KR860001486A - 칩온칩(chip on chip)형 반도체 집적회로 - Google Patents

칩온칩(chip on chip)형 반도체 집적회로

Info

Publication number
KR860001486A
KR860001486A KR1019850004960A KR850004960A KR860001486A KR 860001486 A KR860001486 A KR 860001486A KR 1019850004960 A KR1019850004960 A KR 1019850004960A KR 850004960 A KR850004960 A KR 850004960A KR 860001486 A KR860001486 A KR 860001486A
Authority
KR
South Korea
Prior art keywords
chip
integrated circuit
semiconductor integrated
chip semiconductor
circuit
Prior art date
Application number
KR1019850004960A
Other languages
English (en)
Other versions
KR900000175B1 (ko
Inventor
요시노리 에노모또
히데오 몬마
슌조 오오따
다께시 사사끼
Original Assignee
후지쑤 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지쑤 가부시끼가이샤 filed Critical 후지쑤 가부시끼가이샤
Publication of KR860001486A publication Critical patent/KR860001486A/ko
Application granted granted Critical
Publication of KR900000175B1 publication Critical patent/KR900000175B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1019850004960A 1984-07-27 1985-07-11 칩온칩(chip on chip)형 반도체 집적회로 KR900000175B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP15661884A JPS6135546A (ja) 1984-07-27 1984-07-27 半導体装置
JP59-156618 1984-07-27

Publications (2)

Publication Number Publication Date
KR860001486A true KR860001486A (ko) 1986-02-26
KR900000175B1 KR900000175B1 (ko) 1990-01-23

Family

ID=15631657

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850004960A KR900000175B1 (ko) 1984-07-27 1985-07-11 칩온칩(chip on chip)형 반도체 집적회로

Country Status (2)

Country Link
JP (1) JPS6135546A (ko)
KR (1) KR900000175B1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7026718B1 (en) 1998-09-25 2006-04-11 Stmicroelectronics, Inc. Stacked multi-component integrated circuit microprocessor
JP4732642B2 (ja) * 2001-09-28 2011-07-27 ローム株式会社 半導体装置
WO2007141931A1 (ja) * 2006-05-29 2007-12-13 Panasonic Corporation 複数チップ構成半導体装置、及び半導体検査方法
US8471582B2 (en) 2009-01-27 2013-06-25 Qualcomm Incorporated Circuit for detecting tier-to-tier couplings in stacked integrated circuit devices

Also Published As

Publication number Publication date
JPS6135546A (ja) 1986-02-20
KR900000175B1 (ko) 1990-01-23

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