JPS56138920A - Method of selection and diffusion for impurities - Google Patents
Method of selection and diffusion for impuritiesInfo
- Publication number
- JPS56138920A JPS56138920A JP4173680A JP4173680A JPS56138920A JP S56138920 A JPS56138920 A JP S56138920A JP 4173680 A JP4173680 A JP 4173680A JP 4173680 A JP4173680 A JP 4173680A JP S56138920 A JPS56138920 A JP S56138920A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- polycrystalline
- substrate
- mask
- laser annealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
Abstract
PURPOSE:To unnecessitate the use of a mask matching as well as to prevent the contamination of a substrate by a method wherein an ion implantation and a laser annealing are performed using the polycrystalline semiconductor layer, which has been selectively provided on a semiconductor substrate 1 through an insulating layer, as a mask. CONSTITUTION:An SiO2 film 2 and a polycrystalline Si layer 3 are coated on an Si substrate 1, and after an aperture has been provided on the polycrystalline Si layer, an impurity element such as B and the like is ion implanted using said polycrystalline Si layer as a mask and an impurity diffused region 5 is formed by performing a laser annealing. Through these procedures, the contamination of the substrate generated with the laser annealing is performed is prevented by the SiO2 film and the selective diffusion under different state of conditions can be done by performing a self-alignment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4173680A JPS56138920A (en) | 1980-03-31 | 1980-03-31 | Method of selection and diffusion for impurities |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4173680A JPS56138920A (en) | 1980-03-31 | 1980-03-31 | Method of selection and diffusion for impurities |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56138920A true JPS56138920A (en) | 1981-10-29 |
Family
ID=12616702
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4173680A Pending JPS56138920A (en) | 1980-03-31 | 1980-03-31 | Method of selection and diffusion for impurities |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56138920A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002175772A (en) * | 2000-12-06 | 2002-06-21 | Ulvac Japan Ltd | Ion implanting device and ion implanting method |
JP2008021827A (en) * | 2006-07-13 | 2008-01-31 | Renesas Technology Corp | Manufacturing method for semiconductor device |
KR100899773B1 (en) | 2009-03-03 | 2009-05-28 | 주식회사 누리플랜 | Vehicle protection fence |
KR100909829B1 (en) | 2009-03-03 | 2009-07-28 | 주식회사 누리플랜 | Vehicle protection fence |
CN104882369A (en) * | 2014-02-28 | 2015-09-02 | 株洲南车时代电气股份有限公司 | Silicon carbide ion implantation doped mask structure and preparation method thereof |
CN113270482A (en) * | 2021-05-20 | 2021-08-17 | 厦门市三安集成电路有限公司 | Preparation method of MOSFET device |
CN115799053A (en) * | 2023-02-08 | 2023-03-14 | 通威微电子有限公司 | High-energy ion implantation method and semiconductor device |
-
1980
- 1980-03-31 JP JP4173680A patent/JPS56138920A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002175772A (en) * | 2000-12-06 | 2002-06-21 | Ulvac Japan Ltd | Ion implanting device and ion implanting method |
JP2008021827A (en) * | 2006-07-13 | 2008-01-31 | Renesas Technology Corp | Manufacturing method for semiconductor device |
KR100899773B1 (en) | 2009-03-03 | 2009-05-28 | 주식회사 누리플랜 | Vehicle protection fence |
KR100909829B1 (en) | 2009-03-03 | 2009-07-28 | 주식회사 누리플랜 | Vehicle protection fence |
CN104882369A (en) * | 2014-02-28 | 2015-09-02 | 株洲南车时代电气股份有限公司 | Silicon carbide ion implantation doped mask structure and preparation method thereof |
CN113270482A (en) * | 2021-05-20 | 2021-08-17 | 厦门市三安集成电路有限公司 | Preparation method of MOSFET device |
CN115799053A (en) * | 2023-02-08 | 2023-03-14 | 通威微电子有限公司 | High-energy ion implantation method and semiconductor device |
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