JPS5541721A - Carrier tape for semiconductor device - Google Patents

Carrier tape for semiconductor device

Info

Publication number
JPS5541721A
JPS5541721A JP11424078A JP11424078A JPS5541721A JP S5541721 A JPS5541721 A JP S5541721A JP 11424078 A JP11424078 A JP 11424078A JP 11424078 A JP11424078 A JP 11424078A JP S5541721 A JPS5541721 A JP S5541721A
Authority
JP
Japan
Prior art keywords
tape
resin
carrier
semiconductor
adhered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11424078A
Other languages
Japanese (ja)
Inventor
Toshio Kobayashi
Masanori Nakamura
Hiroaki Okudaira
Akira Ikegami
Tokio Isogai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11424078A priority Critical patent/JPS5541721A/en
Publication of JPS5541721A publication Critical patent/JPS5541721A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To provide carrier tapes for a semiconductor device having a sufficiently reinforced thin beam as well as improved yield of connection between the conducting beam and the semiconductor elements by providing the beam as adhered to a carrier film.
CONSTITUTION: A metal foil tape 1 which is coated with a light-sensitive resin 2 and irradiation by ultraviolet light is applied through a mask 3 having patterns formed, unirradiated areas being dissolved to form connecting holes 4, and the resulting resin coating layer makes a resin tape 2A. Then the metal foil 1 is etched to form conducting beam 1A, which is connected to semiconductor elements 5 placed over the tape 2A in a manner such that the semiconductor element 5 is arranged to have its electrode-connecting bumps 6 set into the corresponding holes 4, to finish the desired carrier tape with the elements 5 mounted. This carrier tape device is advantaged in preventing the thin conducting beam 1A from bending or breaking by virtue of the resin tape 2A adhered thereto and much improving the yield of connection with the semicondution element.
COPYRIGHT: (C)1980,JPO&Japio
JP11424078A 1978-09-18 1978-09-18 Carrier tape for semiconductor device Pending JPS5541721A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11424078A JPS5541721A (en) 1978-09-18 1978-09-18 Carrier tape for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11424078A JPS5541721A (en) 1978-09-18 1978-09-18 Carrier tape for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5541721A true JPS5541721A (en) 1980-03-24

Family

ID=14632773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11424078A Pending JPS5541721A (en) 1978-09-18 1978-09-18 Carrier tape for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5541721A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61131706U (en) * 1985-02-06 1986-08-18
JPS62171134A (en) * 1986-01-23 1987-07-28 Fuji Xerox Co Ltd Film carrier and manufacture of semiconductor device using the filmcarrier
JPH0393246A (en) * 1989-09-05 1991-04-18 Nitto Denko Corp Film carrier and semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61131706U (en) * 1985-02-06 1986-08-18
JPH0524245Y2 (en) * 1985-02-06 1993-06-21
JPS62171134A (en) * 1986-01-23 1987-07-28 Fuji Xerox Co Ltd Film carrier and manufacture of semiconductor device using the filmcarrier
JPH0393246A (en) * 1989-09-05 1991-04-18 Nitto Denko Corp Film carrier and semiconductor device

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