DE2426157A1 - Halbleiter-halterung und verfahren zur herstellung derselben - Google Patents

Halbleiter-halterung und verfahren zur herstellung derselben

Info

Publication number
DE2426157A1
DE2426157A1 DE19742426157 DE2426157A DE2426157A1 DE 2426157 A1 DE2426157 A1 DE 2426157A1 DE 19742426157 DE19742426157 DE 19742426157 DE 2426157 A DE2426157 A DE 2426157A DE 2426157 A1 DE2426157 A1 DE 2426157A1
Authority
DE
Germany
Prior art keywords
opening
conductors
holder
electronic component
holder body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19742426157
Other languages
German (de)
English (en)
Inventor
Douglas A Mills
Martin Monciardini
Alvin B Phillips
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Western Digital Corp
Original Assignee
Western Digital Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Digital Corp filed Critical Western Digital Corp
Publication of DE2426157A1 publication Critical patent/DE2426157A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/124—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed the encapsulations having cavities other than that occupied by chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE19742426157 1973-08-28 1974-05-29 Halbleiter-halterung und verfahren zur herstellung derselben Pending DE2426157A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US39234773A 1973-08-28 1973-08-28

Publications (1)

Publication Number Publication Date
DE2426157A1 true DE2426157A1 (de) 1975-03-27

Family

ID=23550226

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19742426157 Pending DE2426157A1 (de) 1973-08-28 1974-05-29 Halbleiter-halterung und verfahren zur herstellung derselben

Country Status (2)

Country Link
JP (1) JPS5046485A (enExample)
DE (1) DE2426157A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2360174A1 (fr) * 1976-07-30 1978-02-24 Amp Inc Boitier de circuit integre et son procede de fabrication
WO1997002601A1 (de) * 1995-06-30 1997-01-23 Siemens Aktiengesellschaft Verfahren zum verpacken einer druckempfindlichen elektronischen schaltung mit einer allseitig abdichtenden schutzumhäusung
WO2003098666A3 (de) * 2002-05-22 2004-02-19 Infineon Technologies Ag Hochfrequenz-leistungshalbleitermodul mit hohlraumgehäuse sowie verfahren zu dessen herstellung

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61251155A (ja) * 1985-04-30 1986-11-08 Yamaichi Electric Mfg Co Ltd Ｉｃパッケージ
USD1015197S1 (en) 2021-06-17 2024-02-20 Venus by Maria Tash, Inc. Earring post

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2360174A1 (fr) * 1976-07-30 1978-02-24 Amp Inc Boitier de circuit integre et son procede de fabrication
WO1997002601A1 (de) * 1995-06-30 1997-01-23 Siemens Aktiengesellschaft Verfahren zum verpacken einer druckempfindlichen elektronischen schaltung mit einer allseitig abdichtenden schutzumhäusung
WO2003098666A3 (de) * 2002-05-22 2004-02-19 Infineon Technologies Ag Hochfrequenz-leistungshalbleitermodul mit hohlraumgehäuse sowie verfahren zu dessen herstellung

Also Published As

Publication number Publication date
JPS5046485A (enExample) 1975-04-25

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Legal Events

Date Code Title Description
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