JPS5368974A - Production of resin seal type semiconductor device - Google Patents
Production of resin seal type semiconductor deviceInfo
- Publication number
- JPS5368974A JPS5368974A JP14509476A JP14509476A JPS5368974A JP S5368974 A JPS5368974 A JP S5368974A JP 14509476 A JP14509476 A JP 14509476A JP 14509476 A JP14509476 A JP 14509476A JP S5368974 A JPS5368974 A JP S5368974A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- type semiconductor
- seal type
- resin seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14509476A JPS5368974A (en) | 1976-12-01 | 1976-12-01 | Production of resin seal type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14509476A JPS5368974A (en) | 1976-12-01 | 1976-12-01 | Production of resin seal type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5368974A true JPS5368974A (en) | 1978-06-19 |
Family
ID=15377225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14509476A Pending JPS5368974A (en) | 1976-12-01 | 1976-12-01 | Production of resin seal type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5368974A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5954300A (ja) * | 1982-09-21 | 1984-03-29 | 日本電気株式会社 | 樹脂封止型半導体装置の製造方法 |
JPH01187830A (ja) * | 1988-01-21 | 1989-07-27 | T & K Internatl Kenkyusho:Kk | 電子部品の樹脂封止成形用金型 |
JPH05326586A (ja) * | 1992-05-20 | 1993-12-10 | Nec Yamagata Ltd | Icの製造方法 |
-
1976
- 1976-12-01 JP JP14509476A patent/JPS5368974A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5954300A (ja) * | 1982-09-21 | 1984-03-29 | 日本電気株式会社 | 樹脂封止型半導体装置の製造方法 |
JPH01187830A (ja) * | 1988-01-21 | 1989-07-27 | T & K Internatl Kenkyusho:Kk | 電子部品の樹脂封止成形用金型 |
JPH05326586A (ja) * | 1992-05-20 | 1993-12-10 | Nec Yamagata Ltd | Icの製造方法 |
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