JPS57207356A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57207356A
JPS57207356A JP56091799A JP9179981A JPS57207356A JP S57207356 A JPS57207356 A JP S57207356A JP 56091799 A JP56091799 A JP 56091799A JP 9179981 A JP9179981 A JP 9179981A JP S57207356 A JPS57207356 A JP S57207356A
Authority
JP
Japan
Prior art keywords
chip
concave part
common
ceramic
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56091799A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6347143B2 (enExample
Inventor
Yoshihiro Takemae
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56091799A priority Critical patent/JPS57207356A/ja
Priority to EP82303014A priority patent/EP0067677B1/en
Priority to DE8282303014T priority patent/DE3277268D1/de
Priority to US06/388,616 priority patent/US4578697A/en
Publication of JPS57207356A publication Critical patent/JPS57207356A/ja
Publication of JPS6347143B2 publication Critical patent/JPS6347143B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W70/60—
    • H10W70/611—
    • H10W70/68—
    • H10W76/157—
    • H10W90/00—
    • H10W70/682—
    • H10W72/07353—
    • H10W72/334—
    • H10W72/5445—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/884—
    • H10W72/931—
    • H10W72/932—
    • H10W76/18—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP56091799A 1981-06-15 1981-06-15 Semiconductor device Granted JPS57207356A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP56091799A JPS57207356A (en) 1981-06-15 1981-06-15 Semiconductor device
EP82303014A EP0067677B1 (en) 1981-06-15 1982-06-10 Chip-array-constructed semiconductor device
DE8282303014T DE3277268D1 (en) 1981-06-15 1982-06-10 Chip-array-constructed semiconductor device
US06/388,616 US4578697A (en) 1981-06-15 1982-06-15 Semiconductor device encapsulating a multi-chip array

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56091799A JPS57207356A (en) 1981-06-15 1981-06-15 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57207356A true JPS57207356A (en) 1982-12-20
JPS6347143B2 JPS6347143B2 (enExample) 1988-09-20

Family

ID=14036658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56091799A Granted JPS57207356A (en) 1981-06-15 1981-06-15 Semiconductor device

Country Status (4)

Country Link
US (1) US4578697A (enExample)
EP (1) EP0067677B1 (enExample)
JP (1) JPS57207356A (enExample)
DE (1) DE3277268D1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60143641A (ja) * 1983-12-29 1985-07-29 Konishiroku Photo Ind Co Ltd 集積回路装置
US4674007A (en) * 1985-06-07 1987-06-16 Microscience Corporation Method and apparatus for facilitating production of electronic circuit boards
JP2015191939A (ja) * 2014-03-27 2015-11-02 三菱電機株式会社 半導体装置および半導体装置の製造方法

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3382726D1 (de) * 1982-06-30 1994-01-27 Fujitsu Ltd Integrierte Halbleiterschaltungsanordnung.
GB8412674D0 (en) * 1984-05-18 1984-06-27 British Telecomm Integrated circuit chip carrier
EP0334397A3 (en) * 1984-05-18 1990-04-11 BRITISH TELECOMMUNICATIONS public limited company Circuit board
GB2170657B (en) * 1985-02-05 1988-01-27 Stc Plc Semiconductor memory device
FR2591801B1 (fr) * 1985-12-17 1988-10-14 Inf Milit Spatiale Aeronaut Boitier d'encapsulation d'un circuit electronique
US4751564A (en) * 1986-05-05 1988-06-14 Itt Corporation Multiple wafer scale assembly apparatus and fixture for use during the fabrication thereof
US4774635A (en) * 1986-05-27 1988-09-27 American Telephone And Telegraph Company At&T Bell Laboratories Semiconductor package with high density I/O lead connection
USRE36894E (en) * 1986-05-27 2000-10-03 Lucent Technologies Inc. Semiconductor package with high density I/O lead connection
IT1218104B (it) * 1986-06-27 1990-04-12 Sgs Microelettronica Spa Metodo di progettazione di microcalcolatori integrati e microcalcolatore integrato a struttura modulare ottenuto con il metodo suddetto
FR2604029B1 (fr) * 1986-09-16 1994-08-05 Toshiba Kk Puce de circuit integre possedant des bornes de sortie ameliorees
US4816422A (en) * 1986-12-29 1989-03-28 General Electric Company Fabrication of large power semiconductor composite by wafer interconnection of individual devices
US4868712A (en) * 1987-02-04 1989-09-19 Woodman John K Three dimensional integrated circuit package
JPH0834264B2 (ja) * 1987-04-21 1996-03-29 住友電気工業株式会社 半導体装置およびその製造方法
US5016138A (en) * 1987-10-27 1991-05-14 Woodman John K Three dimensional integrated circuit package
US4918335A (en) * 1987-11-06 1990-04-17 Ford Aerospace Corporation Interconnection system for integrated circuit chips
US4858072A (en) * 1987-11-06 1989-08-15 Ford Aerospace & Communications Corporation Interconnection system for integrated circuit chips
JP2560805B2 (ja) * 1988-10-06 1996-12-04 三菱電機株式会社 半導体装置
US4924291A (en) * 1988-10-24 1990-05-08 Motorola Inc. Flagless semiconductor package
US5255156A (en) * 1989-02-22 1993-10-19 The Boeing Company Bonding pad interconnection on a multiple chip module having minimum channel width
EP0417345B1 (en) * 1989-09-15 1996-07-24 International Business Machines Corporation Design method for VLSI chips arranged on a carrier and module thus designed
US5191404A (en) * 1989-12-20 1993-03-02 Digital Equipment Corporation High density memory array packaging
US5081563A (en) * 1990-04-27 1992-01-14 International Business Machines Corporation Multi-layer package incorporating a recessed cavity for a semiconductor chip
FR2680262B1 (fr) * 1991-08-08 1993-10-08 Gemplus Card International Circuits integres pour carte a puce et carte a plusieurs puces utilisant ces circuits.
US5212406A (en) * 1992-01-06 1993-05-18 Eastman Kodak Company High density packaging of solid state devices
US5340772A (en) * 1992-07-17 1994-08-23 Lsi Logic Corporation Method of increasing the layout efficiency of dies on a wafer and increasing the ratio of I/O area to active area per die
DE4225154A1 (de) * 1992-07-30 1994-02-03 Meyerhoff Dieter Chip-Modul
US5325268A (en) * 1993-01-28 1994-06-28 National Semiconductor Corporation Interconnector for a multi-chip module or package
JPH07161919A (ja) * 1993-12-03 1995-06-23 Seiko Instr Inc 半導体装置およびその製造方法
JP3269745B2 (ja) 1995-01-17 2002-04-02 株式会社日立製作所 モジュール型半導体装置
US6064116A (en) 1997-06-06 2000-05-16 Micron Technology, Inc. Device for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications
US6201186B1 (en) 1998-06-29 2001-03-13 Motorola, Inc. Electronic component assembly and method of making the same
US6418490B1 (en) * 1998-12-30 2002-07-09 International Business Machines Corporation Electronic circuit interconnection system using a virtual mirror cross over package
GB9915076D0 (en) * 1999-06-28 1999-08-25 Shen Ming Tung Integrated circuit packaging structure
US11042211B2 (en) 2009-08-07 2021-06-22 Advanced Processor Architectures, Llc Serially connected computing nodes in a distributed computing system
US9429983B1 (en) 2013-09-12 2016-08-30 Advanced Processor Architectures, Llc System clock distribution in a distributed computing environment
US9645603B1 (en) 2013-09-12 2017-05-09 Advanced Processor Architectures, Llc System clock distribution in a distributed computing environment
WO2011017676A1 (en) 2009-08-07 2011-02-10 Advanced Processor Architectures, Llc Distributed computing
US9420715B2 (en) * 2012-06-07 2016-08-16 Intal Tech Ltd. Electrononic equipment building blocks for rack mounting
TWM577186U (zh) * 2018-12-11 2019-04-21 品威電子國際股份有限公司 Adapter for flexible cable

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312771A (en) * 1964-08-07 1967-04-04 Nat Beryllia Corp Microelectronic package
US3483038A (en) * 1967-01-05 1969-12-09 Rca Corp Integrated array of thin-film photovoltaic cells and method of making same
US3568012A (en) * 1968-11-05 1971-03-02 Westinghouse Electric Corp A microminiature circuit device employing a low thermal expansion binder
US3611317A (en) * 1970-02-02 1971-10-05 Bell Telephone Labor Inc Nested chip arrangement for integrated circuit memories
US3641401A (en) * 1971-03-10 1972-02-08 American Lava Corp Leadless ceramic package for integrated circuits
US3777221A (en) * 1972-12-18 1973-12-04 Ibm Multi-layer circuit package
JPS49131863U (enExample) * 1973-03-10 1974-11-13
DE2415047B2 (de) * 1974-03-28 1978-02-02 Siemens AG, 1000 Berlin und 8000 München Multichip-verdrahtung mit anschlussflaechenkonfigurationen zur kontaktierung von vier gleichen halbleiterspeicher-chips
US4038488A (en) * 1975-05-12 1977-07-26 Cambridge Memories, Inc. Multilayer ceramic multi-chip, dual in-line packaging assembly
JPS548976A (en) * 1977-06-22 1979-01-23 Nec Corp Lsi package
JPS5835367B2 (ja) * 1978-07-18 1983-08-02 ミツミ電機株式会社 回路素子基板及びその製造方法
US4297719A (en) * 1979-08-10 1981-10-27 Rca Corporation Electrically programmable control gate injected floating gate solid state memory transistor and method of making same
GB2056772B (en) * 1980-08-12 1983-09-01 Amdahl Corp Integrated circuit package and module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60143641A (ja) * 1983-12-29 1985-07-29 Konishiroku Photo Ind Co Ltd 集積回路装置
US4674007A (en) * 1985-06-07 1987-06-16 Microscience Corporation Method and apparatus for facilitating production of electronic circuit boards
JP2015191939A (ja) * 2014-03-27 2015-11-02 三菱電機株式会社 半導体装置および半導体装置の製造方法

Also Published As

Publication number Publication date
EP0067677B1 (en) 1987-09-09
DE3277268D1 (en) 1987-10-15
EP0067677A2 (en) 1982-12-22
EP0067677A3 (en) 1984-10-03
JPS6347143B2 (enExample) 1988-09-20
US4578697A (en) 1986-03-25

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