KR870002643A - 직접회로용 패케이지 - Google Patents
직접회로용 패케이지 Download PDFInfo
- Publication number
- KR870002643A KR870002643A KR1019860006353A KR860006353A KR870002643A KR 870002643 A KR870002643 A KR 870002643A KR 1019860006353 A KR1019860006353 A KR 1019860006353A KR 860006353 A KR860006353 A KR 860006353A KR 870002643 A KR870002643 A KR 870002643A
- Authority
- KR
- South Korea
- Prior art keywords
- integrated circuit
- height
- ridges
- circuit package
- package
- Prior art date
Links
- 238000010586 diagram Methods 0.000 description 2
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01067—Holmium [Ho]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 인쇄회로 기판상 납땜된 PLCC의 횡단측면도의 개략도.
제2도는 융기부와 그의 연관 리이드를 확대하여 보인 횡단측면도의 개략도.
제7도는 본 발명의 PLCC의 융기부들과 그들에 연관된 리이드들의 확대부분 사시도의 개략도.
Claims (2)
- (a) 내부에 집적회로를 내장하며 또한 상면, 밑면 및 4개의 측면들을 갖고 있되, 상기 밑면은 다수의 융기부들을 갖고 있으며, 상기 융기부들은 각 측면을 따라 정렬되며 또한 예정된 거리만큼 상호연결구에 의해 인접한 융기부로부터 격리되어 그에 연결되며, 상기 상호연결구는 상기 봉합과 동일한 재료로 제조되어상기 밑면의 밖으로 돌출하며 또한 상기 밑면으로부터 측정된 상기 융기부의 높이 보다 낮은 높이를 갖는 봉함과, 그리고 (b) 각 리드의 단부가 상기 봉함 내부에 봉입된 상기 집적회로의 단자패드에 연결되며, 상기 각 측면을 통하여 상기 밑면을 향해 상기 측면을 따라 연장되며, 그리고 상기 리이드는 상기 밑면을 향하여 상기 융기부를 따라 만곡되어 그 위로 더 연장되는 다수의 리이드들을 포함하는 것이 특징인 집적회로용 패케이지.
- 제1항에서, 상기 상호연결부의 높이는 상기 밑면으로부터 측정된 상기 융기부의 높이의 1/3보다는 크나 2/3보다는 작은 것이 특징인 집적회로용 패케이지.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985122952U JPH0325410Y2 (ko) | 1985-08-10 | 1985-08-10 | |
JP60-122952 | 1985-08-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR870002643A true KR870002643A (ko) | 1987-04-06 |
KR900001987B1 KR900001987B1 (ko) | 1990-03-30 |
Family
ID=14848683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019860006353A KR900001987B1 (ko) | 1985-08-10 | 1986-08-01 | 집적회로용 패케이지 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4724280A (ko) |
EP (1) | EP0212521B1 (ko) |
JP (1) | JPH0325410Y2 (ko) |
KR (1) | KR900001987B1 (ko) |
DE (1) | DE3679473D1 (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5005070A (en) * | 1988-12-19 | 1991-04-02 | Hewlett-Packard Company | Soldering interconnect method and apparatus for semiconductor packages |
US4989069A (en) * | 1990-01-29 | 1991-01-29 | Motorola, Inc. | Semiconductor package having leads that break-away from supports |
US6072239A (en) | 1995-11-08 | 2000-06-06 | Fujitsu Limited | Device having resin package with projections |
US6376921B1 (en) * | 1995-11-08 | 2002-04-23 | Fujitsu Limited | Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame |
US6159770A (en) * | 1995-11-08 | 2000-12-12 | Fujitsu Limited | Method and apparatus for fabricating semiconductor device |
US6329711B1 (en) | 1995-11-08 | 2001-12-11 | Fujitsu Limited | Semiconductor device and mounting structure |
JP3026426B2 (ja) * | 1996-08-29 | 2000-03-27 | 沖電気工業株式会社 | 樹脂封止型半導体装置とその製造方法及びその金型構造 |
JP3842444B2 (ja) | 1998-07-24 | 2006-11-08 | 富士通株式会社 | 半導体装置の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4079511A (en) * | 1976-07-30 | 1978-03-21 | Amp Incorporated | Method for packaging hermetically sealed integrated circuit chips on lead frames |
US4089575A (en) * | 1976-09-27 | 1978-05-16 | Amp Incorporated | Connector for connecting a circuit element to the surface of a substrate |
US4495376A (en) * | 1981-07-27 | 1985-01-22 | Texas Instruments Incorporated | Carrier for integrated circuit |
US4465898A (en) * | 1981-07-27 | 1984-08-14 | Texas Instruments Incorporated | Carrier for integrated circuit |
US4463217A (en) * | 1981-09-14 | 1984-07-31 | Texas Instruments Incorporated | Plastic surface mounted high pinout integrated circuit package |
JPS58169948A (ja) * | 1982-03-30 | 1983-10-06 | Fujitsu Ltd | 樹脂封止型半導体装置 |
-
1985
- 1985-08-10 JP JP1985122952U patent/JPH0325410Y2/ja not_active Expired
-
1986
- 1986-08-01 KR KR1019860006353A patent/KR900001987B1/ko not_active IP Right Cessation
- 1986-08-07 US US06/894,149 patent/US4724280A/en not_active Expired - Fee Related
- 1986-08-11 EP EP86111059A patent/EP0212521B1/en not_active Expired - Lifetime
- 1986-08-11 DE DE8686111059T patent/DE3679473D1/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0212521B1 (en) | 1991-05-29 |
DE3679473D1 (de) | 1991-07-04 |
JPS6249245U (ko) | 1987-03-26 |
EP0212521A1 (en) | 1987-03-04 |
KR900001987B1 (ko) | 1990-03-30 |
US4724280A (en) | 1988-02-09 |
JPH0325410Y2 (ko) | 1991-06-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 19950304 Year of fee payment: 6 |
|
LAPS | Lapse due to unpaid annual fee |