JPS5453863A - Forming method of insulation films - Google Patents
Forming method of insulation filmsInfo
- Publication number
- JPS5453863A JPS5453863A JP12034877A JP12034877A JPS5453863A JP S5453863 A JPS5453863 A JP S5453863A JP 12034877 A JP12034877 A JP 12034877A JP 12034877 A JP12034877 A JP 12034877A JP S5453863 A JPS5453863 A JP S5453863A
- Authority
- JP
- Japan
- Prior art keywords
- film
- hole
- substrate
- coated
- etched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
Abstract
PURPOSE: To delay the rate of etching on the exposed face side and increase the grade of the holes to be etched by heating the film from the exposed side while cooling the non-exposed face side at the time of heat-setting the high polymer resin film such as of polyimide film coated for the purpose of forming the insulation film.
CONSTITUTION: After a SiO2 film 2 is deposited on a Si substrate 1, specified Al films 3 are formed in specific regions, thence a polymide intermediate film 4 is spin-coated over the entire surface. Next, the substrate 1 with the film 4 being faced upward is secured, by using a conductive adhesive agent 13, onto the copper-made cooling plate 10 which is provided with a through-hole 11 for passing cooling water in the portion close to the top thereof. Thereafter, while water 12 is being flown in the through-hole 11, the film 4 is radiated with the infrared lamp disposed above the substrate 1, whereby it is turned to the film 4' in which setting has progressed more in the upper part. After these, a photo resist film 5 is coated on the film 4', and a hole 6 is opened therein. When the film is then etched with a solution of hydrazine and ehtylene diamine, the hole 7 porduced assumes inverted truncated cone form of a sharp grade
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12034877A JPS5453863A (en) | 1977-10-05 | 1977-10-05 | Forming method of insulation films |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12034877A JPS5453863A (en) | 1977-10-05 | 1977-10-05 | Forming method of insulation films |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5453863A true JPS5453863A (en) | 1979-04-27 |
| JPS6126217B2 JPS6126217B2 (en) | 1986-06-19 |
Family
ID=14784001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12034877A Granted JPS5453863A (en) | 1977-10-05 | 1977-10-05 | Forming method of insulation films |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5453863A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831558A (en) * | 1981-08-18 | 1983-02-24 | Fujitsu Ltd | Manufacture of semiconductor device |
| JPS616843A (en) * | 1984-06-20 | 1986-01-13 | Sanyo Electric Co Ltd | Formation of contact hole in semiconductor device |
| JPS6248044A (en) * | 1985-08-28 | 1987-03-02 | Oki Electric Ind Co Ltd | Multilayer interconnection forming method |
| JPH04229627A (en) * | 1990-04-27 | 1992-08-19 | Hughes Aircraft Co | Electric relay section structure and formation method |
-
1977
- 1977-10-05 JP JP12034877A patent/JPS5453863A/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831558A (en) * | 1981-08-18 | 1983-02-24 | Fujitsu Ltd | Manufacture of semiconductor device |
| JPS616843A (en) * | 1984-06-20 | 1986-01-13 | Sanyo Electric Co Ltd | Formation of contact hole in semiconductor device |
| JPS6248044A (en) * | 1985-08-28 | 1987-03-02 | Oki Electric Ind Co Ltd | Multilayer interconnection forming method |
| JPH04229627A (en) * | 1990-04-27 | 1992-08-19 | Hughes Aircraft Co | Electric relay section structure and formation method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6126217B2 (en) | 1986-06-19 |
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