DE3679473D1 - Packung fuer integrierte schaltung. - Google Patents

Packung fuer integrierte schaltung.

Info

Publication number
DE3679473D1
DE3679473D1 DE8686111059T DE3679473T DE3679473D1 DE 3679473 D1 DE3679473 D1 DE 3679473D1 DE 8686111059 T DE8686111059 T DE 8686111059T DE 3679473 T DE3679473 T DE 3679473T DE 3679473 D1 DE3679473 D1 DE 3679473D1
Authority
DE
Germany
Prior art keywords
package
integrated circuit
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686111059T
Other languages
German (de)
English (en)
Inventor
Kazuto Tsuji
Tsuyoshi Aoki
Michio Ono
Rikio Sugiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3679473D1 publication Critical patent/DE3679473D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
DE8686111059T 1985-08-10 1986-08-11 Packung fuer integrierte schaltung. Expired - Lifetime DE3679473D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985122952U JPH0325410Y2 (enExample) 1985-08-10 1985-08-10

Publications (1)

Publication Number Publication Date
DE3679473D1 true DE3679473D1 (de) 1991-07-04

Family

ID=14848683

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686111059T Expired - Lifetime DE3679473D1 (de) 1985-08-10 1986-08-11 Packung fuer integrierte schaltung.

Country Status (5)

Country Link
US (1) US4724280A (enExample)
EP (1) EP0212521B1 (enExample)
JP (1) JPH0325410Y2 (enExample)
KR (1) KR900001987B1 (enExample)
DE (1) DE3679473D1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5005070A (en) * 1988-12-19 1991-04-02 Hewlett-Packard Company Soldering interconnect method and apparatus for semiconductor packages
US4989069A (en) * 1990-01-29 1991-01-29 Motorola, Inc. Semiconductor package having leads that break-away from supports
US6329711B1 (en) 1995-11-08 2001-12-11 Fujitsu Limited Semiconductor device and mounting structure
US6072239A (en) * 1995-11-08 2000-06-06 Fujitsu Limited Device having resin package with projections
US6159770A (en) * 1995-11-08 2000-12-12 Fujitsu Limited Method and apparatus for fabricating semiconductor device
US6376921B1 (en) * 1995-11-08 2002-04-23 Fujitsu Limited Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
JP3026426B2 (ja) * 1996-08-29 2000-03-27 沖電気工業株式会社 樹脂封止型半導体装置とその製造方法及びその金型構造
JP3842444B2 (ja) 1998-07-24 2006-11-08 富士通株式会社 半導体装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
US4089575A (en) * 1976-09-27 1978-05-16 Amp Incorporated Connector for connecting a circuit element to the surface of a substrate
US4495376A (en) * 1981-07-27 1985-01-22 Texas Instruments Incorporated Carrier for integrated circuit
US4465898A (en) * 1981-07-27 1984-08-14 Texas Instruments Incorporated Carrier for integrated circuit
US4463217A (en) * 1981-09-14 1984-07-31 Texas Instruments Incorporated Plastic surface mounted high pinout integrated circuit package
JPS58169948A (ja) * 1982-03-30 1983-10-06 Fujitsu Ltd 樹脂封止型半導体装置

Also Published As

Publication number Publication date
EP0212521B1 (en) 1991-05-29
EP0212521A1 (en) 1987-03-04
KR900001987B1 (ko) 1990-03-30
US4724280A (en) 1988-02-09
JPH0325410Y2 (enExample) 1991-06-03
KR870002643A (ko) 1987-04-06
JPS6249245U (enExample) 1987-03-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee