JPS5619635A - Manufacturing apparatus - Google Patents

Manufacturing apparatus

Info

Publication number
JPS5619635A
JPS5619635A JP9500479A JP9500479A JPS5619635A JP S5619635 A JPS5619635 A JP S5619635A JP 9500479 A JP9500479 A JP 9500479A JP 9500479 A JP9500479 A JP 9500479A JP S5619635 A JPS5619635 A JP S5619635A
Authority
JP
Japan
Prior art keywords
works
control
treating
sequency
priority
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9500479A
Other languages
English (en)
Other versions
JPS646540B2 (ja
Inventor
Hiroto Nagatomo
Hiroshi Maejima
Jun Suzuki
Yoshiyuki Fujikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9500479A priority Critical patent/JPS5619635A/ja
Priority to GB8023045A priority patent/GB2056169B/en
Priority to DE19803028283 priority patent/DE3028283A1/de
Publication of JPS5619635A publication Critical patent/JPS5619635A/ja
Priority to US06/477,895 priority patent/US4544318A/en
Priority to SG414/84A priority patent/SG41484G/en
Priority to HK359/85A priority patent/HK35985A/xx
Priority to MY667/85A priority patent/MY8500667A/xx
Publication of JPS646540B2 publication Critical patent/JPS646540B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5196—Multiple station with conveyor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP9500479A 1979-07-27 1979-07-27 Manufacturing apparatus Granted JPS5619635A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP9500479A JPS5619635A (en) 1979-07-27 1979-07-27 Manufacturing apparatus
GB8023045A GB2056169B (en) 1979-07-27 1980-07-15 Manufacturing system for semiconductor devices
DE19803028283 DE3028283A1 (de) 1979-07-27 1980-07-25 Fertigungssystem
US06/477,895 US4544318A (en) 1979-07-27 1983-03-23 Manufacturing system
SG414/84A SG41484G (en) 1979-07-27 1984-06-04 Manufacturing system
HK359/85A HK35985A (en) 1979-07-27 1985-05-09 Manufacturing system
MY667/85A MY8500667A (en) 1979-07-27 1985-12-30 Manufacturing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9500479A JPS5619635A (en) 1979-07-27 1979-07-27 Manufacturing apparatus

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP23512385A Division JPS61123151A (ja) 1985-10-23 1985-10-23 製造装置
JP23512285A Division JPS61123150A (ja) 1985-10-23 1985-10-23 製造装置

Publications (2)

Publication Number Publication Date
JPS5619635A true JPS5619635A (en) 1981-02-24
JPS646540B2 JPS646540B2 (ja) 1989-02-03

Family

ID=14125760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9500479A Granted JPS5619635A (en) 1979-07-27 1979-07-27 Manufacturing apparatus

Country Status (7)

Country Link
US (1) US4544318A (ja)
JP (1) JPS5619635A (ja)
DE (1) DE3028283A1 (ja)
GB (1) GB2056169B (ja)
HK (1) HK35985A (ja)
MY (1) MY8500667A (ja)
SG (1) SG41484G (ja)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821318A (ja) * 1981-07-28 1983-02-08 Toshiba Corp ウエハ搬送方式
JPS58134441A (ja) * 1982-02-04 1983-08-10 Fujitsu Ltd ウエハ処理装置
JPS5981034U (ja) * 1982-11-22 1984-05-31 日立プラント建設株式会社 ウエハ搬送装置
JPS60186572A (ja) * 1984-03-06 1985-09-24 Hinode Eng Kk 塗料の製造方法
JPS61283337A (ja) * 1985-06-06 1986-12-13 Mitsui Eng & Shipbuild Co Ltd 少量多品種化学製品の生産方法
JPS63229836A (ja) * 1987-03-19 1988-09-26 Nikon Corp ウエハ検査装置
JPS63283141A (ja) * 1987-05-15 1988-11-21 Tokyo Electron Ltd 全自動プロ−バ遠隔操作システム
JPH0278243A (ja) * 1988-09-14 1990-03-19 Fujitsu Ltd ウェーハの連続処理装置及び連続処理方法
JPH0344054A (ja) * 1989-07-12 1991-02-25 Hitachi Ltd 検査システムおよび電子デバイスの製造方法
US5536128A (en) * 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
JPH08227925A (ja) * 1995-12-27 1996-09-03 Tokyo Electron Ltd プロービィング方法
JPH1064977A (ja) * 1997-06-23 1998-03-06 Hitachi Ltd 真空処理装置及び基板の処理方法
US6404911B2 (en) 1989-07-12 2002-06-11 Hitachi, Ltd. Semiconductor failure analysis system
US7239930B2 (en) 2005-05-24 2007-07-03 International Business Machines Corporation Method, system, and computer program product for improved flow of development lots in a manufacturing facility
US7305276B2 (en) 2005-10-31 2007-12-04 International Business Machines Corporation Method, system, and computer program product for controlling the flow of material in a manufacturing facility using an extended zone of control

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* Cited by examiner, † Cited by third party
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US4682927A (en) * 1982-09-17 1987-07-28 Nacom Industries, Incorporated Conveyor system
US4943457A (en) * 1985-10-24 1990-07-24 Texas Instruments Incorporated Vacuum slice carrier
JP2559617B2 (ja) * 1988-03-24 1996-12-04 キヤノン株式会社 基板処理装置
JPH0756879B2 (ja) * 1988-03-31 1995-06-14 日鉄セミコンダクター株式会社 半導体の無塵化製造装置
US5024570A (en) * 1988-09-14 1991-06-18 Fujitsu Limited Continuous semiconductor substrate processing system
JP2528708B2 (ja) * 1989-03-14 1996-08-28 富士通株式会社 半導体製造装置
JPH0313837A (ja) * 1989-06-12 1991-01-22 Mitsubishi Heavy Ind Ltd 排気弁の故障診断装置
JP2565786B2 (ja) * 1990-03-09 1996-12-18 三菱電機株式会社 自動搬送装置及び方法
DE9004208U1 (de) * 1990-04-11 1990-06-13 Groninger & Co Gmbh, 74564 Crailsheim Einrichtung zur Verarbeitung pharamzeutischer, kosmetischer o.dgl. Medien
JP2525284B2 (ja) * 1990-10-22 1996-08-14 ティーディーケイ株式会社 クリ―ン搬送方法及び装置
US5668056A (en) * 1990-12-17 1997-09-16 United Microelectronics Corporation Single semiconductor wafer transfer method and manufacturing system
JP3351802B2 (ja) * 1991-01-01 2002-12-03 忠弘 大見 薄膜形成装置
EP0582019B1 (en) * 1992-08-04 1995-10-18 International Business Machines Corporation Fully automated and computerized conveyor based manufacturing line architectures adapted to pressurized sealable transportable containers
US5865319A (en) * 1994-12-28 1999-02-02 Advantest Corp. Automatic test handler system for IC tester
US6672819B1 (en) 1995-07-19 2004-01-06 Hitachi, Ltd. Vacuum processing apparatus and semiconductor manufacturing line using the same
JPH0936198A (ja) 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
KR100487590B1 (ko) * 1995-08-21 2005-08-04 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치
US6267661B1 (en) 1996-10-03 2001-07-31 Richard Archer Melville Apparatus and process for meat packing
GB9713390D0 (en) * 1997-06-26 1997-08-27 Trikon Equip Ltd Apparatus for processing workpieces
US6647303B1 (en) 1999-10-15 2003-11-11 Data I/O Corporation Feeder/programming/buffer control system and control method
NL1013569C2 (nl) * 1999-11-12 2001-05-15 Fico Bv Transportinrichting en werkwijze voor het verplaatsen van productdragers voor elektronische componenten.
US6711798B2 (en) 2000-01-18 2004-03-30 Dell Products L.P. Method for manufacturing products according to customer orders
US6631606B2 (en) 2000-01-18 2003-10-14 Dell Products L.P. System and method for accommodating atypical customer requirements in a mass customization manufacturing facility
US6892104B2 (en) * 2000-01-18 2005-05-10 Dell Products L.P. System and method for manufacturing products according to customer orders
US7096468B1 (en) * 2000-01-18 2006-08-22 Data I/O Corporation Programmer/feeder system task linking program
JP4915033B2 (ja) * 2000-06-15 2012-04-11 株式会社ニコン 露光装置、基板処理装置及びリソグラフィシステム、並びにデバイス製造方法
US6615092B2 (en) 2001-03-05 2003-09-02 Dell Products L.P. Method, system and facility for controlling resource allocation within a manufacturing environment
US6634506B2 (en) 2001-03-05 2003-10-21 Dell Products L.P. Reusable container management system and method
US6816746B2 (en) 2001-03-05 2004-11-09 Dell Products L.P. Method and system for monitoring resources within a manufacturing environment
US6560509B2 (en) 2001-03-05 2003-05-06 Dell Products L.P. System and method for automated management of a distribution facility
US6529797B2 (en) 2001-03-05 2003-03-04 Dell Products L.P. System and method for automatically releasing collections of goods for shipment
US6505094B2 (en) 2001-03-05 2003-01-07 Dell Products L.P. System and method for shipping items from a distribution facility
US6611727B2 (en) 2001-03-05 2003-08-26 Dell Products L.P. Method and system for simulating production within a manufacturing environment
US7076317B2 (en) * 2001-06-14 2006-07-11 Renesas Technology Corp. Method for manufacturing semiconductor device
US6847858B2 (en) 2001-12-05 2005-01-25 Dell Products L.P. System and method for managing release of goods for packaging
US6726429B2 (en) 2002-02-19 2004-04-27 Vertical Solutions, Inc. Local store for a wafer processing station
JP3966211B2 (ja) * 2002-05-08 2007-08-29 株式会社ニコン 露光方法、露光装置及びデバイス製造方法
US6962306B2 (en) * 2002-07-15 2005-11-08 West Ronald R Units for storing flexible elongated objects
US7778721B2 (en) 2003-01-27 2010-08-17 Applied Materials, Inc. Small lot size lithography bays
US7221993B2 (en) * 2003-01-27 2007-05-22 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
US6840367B2 (en) * 2003-06-16 2005-01-11 Richard R. Tucker Material handling and manufacturing system and method
KR101340110B1 (ko) * 2008-09-30 2013-12-10 가부시키가이샤 섬코 반도체 제조 공장
DE202012011690U1 (de) 2012-03-09 2013-03-13 Schneider Gmbh & Co. Kg Anlage zum Bearbeiten optischer Linsen
DE102015015040A1 (de) 2015-11-12 2017-05-18 Schneider Gmbh & Co. Kg Verfahren, Anlage und System zur Bearbeitung optischer Linsen
DE102016007837A1 (de) 2016-05-25 2017-11-30 Schneider Gmbh & Co. Kg Verfahren und System zur Bearbeitung optischer Linsen
DE102017001680A1 (de) 2017-02-22 2018-08-23 Schneider Gmbh & Co. Kg Anlage und Verfahren zur Bearbeitung optischer Linsen

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49107678A (ja) * 1973-02-05 1974-10-12
JPS5336478A (en) * 1976-09-17 1978-04-04 Hitachi Ltd Automatic lead-out device for wafer from cartridge
JPS53137670A (en) * 1977-04-25 1978-12-01 Rca Corp Device for simultaneously treating plural substrates

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NL103467C (ja) * 1959-05-12
US4015530A (en) * 1966-03-30 1977-04-05 The United States Of America As Represented By The Secretary Of The Navy Two channel optical fuzing system
US3530571A (en) * 1967-12-15 1970-09-29 Cincinnati Milacron Inc Manufacturing system
US3765763A (en) * 1969-07-29 1973-10-16 Texas Instruments Inc Automatic slice processing
JPS5335316B2 (ja) * 1972-12-20 1978-09-26
JPS5332586B2 (ja) * 1973-01-19 1978-09-08
JPS5429797B2 (ja) * 1974-08-30 1979-09-26
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Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JPS49107678A (ja) * 1973-02-05 1974-10-12
JPS5336478A (en) * 1976-09-17 1978-04-04 Hitachi Ltd Automatic lead-out device for wafer from cartridge
JPS53137670A (en) * 1977-04-25 1978-12-01 Rca Corp Device for simultaneously treating plural substrates

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821318A (ja) * 1981-07-28 1983-02-08 Toshiba Corp ウエハ搬送方式
JPS58134441A (ja) * 1982-02-04 1983-08-10 Fujitsu Ltd ウエハ処理装置
JPS5981034U (ja) * 1982-11-22 1984-05-31 日立プラント建設株式会社 ウエハ搬送装置
JPS6317254Y2 (ja) * 1982-11-22 1988-05-16
JPS60186572A (ja) * 1984-03-06 1985-09-24 Hinode Eng Kk 塗料の製造方法
JPH0139697B2 (ja) * 1984-03-06 1989-08-23 Hinode Eng Kk
JPH043256B2 (ja) * 1985-06-06 1992-01-22
JPS61283337A (ja) * 1985-06-06 1986-12-13 Mitsui Eng & Shipbuild Co Ltd 少量多品種化学製品の生産方法
JPS63229836A (ja) * 1987-03-19 1988-09-26 Nikon Corp ウエハ検査装置
JPS63283141A (ja) * 1987-05-15 1988-11-21 Tokyo Electron Ltd 全自動プロ−バ遠隔操作システム
JPH0278243A (ja) * 1988-09-14 1990-03-19 Fujitsu Ltd ウェーハの連続処理装置及び連続処理方法
US5536128A (en) * 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
JPH0344054A (ja) * 1989-07-12 1991-02-25 Hitachi Ltd 検査システムおよび電子デバイスの製造方法
JP2941308B2 (ja) * 1989-07-12 1999-08-25 株式会社日立製作所 検査システムおよび電子デバイスの製造方法
US6185322B1 (en) 1989-07-12 2001-02-06 Hitachi, Ltd. Inspection system and method using separate processors for processing different information regarding a workpiece such as an electronic device
US6330352B1 (en) 1989-07-12 2001-12-11 Hitachi, Ltd. Inspection data analyzing system
US6339653B1 (en) 1989-07-12 2002-01-15 Hitachi, Ltd. Inspection data analyzing system
US6404911B2 (en) 1989-07-12 2002-06-11 Hitachi, Ltd. Semiconductor failure analysis system
US6529619B2 (en) 1989-07-12 2003-03-04 Hitachi, Ltd. Inspection data analyzing system
US6628817B2 (en) 1989-07-12 2003-09-30 Hitachi, Ltd. Inspection data analyzing system
JPH08227925A (ja) * 1995-12-27 1996-09-03 Tokyo Electron Ltd プロービィング方法
JPH1064977A (ja) * 1997-06-23 1998-03-06 Hitachi Ltd 真空処理装置及び基板の処理方法
US7239930B2 (en) 2005-05-24 2007-07-03 International Business Machines Corporation Method, system, and computer program product for improved flow of development lots in a manufacturing facility
US7305276B2 (en) 2005-10-31 2007-12-04 International Business Machines Corporation Method, system, and computer program product for controlling the flow of material in a manufacturing facility using an extended zone of control

Also Published As

Publication number Publication date
US4544318A (en) 1985-10-01
SG41484G (en) 1985-03-08
MY8500667A (en) 1985-12-31
GB2056169B (en) 1983-04-27
DE3028283A1 (de) 1981-02-19
JPS646540B2 (ja) 1989-02-03
GB2056169A (en) 1981-03-11
HK35985A (en) 1985-05-17
DE3028283C2 (ja) 1987-11-26

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