JPH0325410Y2 - - Google Patents

Info

Publication number
JPH0325410Y2
JPH0325410Y2 JP1985122952U JP12295285U JPH0325410Y2 JP H0325410 Y2 JPH0325410 Y2 JP H0325410Y2 JP 1985122952 U JP1985122952 U JP 1985122952U JP 12295285 U JP12295285 U JP 12295285U JP H0325410 Y2 JPH0325410 Y2 JP H0325410Y2
Authority
JP
Japan
Prior art keywords
protrusion
package
view
protrusions
plcc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985122952U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6249245U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985122952U priority Critical patent/JPH0325410Y2/ja
Priority to KR1019860006353A priority patent/KR900001987B1/ko
Priority to US06/894,149 priority patent/US4724280A/en
Priority to DE8686111059T priority patent/DE3679473D1/de
Priority to EP86111059A priority patent/EP0212521B1/en
Publication of JPS6249245U publication Critical patent/JPS6249245U/ja
Application granted granted Critical
Publication of JPH0325410Y2 publication Critical patent/JPH0325410Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1985122952U 1985-08-10 1985-08-10 Expired JPH0325410Y2 (enExample)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1985122952U JPH0325410Y2 (enExample) 1985-08-10 1985-08-10
KR1019860006353A KR900001987B1 (ko) 1985-08-10 1986-08-01 집적회로용 패케이지
US06/894,149 US4724280A (en) 1985-08-10 1986-08-07 Package for integrated circuit
DE8686111059T DE3679473D1 (de) 1985-08-10 1986-08-11 Packung fuer integrierte schaltung.
EP86111059A EP0212521B1 (en) 1985-08-10 1986-08-11 Package for integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985122952U JPH0325410Y2 (enExample) 1985-08-10 1985-08-10

Publications (2)

Publication Number Publication Date
JPS6249245U JPS6249245U (enExample) 1987-03-26
JPH0325410Y2 true JPH0325410Y2 (enExample) 1991-06-03

Family

ID=14848683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985122952U Expired JPH0325410Y2 (enExample) 1985-08-10 1985-08-10

Country Status (5)

Country Link
US (1) US4724280A (enExample)
EP (1) EP0212521B1 (enExample)
JP (1) JPH0325410Y2 (enExample)
KR (1) KR900001987B1 (enExample)
DE (1) DE3679473D1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5005070A (en) * 1988-12-19 1991-04-02 Hewlett-Packard Company Soldering interconnect method and apparatus for semiconductor packages
US4989069A (en) * 1990-01-29 1991-01-29 Motorola, Inc. Semiconductor package having leads that break-away from supports
US6329711B1 (en) 1995-11-08 2001-12-11 Fujitsu Limited Semiconductor device and mounting structure
US6072239A (en) * 1995-11-08 2000-06-06 Fujitsu Limited Device having resin package with projections
US6159770A (en) * 1995-11-08 2000-12-12 Fujitsu Limited Method and apparatus for fabricating semiconductor device
US6376921B1 (en) * 1995-11-08 2002-04-23 Fujitsu Limited Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
JP3026426B2 (ja) * 1996-08-29 2000-03-27 沖電気工業株式会社 樹脂封止型半導体装置とその製造方法及びその金型構造
JP3842444B2 (ja) 1998-07-24 2006-11-08 富士通株式会社 半導体装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
US4089575A (en) * 1976-09-27 1978-05-16 Amp Incorporated Connector for connecting a circuit element to the surface of a substrate
US4495376A (en) * 1981-07-27 1985-01-22 Texas Instruments Incorporated Carrier for integrated circuit
US4465898A (en) * 1981-07-27 1984-08-14 Texas Instruments Incorporated Carrier for integrated circuit
US4463217A (en) * 1981-09-14 1984-07-31 Texas Instruments Incorporated Plastic surface mounted high pinout integrated circuit package
JPS58169948A (ja) * 1982-03-30 1983-10-06 Fujitsu Ltd 樹脂封止型半導体装置

Also Published As

Publication number Publication date
EP0212521B1 (en) 1991-05-29
EP0212521A1 (en) 1987-03-04
KR900001987B1 (ko) 1990-03-30
US4724280A (en) 1988-02-09
DE3679473D1 (de) 1991-07-04
KR870002643A (ko) 1987-04-06
JPS6249245U (enExample) 1987-03-26

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