JPS56135969A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS56135969A
JPS56135969A JP3928880A JP3928880A JPS56135969A JP S56135969 A JPS56135969 A JP S56135969A JP 3928880 A JP3928880 A JP 3928880A JP 3928880 A JP3928880 A JP 3928880A JP S56135969 A JPS56135969 A JP S56135969A
Authority
JP
Japan
Prior art keywords
silicon semiconductor
substrate
type
opening
laser beams
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3928880A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6246989B2 (cg-RX-API-DMAC10.html
Inventor
Haruhisa Mori
Tsutomu Ogawa
Takashi Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP3928880A priority Critical patent/JPS56135969A/ja
Priority to US06/247,376 priority patent/US4381202A/en
Priority to DE8181301326T priority patent/DE3168239D1/de
Priority to EP81301326A priority patent/EP0037261B1/en
Publication of JPS56135969A publication Critical patent/JPS56135969A/ja
Publication of JPS6246989B2 publication Critical patent/JPS6246989B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P34/42—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/113—Isolations within a component, i.e. internal isolations
    • H10D62/115—Dielectric isolations, e.g. air gaps
    • H10D62/116—Dielectric isolations, e.g. air gaps adjoining the input or output regions of field-effect devices, e.g. adjoining source or drain regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40—Crystalline structures
    • H10P32/1414—
    • H10P32/171—
    • H10P95/90—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/046—Electron beam treatment of devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/09—Laser anneal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/091—Laser beam processing of fets

Landscapes

  • Recrystallisation Techniques (AREA)
  • Bipolar Transistors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
JP3928880A 1980-03-27 1980-03-27 Manufacture of semiconductor device Granted JPS56135969A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP3928880A JPS56135969A (en) 1980-03-27 1980-03-27 Manufacture of semiconductor device
US06/247,376 US4381202A (en) 1980-03-27 1981-03-25 Selective epitaxy by beam energy and devices thereon
DE8181301326T DE3168239D1 (en) 1980-03-27 1981-03-27 A method of manufacturing a semiconductor device, and a device, for example a bomis fet, so manufactured
EP81301326A EP0037261B1 (en) 1980-03-27 1981-03-27 A method of manufacturing a semiconductor device, and a device, for example a bomis fet, so manufactured

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3928880A JPS56135969A (en) 1980-03-27 1980-03-27 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS56135969A true JPS56135969A (en) 1981-10-23
JPS6246989B2 JPS6246989B2 (cg-RX-API-DMAC10.html) 1987-10-06

Family

ID=12548963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3928880A Granted JPS56135969A (en) 1980-03-27 1980-03-27 Manufacture of semiconductor device

Country Status (4)

Country Link
US (1) US4381202A (cg-RX-API-DMAC10.html)
EP (1) EP0037261B1 (cg-RX-API-DMAC10.html)
JP (1) JPS56135969A (cg-RX-API-DMAC10.html)
DE (1) DE3168239D1 (cg-RX-API-DMAC10.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6077465A (ja) * 1983-10-05 1985-05-02 Matsushita Electric Ind Co Ltd 半導体装置
JPS6477156A (en) * 1987-09-18 1989-03-23 Toshiba Corp Semiconductor device and manufacture thereof
WO1991001569A1 (fr) * 1989-07-14 1991-02-07 Seiko Instruments Inc. Dispositif a semi-conducteurs et procede de production
JPH03209876A (ja) * 1990-01-12 1991-09-12 Mitsubishi Electric Corp 微小なｍｉｓ型ｆｅｔとその製造方法
US5331121A (en) * 1990-03-28 1994-07-19 Mitsubishi Denki Kabushiki Kaisha Elevator control apparatus

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56160034A (en) * 1980-05-14 1981-12-09 Fujitsu Ltd Impurity diffusion
EP0077737A3 (en) * 1981-10-19 1984-11-07 FAIRCHILD CAMERA & INSTRUMENT CORPORATION Low capacitance field effect transistor
JPS5891621A (ja) * 1981-11-26 1983-05-31 Mitsubishi Electric Corp 半導体装置の製造方法
JPS58115832A (ja) * 1981-12-28 1983-07-09 Fujitsu Ltd 半導体装置の製造方法
JPS59108313A (ja) * 1982-12-13 1984-06-22 Mitsubishi Electric Corp 半導体単結晶層の製造方法
US4837175A (en) * 1983-02-15 1989-06-06 Eaton Corporation Making a buried channel FET with lateral growth over amorphous region
JPS59195871A (ja) * 1983-04-20 1984-11-07 Mitsubishi Electric Corp Ｍｏｓ電界効果トランジスタの製造方法
US4566914A (en) * 1983-05-13 1986-01-28 Micro Power Systems, Inc. Method of forming localized epitaxy and devices formed therein
JPS59220972A (ja) * 1983-05-30 1984-12-12 Mitsubishi Electric Corp Ｍｏｓ形半導体装置およびその製造方法
KR890004495B1 (ko) * 1984-11-29 1989-11-06 가부시끼가이샤 도오시바 반도체 장치
US4651410A (en) * 1984-12-18 1987-03-24 Semiconductor Division Thomson-Csf Components Corporation Method of fabricating regions of a bipolar microwave integratable transistor
US4654958A (en) * 1985-02-11 1987-04-07 Intel Corporation Process for forming isolated silicon regions and field-effect devices on a silicon substrate
US4935789A (en) * 1985-02-19 1990-06-19 Eaton Corporation Buried channel FET with lateral growth over amorphous region
JPS6235668A (ja) * 1985-08-09 1987-02-16 Nec Corp 半導体記憶装置
US4778775A (en) * 1985-08-26 1988-10-18 Intel Corporation Buried interconnect for silicon on insulator structure
NL190388C (nl) * 1986-02-07 1994-02-01 Nippon Telegraph & Telephone Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting.
US5366922A (en) * 1989-12-06 1994-11-22 Seiko Instruments Inc. Method for producing CMOS transistor
US5252143A (en) * 1990-10-15 1993-10-12 Hewlett-Packard Company Bipolar transistor structure with reduced collector-to-substrate capacitance
EP0505877A2 (en) * 1991-03-27 1992-09-30 Seiko Instruments Inc. Impurity doping method with adsorbed diffusion source
DE69213539T2 (de) * 1991-04-26 1997-02-20 Canon Kk Halbleitervorrichtung mit verbessertem isoliertem Gate-Transistor
US6064077A (en) 1991-08-30 2000-05-16 Stmicroelectronics, Inc. Integrated circuit transistor
GB9406900D0 (en) * 1994-04-07 1994-06-01 Philips Electronics Uk Ltd Manufacture of electronic devices comprising thin -film transistors
JP3216861B2 (ja) * 1995-04-10 2001-10-09 シャープ株式会社 多結晶シリコン膜の形成方法および薄膜トランジスタの製造方法
US5661051A (en) * 1996-10-09 1997-08-26 National Science Council Method for fabricating a polysilicon transistor having a buried-gate structure
US6225666B1 (en) * 1999-10-29 2001-05-01 National Semiconductor Corporation Low stress active area silicon island structure with a non-rectangular cross-section profile and method for its formation
JP3823693B2 (ja) * 2000-06-22 2006-09-20 株式会社村田製作所 半導体薄膜の製造方法およびその製造方法による半導体薄膜を備えた磁電変換素子
US6919238B2 (en) * 2002-07-29 2005-07-19 Intel Corporation Silicon on insulator (SOI) transistor and methods of fabrication
US7749872B2 (en) * 2004-03-17 2010-07-06 The Board Of Trustees Of The Leland Stanford Junior University Crystalline-type device and approach therefor
US7498243B2 (en) * 2004-03-17 2009-03-03 The Board Of Trustees Of The Leland Stanford Junior University Crystalline-type device and approach therefor
KR100612123B1 (ko) * 2004-10-18 2006-08-11 센서스앤드컨트롤스코리아 주식회사 냉장고 압축기용 접속 패키지
KR100659977B1 (ko) * 2004-11-03 2006-12-26 센서스앤드컨트롤스코리아 주식회사 냉장고 압축기용 접속 패키지의 분리형 클램프 장치
KR20100040455A (ko) * 2008-10-10 2010-04-20 주식회사 동부하이텍 반도체 소자의 제조 방법
US10435814B2 (en) 2015-10-30 2019-10-08 The Board Of Trustees Of The Leland Stanford Junior University Single metal crystals
DE102016117030B4 (de) 2016-07-17 2018-07-05 X-Fab Semiconductor Foundries Ag Herstellung von Halbleiterstrukturen auf einem Trägersubstrat, die durch Überführungsdruck (Transfer Print) übertragbar sind.
DE102017101333B4 (de) 2017-01-24 2023-07-27 X-Fab Semiconductor Foundries Gmbh Halbleiter und verfahren zur herstellung eines halbleiters

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4016587A (en) * 1974-12-03 1977-04-05 International Business Machines Corporation Raised source and drain IGFET device and method
JPS51135385A (en) * 1975-03-06 1976-11-24 Texas Instruments Inc Method of producing semiconductor device
US4240843A (en) * 1978-05-23 1980-12-23 Western Electric Company, Inc. Forming self-guarded p-n junctions by epitaxial regrowth of amorphous regions using selective radiation annealing
US4187126A (en) * 1978-07-28 1980-02-05 Conoco, Inc. Growth-orientation of crystals by raster scanning electron beam
US4147563A (en) * 1978-08-09 1979-04-03 The United States Of America As Represented By The United States Department Of Energy Method for forming p-n junctions and solar-cells by laser-beam processing
DE2837750A1 (de) * 1978-08-30 1980-03-13 Philips Patentverwaltung Verfahhren zum herstellen von halbleiterbauelementen
US4229232A (en) * 1978-12-11 1980-10-21 Spire Corporation Method involving pulsed beam processing of metallic and dielectric materials
JPS55115341A (en) * 1979-02-28 1980-09-05 Chiyou Lsi Gijutsu Kenkyu Kumiai Manufacture of semiconductor device
US4269631A (en) * 1980-01-14 1981-05-26 International Business Machines Corporation Selective epitaxy method using laser annealing for making filamentary transistors

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6077465A (ja) * 1983-10-05 1985-05-02 Matsushita Electric Ind Co Ltd 半導体装置
JPS6477156A (en) * 1987-09-18 1989-03-23 Toshiba Corp Semiconductor device and manufacture thereof
WO1991001569A1 (fr) * 1989-07-14 1991-02-07 Seiko Instruments Inc. Dispositif a semi-conducteurs et procede de production
JPH03209876A (ja) * 1990-01-12 1991-09-12 Mitsubishi Electric Corp 微小なｍｉｓ型ｆｅｔとその製造方法
US5331121A (en) * 1990-03-28 1994-07-19 Mitsubishi Denki Kabushiki Kaisha Elevator control apparatus

Also Published As

Publication number Publication date
EP0037261B1 (en) 1985-01-16
EP0037261A1 (en) 1981-10-07
US4381202A (en) 1983-04-26
DE3168239D1 (en) 1985-02-28
JPS6246989B2 (cg-RX-API-DMAC10.html) 1987-10-06

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