JPS5317276A - Integrated circuit package and method of manufacture thereof - Google Patents

Integrated circuit package and method of manufacture thereof

Info

Publication number
JPS5317276A
JPS5317276A JP8989177A JP8989177A JPS5317276A JP S5317276 A JPS5317276 A JP S5317276A JP 8989177 A JP8989177 A JP 8989177A JP 8989177 A JP8989177 A JP 8989177A JP S5317276 A JPS5317276 A JP S5317276A
Authority
JP
Japan
Prior art keywords
manufacture
integrated circuit
circuit package
package
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8989177A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6143851B2 (enExample
Inventor
Jii Guratsube Deimiitori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of JPS5317276A publication Critical patent/JPS5317276A/ja
Publication of JPS6143851B2 publication Critical patent/JPS6143851B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/479—
    • H10W70/429—
    • H10W72/071—
    • H10W76/47—
    • H10W90/811—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W74/00—
    • H10W90/756—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Casings For Electric Apparatus (AREA)
JP8989177A 1976-07-30 1977-07-28 Integrated circuit package and method of manufacture thereof Granted JPS5317276A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/710,043 US4079511A (en) 1976-07-30 1976-07-30 Method for packaging hermetically sealed integrated circuit chips on lead frames

Publications (2)

Publication Number Publication Date
JPS5317276A true JPS5317276A (en) 1978-02-17
JPS6143851B2 JPS6143851B2 (enExample) 1986-09-30

Family

ID=24852388

Family Applications (2)

Application Number Title Priority Date Filing Date
JP8989177A Granted JPS5317276A (en) 1976-07-30 1977-07-28 Integrated circuit package and method of manufacture thereof
JP59155643A Granted JPS60126850A (ja) 1976-07-30 1984-07-27 集積回路パツケ−ジ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP59155643A Granted JPS60126850A (ja) 1976-07-30 1984-07-27 集積回路パツケ−ジ

Country Status (12)

Country Link
US (1) US4079511A (enExample)
JP (2) JPS5317276A (enExample)
BE (1) BE857125A (enExample)
BR (1) BR7704965A (enExample)
CA (1) CA1069220A (enExample)
DE (1) DE2734439A1 (enExample)
ES (2) ES461133A1 (enExample)
FR (1) FR2360174A1 (enExample)
GB (1) GB1524776A (enExample)
IT (1) IT1080619B (enExample)
NL (1) NL7707424A (enExample)
SE (1) SE423846B (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58169948A (ja) * 1982-03-30 1983-10-06 Fujitsu Ltd 樹脂封止型半導体装置
JPS58153459U (ja) * 1982-04-07 1983-10-14 三菱電機株式会社 半導体装置
JPS592152U (ja) * 1982-06-28 1984-01-09 富士通株式会社 リ−ド付チツプキヤリア
JPS59189662A (ja) * 1983-04-13 1984-10-27 Fujitsu Ltd 樹脂封止型半導体装置
JPS628639U (enExample) * 1985-06-28 1987-01-19
JP2010182917A (ja) * 2009-02-06 2010-08-19 Panasonic Corp パッケージ部品
JP2010185811A (ja) * 2009-02-13 2010-08-26 Panasonic Corp センサ部品
JP2011243798A (ja) * 2010-05-19 2011-12-01 Mitsubishi Electric Corp 半導体装置

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US4195193A (en) * 1979-02-23 1980-03-25 Amp Incorporated Lead frame and chip carrier housing
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US4549247A (en) * 1980-11-21 1985-10-22 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element for IC-modules
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JPS5236537Y2 (enExample) * 1973-12-30 1977-08-19

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58169948A (ja) * 1982-03-30 1983-10-06 Fujitsu Ltd 樹脂封止型半導体装置
JPS58153459U (ja) * 1982-04-07 1983-10-14 三菱電機株式会社 半導体装置
JPS592152U (ja) * 1982-06-28 1984-01-09 富士通株式会社 リ−ド付チツプキヤリア
JPS59189662A (ja) * 1983-04-13 1984-10-27 Fujitsu Ltd 樹脂封止型半導体装置
JPS628639U (enExample) * 1985-06-28 1987-01-19
JP2010182917A (ja) * 2009-02-06 2010-08-19 Panasonic Corp パッケージ部品
JP2010185811A (ja) * 2009-02-13 2010-08-26 Panasonic Corp センサ部品
JP2011243798A (ja) * 2010-05-19 2011-12-01 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
CA1069220A (en) 1980-01-01
JPS60126850A (ja) 1985-07-06
NL7707424A (nl) 1978-02-01
FR2360174A1 (fr) 1978-02-24
GB1524776A (en) 1978-09-13
SE423846B (sv) 1982-06-07
FR2360174B1 (enExample) 1983-01-21
IT1080619B (it) 1985-05-16
DE2734439A1 (de) 1978-02-02
ES462978A1 (es) 1978-06-01
JPS6143851B2 (enExample) 1986-09-30
JPS6229908B2 (enExample) 1987-06-29
US4079511A (en) 1978-03-21
DE2734439C2 (enExample) 1988-08-25
BR7704965A (pt) 1978-04-25
SE7708156L (sv) 1978-01-31
ES461133A1 (es) 1978-06-01
BE857125A (fr) 1978-01-25

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