JPS54161282A - Manufacture of mos semiconductor device - Google Patents

Manufacture of mos semiconductor device

Info

Publication number
JPS54161282A
JPS54161282A JP7049878A JP7049878A JPS54161282A JP S54161282 A JPS54161282 A JP S54161282A JP 7049878 A JP7049878 A JP 7049878A JP 7049878 A JP7049878 A JP 7049878A JP S54161282 A JPS54161282 A JP S54161282A
Authority
JP
Japan
Prior art keywords
film
regions
substrate
sio
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7049878A
Other languages
Japanese (ja)
Inventor
Minoru Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7049878A priority Critical patent/JPS54161282A/en
Publication of JPS54161282A publication Critical patent/JPS54161282A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To obtain a short-channel element with excellent electric characteristics by forming a step between source and drain regions, by carrying out shallow diffusion where an insulating film near a gate electrode resides and deep diffusion where the substrate surface outside of it is exposed.
CONSTITUTION: At both edges of P--type Si substrate 1, thick field SiO2 films 2 are formed and on substrate 1 surrounded with them, thin gate SiO2 film 3 is bonded. On the center region of film 3, poly-crystal Si gate electrode 4 is provided, its surface and flank are covered with resist film 5, and the exposed part of film 3 is removed by etching. Through ion injection, N+-type source region 6 and N+-type drain region 7 are formed inside of substrate 1 and electrode 4 is made conductive, but the depths of regions 6 and 7 right under residual film 3 projecting under electrode 4 at this time become shallower. In this way, a step is given between regions 6 and 7, a window is made in SiO2 film 8 bonded on the entire surface, and electrodes 9 and 10 are provided to regions 6 and 7 respectively.
COPYRIGHT: (C)1979,JPO&Japio
JP7049878A 1978-06-12 1978-06-12 Manufacture of mos semiconductor device Pending JPS54161282A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7049878A JPS54161282A (en) 1978-06-12 1978-06-12 Manufacture of mos semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7049878A JPS54161282A (en) 1978-06-12 1978-06-12 Manufacture of mos semiconductor device

Publications (1)

Publication Number Publication Date
JPS54161282A true JPS54161282A (en) 1979-12-20

Family

ID=13433241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7049878A Pending JPS54161282A (en) 1978-06-12 1978-06-12 Manufacture of mos semiconductor device

Country Status (1)

Country Link
JP (1) JPS54161282A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4818715A (en) * 1987-07-09 1989-04-04 Industrial Technology Research Institute Method of fabricating a LDDFET with self-aligned silicide
US4837180A (en) * 1987-07-09 1989-06-06 Industrial Technology Research Institute Ladder gate LDDFET
US4906589A (en) * 1989-02-06 1990-03-06 Industrial Technology Research Institute Inverse-T LDDFET with self-aligned silicide
US5015598A (en) * 1989-11-03 1991-05-14 U.S. Philips Corporation Method of manufacturing a device comprising MIS transistors having a gate electrode in the form of an inverted "T"
JPH07169975A (en) * 1993-09-20 1995-07-04 Semiconductor Energy Lab Co Ltd Semiconductor device and its manufacture
JPH07169974A (en) * 1993-09-20 1995-07-04 Semiconductor Energy Lab Co Ltd Semiconductor device and its manufacture
US6049092A (en) * 1993-09-20 2000-04-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2010098321A (en) * 1993-09-20 2010-04-30 Semiconductor Energy Lab Co Ltd Semiconductor device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4818715A (en) * 1987-07-09 1989-04-04 Industrial Technology Research Institute Method of fabricating a LDDFET with self-aligned silicide
US4837180A (en) * 1987-07-09 1989-06-06 Industrial Technology Research Institute Ladder gate LDDFET
US4906589A (en) * 1989-02-06 1990-03-06 Industrial Technology Research Institute Inverse-T LDDFET with self-aligned silicide
US5015598A (en) * 1989-11-03 1991-05-14 U.S. Philips Corporation Method of manufacturing a device comprising MIS transistors having a gate electrode in the form of an inverted "T"
JPH07169975A (en) * 1993-09-20 1995-07-04 Semiconductor Energy Lab Co Ltd Semiconductor device and its manufacture
JPH07169974A (en) * 1993-09-20 1995-07-04 Semiconductor Energy Lab Co Ltd Semiconductor device and its manufacture
US6049092A (en) * 1993-09-20 2000-04-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US6867431B2 (en) * 1993-09-20 2005-03-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2010098321A (en) * 1993-09-20 2010-04-30 Semiconductor Energy Lab Co Ltd Semiconductor device
JP4657361B2 (en) * 1993-09-20 2011-03-23 株式会社半導体エネルギー研究所 Semiconductor device

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