JPS5046485A - - Google Patents
Info
- Publication number
- JPS5046485A JPS5046485A JP49057223A JP5722374A JPS5046485A JP S5046485 A JPS5046485 A JP S5046485A JP 49057223 A JP49057223 A JP 49057223A JP 5722374 A JP5722374 A JP 5722374A JP S5046485 A JPS5046485 A JP S5046485A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W74/016—
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- H10W70/421—
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- H10W74/111—
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- H10W74/124—
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- H10W74/131—
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- H10W76/157—
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- H10W74/00—
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- H10W90/756—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US39234773A | 1973-08-28 | 1973-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5046485A true JPS5046485A (enExample) | 1975-04-25 |
Family
ID=23550226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49057223A Pending JPS5046485A (enExample) | 1973-08-28 | 1974-05-21 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS5046485A (enExample) |
| DE (1) | DE2426157A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61251155A (ja) * | 1985-04-30 | 1986-11-08 | Yamaichi Electric Mfg Co Ltd | Ｉｃパッケージ |
| USD1015197S1 (en) | 2021-06-17 | 2024-02-20 | Venus by Maria Tash, Inc. | Earring post |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4079511A (en) * | 1976-07-30 | 1978-03-21 | Amp Incorporated | Method for packaging hermetically sealed integrated circuit chips on lead frames |
| DE19524001A1 (de) * | 1995-06-30 | 1997-03-06 | Siemens Ag | Verfahren zum Verpacken einer druckempfindlichen elektronischen Schaltung mit einer allseitig abdichtenden Schutzumhäusung |
| DE10223035A1 (de) * | 2002-05-22 | 2003-12-04 | Infineon Technologies Ag | Elektronisches Bauteil mit Hohlraumgehäuse, insbesondere Hochfrequenz-Leistungsmodul |
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1974
- 1974-05-21 JP JP49057223A patent/JPS5046485A/ja active Pending
- 1974-05-29 DE DE19742426157 patent/DE2426157A1/de active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61251155A (ja) * | 1985-04-30 | 1986-11-08 | Yamaichi Electric Mfg Co Ltd | Ｉｃパッケージ |
| USD1015197S1 (en) | 2021-06-17 | 2024-02-20 | Venus by Maria Tash, Inc. | Earring post |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2426157A1 (de) | 1975-03-27 |