JPS5678121A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5678121A JPS5678121A JP15459579A JP15459579A JPS5678121A JP S5678121 A JPS5678121 A JP S5678121A JP 15459579 A JP15459579 A JP 15459579A JP 15459579 A JP15459579 A JP 15459579A JP S5678121 A JPS5678121 A JP S5678121A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- characteristic
- elevate
- polycrystalline
- piled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 238000000137 annealing Methods 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 230000006866 deterioration Effects 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 230000009977 dual effect Effects 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Bipolar Transistors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To improve the forward and reverse directional characteristic of a semiconductor device and to elevate the reliability by a method wherein dual structural electrodes consisting of doped polycrystalline Si and Al are provided on a semiconductor substrate. CONSTITUTION:After openings 13 are formed in an oxide film on the surface of an N type Si substrate 10 being formed a diffusion layer according with a prescribed method, polycrystalline Si 15 being added with B is piled up and is annealed in H2 gas. When the concentration of B made to be 1X10<16>/cm<3> or more, the contact resistance with the substrate 10 is reduced to elevate the forward characteristic. Then Al 16 is piled up. The Al 16, the polycrystalline Si 15 are etched selectively to form electrodes 17, and an electrode 18 is equipped at the back face of the substrate. By this constitution, the reaction of the Al 16 and Si in the SiO2 13 during the annealing can be prevented, and the deterioration of withstand voltage can be prevented to elevate the reverse characteristic. By this way, a device having a favorable characteristic can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15459579A JPS5678121A (en) | 1979-11-29 | 1979-11-29 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15459579A JPS5678121A (en) | 1979-11-29 | 1979-11-29 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5678121A true JPS5678121A (en) | 1981-06-26 |
Family
ID=15587614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15459579A Pending JPS5678121A (en) | 1979-11-29 | 1979-11-29 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5678121A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6411365A (en) * | 1987-07-03 | 1989-01-13 | Nippon Telegraph & Telephone | Semiconductor device and manufacture thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50140059A (en) * | 1974-04-26 | 1975-11-10 | ||
JPS51103769A (en) * | 1975-03-10 | 1976-09-13 | Fujitsu Ltd | Handotaisochino seizohoho |
JPS51116675A (en) * | 1975-04-05 | 1976-10-14 | Fujitsu Ltd | Manufacturing method for a semiconductor device |
JPS54145488A (en) * | 1979-03-01 | 1979-11-13 | Toshiba Corp | Semiconductor device |
-
1979
- 1979-11-29 JP JP15459579A patent/JPS5678121A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50140059A (en) * | 1974-04-26 | 1975-11-10 | ||
JPS51103769A (en) * | 1975-03-10 | 1976-09-13 | Fujitsu Ltd | Handotaisochino seizohoho |
JPS51116675A (en) * | 1975-04-05 | 1976-10-14 | Fujitsu Ltd | Manufacturing method for a semiconductor device |
JPS54145488A (en) * | 1979-03-01 | 1979-11-13 | Toshiba Corp | Semiconductor device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6411365A (en) * | 1987-07-03 | 1989-01-13 | Nippon Telegraph & Telephone | Semiconductor device and manufacture thereof |
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