DE69127910T2 - Halbleiteranordnung mit einem Träger, Verfahren zu seiner Herstellung, und Verfahren zum Herstellen des Trägers - Google Patents

Halbleiteranordnung mit einem Träger, Verfahren zu seiner Herstellung, und Verfahren zum Herstellen des Trägers

Info

Publication number
DE69127910T2
DE69127910T2 DE69127910T DE69127910T DE69127910T2 DE 69127910 T2 DE69127910 T2 DE 69127910T2 DE 69127910 T DE69127910 T DE 69127910T DE 69127910 T DE69127910 T DE 69127910T DE 69127910 T2 DE69127910 T2 DE 69127910T2
Authority
DE
Germany
Prior art keywords
carrier
manufacturing
production
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69127910T
Other languages
English (en)
Other versions
DE69127910D1 (de
Inventor
Johannes Maria C Verspeek
Henricus Adrianus L Laarhoven
Peter Wilhelmus M Van De Water
Kornelis Boer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV, Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of DE69127910D1 publication Critical patent/DE69127910D1/de
Application granted granted Critical
Publication of DE69127910T2 publication Critical patent/DE69127910T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H01L23/49844—Geometry or layout for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE69127910T 1990-01-23 1991-01-21 Halbleiteranordnung mit einem Träger, Verfahren zu seiner Herstellung, und Verfahren zum Herstellen des Trägers Expired - Fee Related DE69127910T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9000161A NL9000161A (nl) 1990-01-23 1990-01-23 Halfgeleiderinrichting bevattende een drager en werkwijze voor het vervaardigen van de drager.

Publications (2)

Publication Number Publication Date
DE69127910D1 DE69127910D1 (de) 1997-11-20
DE69127910T2 true DE69127910T2 (de) 1998-04-02

Family

ID=19856464

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69127910T Expired - Fee Related DE69127910T2 (de) 1990-01-23 1991-01-21 Halbleiteranordnung mit einem Träger, Verfahren zu seiner Herstellung, und Verfahren zum Herstellen des Trägers

Country Status (7)

Country Link
US (1) US5198886A (de)
EP (1) EP0439227B1 (de)
JP (1) JP3040501B2 (de)
KR (1) KR100198209B1 (de)
CN (1) CN1024731C (de)
DE (1) DE69127910T2 (de)
NL (1) NL9000161A (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0705484B1 (de) * 1994-04-15 1999-02-24 Koninklijke Philips Electronics N.V. Herstellungsverfahren für eine anordnung, wobei ein längsträger mit leiterbahnen zur elektrischen kontaktierung eines halbleiterelements versehen ist
KR100372136B1 (ko) * 1995-05-10 2003-03-15 코닌클리케 필립스 일렉트로닉스 엔.브이. 반도체디바이스및그제조에적합한캐리어로드
RU2130221C1 (ru) * 1996-04-23 1999-05-10 Акционерное общество закрытого типа "Энергомаштехника" Матрица лазерных диодов
JP2810647B2 (ja) * 1996-04-30 1998-10-15 山一電機株式会社 Ｉｃパッケージ
US5986334A (en) * 1996-10-04 1999-11-16 Anam Industrial Co., Ltd. Semiconductor package having light, thin, simple and compact structure
US6295307B1 (en) * 1997-10-14 2001-09-25 Decade Products, Inc. Laser diode assembly
JP3842444B2 (ja) * 1998-07-24 2006-11-08 富士通株式会社 半導体装置の製造方法
DE10025774A1 (de) * 2000-05-26 2001-12-06 Osram Opto Semiconductors Gmbh Halbleiterbauelement mit Oberflächenmetallisierung
WO2004068536A2 (en) * 2003-01-30 2004-08-12 University Of Cape Town A thin film semiconductor device and method of manufacturing a thin film semiconductor device
US7183587B2 (en) * 2003-09-09 2007-02-27 Cree, Inc. Solid metal block mounting substrates for semiconductor light emitting devices
US20060097385A1 (en) 2004-10-25 2006-05-11 Negley Gerald H Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
US7322732B2 (en) 2004-12-23 2008-01-29 Cree, Inc. Light emitting diode arrays for direct backlighting of liquid crystal displays
US7304694B2 (en) 2005-01-12 2007-12-04 Cree, Inc. Solid colloidal dispersions for backlighting of liquid crystal displays
EP1878062A2 (de) * 2005-04-28 2008-01-16 Koninklijke Philips Electronics N.V. Lichtquelle mit in eine aussparung angeordneter led
US20070269915A1 (en) * 2006-05-16 2007-11-22 Ak Wing Leong LED devices incorporating moisture-resistant seals and having ceramic substrates
WO2007139781A2 (en) 2006-05-23 2007-12-06 Cree Led Lighting Solutions, Inc. Lighting device
US8772817B2 (en) 2010-12-22 2014-07-08 Cree, Inc. Electronic device submounts including substrates with thermally conductive vias
DE102012001346A1 (de) * 2012-01-24 2013-07-25 Giesecke & Devrient Gmbh Verfahren zum Herstellen eines Datenträgers
DE102012103633B4 (de) * 2012-04-25 2020-08-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierende Vorrichtung und Verfahren zum Herstellen einer derartigen Vorrichtung
CN104260009B (zh) * 2014-08-23 2016-05-11 华东光电集成器件研究所 一种衬底粘接夹持定位装置
US11431146B2 (en) * 2015-03-27 2022-08-30 Jabil Inc. Chip on submount module

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3254274A (en) * 1961-09-26 1966-05-31 Ibm Mounting apparatus for electronic devices
DE1564444C3 (de) * 1966-03-24 1978-05-11 N.V. Philips' Gloeilampenfabrieken, Eindhoven (Niederlande) Halbleiteranordnung mit einem isolierenden Träger
US3857115A (en) * 1972-05-30 1974-12-24 Marconi Co Ltd Semiconductor device mounting arrangements
US3972012A (en) * 1974-12-23 1976-07-27 Rca Corporation Apparatus for mounting a diode in a microwave circuit
GB1597707A (en) * 1978-03-08 1981-09-09 Aei Semiconductors Ltd Electronic component assemblies
JPS5875859A (ja) * 1981-10-30 1983-05-07 Fujitsu Ltd 半導体装置
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
JPS58173790A (ja) * 1982-04-06 1983-10-12 シチズン時計株式会社 表示装置と半導体装置の接続構造
FR2535110B1 (fr) * 1982-10-20 1986-07-25 Radiotechnique Compelec Procede d'encapsulation d'un composant semi-conducteur dans un circuit electronique realise sur substrat et application aux circuits integres rapides
US4670770A (en) * 1984-02-21 1987-06-02 American Telephone And Telegraph Company Integrated circuit chip-and-substrate assembly
EP0333237A3 (de) * 1984-05-18 1990-03-21 BRITISH TELECOMMUNICATIONS public limited company Integrierter Schaltungschipträger
GB8412674D0 (en) * 1984-05-18 1984-06-27 British Telecomm Integrated circuit chip carrier
US4647959A (en) * 1985-05-20 1987-03-03 Tektronix, Inc. Integrated circuit package, and method of forming an integrated circuit package
FR2589629B1 (fr) * 1985-11-05 1987-12-18 Radiotechnique Compelec Composant opto-electronique pour montage en surface et son procede de fabrication
KR940003375B1 (ko) * 1986-05-21 1994-04-21 가부시끼가이샤 히다찌세이사꾸쇼 반도체 장치 및 그 제조 방법
US4922378A (en) * 1986-08-01 1990-05-01 Texas Instruments Incorporated Baseboard for orthogonal chip mount
KR880014692A (ko) * 1987-05-30 1988-12-24 강진구 반사경이 부착된 반도체 발광장치

Also Published As

Publication number Publication date
NL9000161A (nl) 1991-08-16
KR910015038A (ko) 1991-08-31
CN1054334A (zh) 1991-09-04
US5198886A (en) 1993-03-30
EP0439227A1 (de) 1991-07-31
DE69127910D1 (de) 1997-11-20
JPH04212431A (ja) 1992-08-04
JP3040501B2 (ja) 2000-05-15
CN1024731C (zh) 1994-05-25
KR100198209B1 (ko) 1999-07-01
EP0439227B1 (de) 1997-10-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N

8339 Ceased/non-payment of the annual fee