Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu LtdfiledCriticalFujitsu Ltd
Priority to JP7948477ApriorityCriticalpatent/JPS5414160A/en
Publication of JPS5414160ApublicationCriticalpatent/JPS5414160A/en
PURPOSE: To increase the adhesion of resist and to make correct the alignment with resist, by making coarse the patterning surface of wafer, when the semiconductor wafer on which the beam lead chip is provided is made patterning with the resist.
COPYRIGHT: (C)1979,JPO&Japio
JP7948477A1977-07-051977-07-05Manufacture for semiconductor device
PendingJPS5414160A
(en)