated vertical power transistor and bypass diode |
JP2022051424A (ja) * | 2020-09-18 | 2022-03-31 | 株式会社東芝 | 半導体装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5553462A (en) * | 1978-10-13 | 1980-04-18 | Int Rectifier Corp | Mosfet element |
-
1980
- 1980-08-27 JP JP55117093A patent/JPS5742164A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5553462A (en) * | 1978-10-13 | 1980-04-18 | Int Rectifier Corp | Mosfet element |
Cited By (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5598018A (en) * | 1978-10-13 | 1997-01-28 | International Rectifier Corporation | High power MOSFET with low on-resistance and high breakdown voltage |
US5742087A (en) * | 1978-10-13 | 1998-04-21 | International Rectifier Corporation | High power MOSFET with low on-resistance and high breakdown voltage |
US5191396A (en) * | 1978-10-13 | 1993-03-02 | International Rectifier Corp. | High power mosfet with low on-resistance and high breakdown voltage |
US5338961A (en) * | 1978-10-13 | 1994-08-16 | International Rectifier Corporation | High power MOSFET with low on-resistance and high breakdown voltage |
US4803532A (en) * | 1982-11-27 | 1989-02-07 | Nissan Motor Co., Ltd. | Vertical MOSFET having a proof structure against puncture due to breakdown |
US4686551A (en) * | 1982-11-27 | 1987-08-11 | Nissan Motor Co., Ltd. | MOS transistor |
US4974059A (en) * | 1982-12-21 | 1990-11-27 | International Rectifier Corporation | Semiconductor high-power mosfet device |
USRE32784E (en) * | 1984-03-19 | 1988-11-15 | Kabushiki Kaisha Toshiba | Conductivity modulated MOS transistor device |
US4680604A (en) * | 1984-03-19 | 1987-07-14 | Kabushiki Kaisha Toshiba | Conductivity modulated MOS transistor device |
JPS628571A (ja) * | 1985-07-04 | 1987-01-16 | Nec Corp | 半導体装置 |
JPS62155567A (ja) * | 1985-11-12 | 1987-07-10 | ゼネラル・エレクトリツク・カンパニイ | 絶縁ゲ−ト型半導体装置の製造方法 |
JPS62213166A (ja) * | 1986-03-13 | 1987-09-19 | Nec Corp | 縦型高耐圧mosfet |
JPS63133678A (ja) * | 1986-11-26 | 1988-06-06 | Nec Corp | 縦型電界効果トランジスタの製造方法 |
JPS63157477A (ja) * | 1986-12-22 | 1988-06-30 | Nissan Motor Co Ltd | 電導度変調形mosfet |
JPS63177566A (ja) * | 1987-01-19 | 1988-07-21 | Nec Corp | 電界効果トランジスタ |
US4879584A (en) * | 1987-02-13 | 1989-11-07 | Kabushiki Kaisha Toshiba | Semiconductor device with isolation between MOSFET and control circuit |
USRE34025E (en) * | 1987-02-13 | 1992-08-11 | Kabushiki Kaisha Toshiba | Semiconductor device with isolation between MOSFET and control circuit |
JPS6482565A (en) * | 1987-09-24 | 1989-03-28 | Mitsubishi Electric Corp | Field-effect semiconductor device |
JPS6482567A (en) * | 1987-09-24 | 1989-03-28 | Mitsubishi Electric Corp | Field-effect semiconductor device |
JPS6482566A (en) * | 1987-09-24 | 1989-03-28 | Mitsubishi Electric Corp | Field-effect semiconductor device |
JPS6482564A (en) * | 1987-09-24 | 1989-03-28 | Mitsubishi Electric Corp | Field-effect semiconductor device |
US5055895A (en) * | 1988-01-18 | 1991-10-08 | Matsushuta Electric Works, Ltd. | Double-diffused metal-oxide semiconductor field effect transistor device |
US4902636A (en) * | 1988-01-18 | 1990-02-20 | Matsushita Electric Works, Ltd. | Method for manufacturing a depletion type double-diffused metal-oxide semiconductor field effect transistor device |
FR2635413A1 (fr) * | 1988-08-10 | 1990-02-16 | Fuji Electric Co Ltd | Procede de fabrication pour un dispositif metal-oxyde-semiconducteur |
JPH0247874A (ja) * | 1988-08-10 | 1990-02-16 | Fuji Electric Co Ltd | Mos型半導体装置の製造方法 |
JPH0494576A (ja) * | 1990-08-11 | 1992-03-26 | Sharp Corp | 縦型パワーmos fet |
US5545908A (en) * | 1991-12-09 | 1996-08-13 | Nippondenso Co., Ltd. | Vertical type insulated-gate semiconductor device |
US5631487A (en) * | 1993-07-30 | 1997-05-20 | Nec Corporation | Semiconductor device and motor driver circuit using the same |
US5897355A (en) * | 1994-08-03 | 1999-04-27 | National Semiconductor Corporation | Method of manufacturing insulated gate semiconductor device to improve ruggedness |
US5701023A (en) * | 1994-08-03 | 1997-12-23 | National Semiconductor Corporation | Insulated gate semiconductor device typically having subsurface-peaked portion of body region for improved ruggedness |
JPH08250731A (ja) * | 1994-12-30 | 1996-09-27 | Siliconix Inc | 高いブレークダウン電圧と低いオン抵抗を兼ね備えたトレンチ型mosfet |
US5869371A (en) * | 1995-06-07 | 1999-02-09 | Stmicroelectronics, Inc. | Structure and process for reducing the on-resistance of mos-gated power devices |
US6046473A (en) * | 1995-06-07 | 2000-04-04 | Stmicroelectronics, Inc. | Structure and process for reducing the on-resistance of MOS-gated power devices |
JPH08213615A (ja) * | 1995-08-18 | 1996-08-20 | Matsushita Electron Corp | 縦型mos電界効果トランジスタ |
US7482285B2 (en) | 1999-06-09 | 2009-01-27 | International Rectifier Corporation | Dual epitaxial layer for high voltage vertical conduction power MOSFET devices |
US6703665B1 (en) * | 1999-08-20 | 2004-03-09 | Shindengen Electric Manufacturing Co., Ltd. | Transistor |
JP2001210823A (ja) * | 2000-01-21 | 2001-08-03 | Denso Corp | 半導体装置 |
JP2002176176A (ja) * | 2000-12-08 | 2002-06-21 | Denso Corp | 半導体装置 |
WO2005034246A1 (ja) * | 2003-10-03 | 2005-04-14 | National Institute Of Advanced Industrial Science And Technology | 炭化ケイ素半導体装置 |
JP2006059916A (ja) * | 2004-08-18 | 2006-03-02 | Matsushita Electric Ind Co Ltd | 半導体装置 |
WO2007070050A1 (en) * | 2005-12-14 | 2007-06-21 | Freescale Semiconductor, Inc. | Power mosfet and method of making the same |
US8327822B2 (en) | 2007-09-21 | 2012-12-11 | Yanmar Co., Ltd. | Diesel engine |
JP2013239554A (ja) * | 2012-05-15 | 2013-11-28 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
JP2018125544A (ja) * | 2013-08-08 | 2018-08-09 | クリー インコーポレイテッドCree Inc. | 縦型パワートランジスタデバイス |
USRE48380E1 (en) | 2013-08-08 | 2021-01-05 | Cree, Inc. | Vertical power transistor device |
USRE49913E1 (en) | 2013-08-08 | 2024-04-09 | Wolfspeed, Inc. | Vertical power transistor device |
US10600903B2 (en) | 2013-09-20 | 2020-03-24 | Cree, Inc. | Semiconductor device including a power transistor device and bypass diode |
US10868169B2 (en) | 2013-09-20 | 2020-12-15 | Cree, Inc. | Monolithically integrated vertical power transistor and bypass diode |
US10950719B2 (en) | 2013-09-20 | 2021-03-16 | Cree, Inc. | Seminconductor device with spreading layer |
JP2015115375A (ja) * | 2013-12-09 | 2015-06-22 | 国立研究開発法人産業技術総合研究所 | 炭化珪素半導体装置 |
JP2018060985A (ja) * | 2016-10-07 | 2018-04-12 | トヨタ自動車株式会社 | 半導体装置 |
US10256295B2 (en) | 2016-10-07 | 2019-04-09 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device |
WO2020193169A1 (de) * | 2019-03-26 | 2020-10-01 | Robert Bosch Gmbh | Leistungstransistorzelle für batteriesysteme |
JP2022051424A (ja) * | 2020-09-18 | 2022-03-31 | 株式会社東芝 | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0330310B2 (ja) | 1991-04-26 |
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