KR890007422A - 집적회로가 탑재된 필름세그먼트와 그 고정물 - Google Patents

집적회로가 탑재된 필름세그먼트와 그 고정물 Download PDF

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Publication number
KR890007422A
KR890007422A KR1019880012992A KR880012992A KR890007422A KR 890007422 A KR890007422 A KR 890007422A KR 1019880012992 A KR1019880012992 A KR 1019880012992A KR 880012992 A KR880012992 A KR 880012992A KR 890007422 A KR890007422 A KR 890007422A
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KR
South Korea
Prior art keywords
film segment
hole
segment body
lead
film
Prior art date
Application number
KR1019880012992A
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English (en)
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KR910009421B1 (ko
Inventor
다쯔야 미야자끼
Original Assignee
야마모도 다꾸마
후지쓰 가부시끼가이샤
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Application filed by 야마모도 다꾸마, 후지쓰 가부시끼가이샤 filed Critical 야마모도 다꾸마
Publication of KR890007422A publication Critical patent/KR890007422A/ko
Application granted granted Critical
Publication of KR910009421B1 publication Critical patent/KR910009421B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

내용 없음

Description

집적회로가 탑재된 필름세그먼트와 그 고정물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따라 무선방식으로 집적회로를 탑재한 필름세그먼트의 단면도.
제2도는 홀더 또는 고정물(flxture)과 함께 제1도의 필름세그먼트를 나타내는 사시도.
제3도는 제2도의 선Ⅲ-Ⅲ을 따라 고정물에 고정되는 필름세그먼트의 단면도.

Claims (2)

  1. 필름세그먼트보디의 4개의 측면모서리 중 2개의 반대편 모서리에 밀접하게 위치하고 나머지 2개의 반대편모서리와 평행하게 위치되는 다수의 스프로킷구멍과 4개의 측면에 직사각형 모양을 갖는 상기 필름세그먼트보디; 상기 필름세그먼트보디에 구비되고 그 중앙부에 형성된 구멍; 상기 필름세그먼트보디에 형성되고 상기 필름세그먼트보디에 고정되는 외부와 상기 중앙구멍의 안쪽영역으로 연장되는 내부를 포함하며, 집적회로칩이 리드소자의 내부에 장착되어 집적회로칩이 사실상 중앙구멍의 안쪽영역에 배치되는 다수의 상기 리드소자를 포함하는 리드패턴; 상기 리드패턴에 포함되고, 상기 리드소자에 각각 전기적으로 연결되며, 상기 중앙구멍 주변과 상기 스프로킷구멍의 내부에 세트되는 상기 필름세그먼트보디의 일영역에 열로 형성되는 다수의 도체패드; 및 상기 필름세그먼트에 구비되고, 상기 도체패드에 근접하여 배치되어 상기 도체패드의 열에 포함되는 각각의 위치결정구멍 중 최소한 2개의 위치결정구멍을 포함하는 것을 특징으로 하는 집적회로공급용 필름세그먼트.
  2. 제1항에 있어서, 필름세그먼트를 수신하기 위해 형성된 오목부를 구비한 고정물보디; 상기 고정물보디에 구비되며 상기 오목부의 저면에 형성된 윈도우; 상기 오목부에서 필름세그먼트를 수신하면서 스프로킷구멍과 연동하기 위해 상기 오목저면의 여유영역에서 돌출된 최소한 2개의 돌기부; 및 필름세그먼트보내와 위에 형성된 도체패드와 위치결정구멍을 둘러싸도록 크기가 결정되고 상기 세그먼트보디 보다는 작은 상기 윈도우를 포함하는 것을 특징으로 하는 필름세그먼트 고정용 고정물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880012992A 1987-10-05 1988-10-05 집적회로가 탑재된 필름세그먼트와 그 고정물 KR910009421B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62250997A JPH0628273B2 (ja) 1987-10-05 1987-10-05 Ｉｃ支持フィルムとそれを塔載したキャリア
JP62-250997 1987-10-05

Publications (2)

Publication Number Publication Date
KR890007422A true KR890007422A (ko) 1989-06-19
KR910009421B1 KR910009421B1 (ko) 1991-11-15

Family

ID=17216115

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880012992A KR910009421B1 (ko) 1987-10-05 1988-10-05 집적회로가 탑재된 필름세그먼트와 그 고정물

Country Status (5)

Country Link
US (1) US4937655A (ko)
EP (1) EP0311513B1 (ko)
JP (1) JPH0628273B2 (ko)
KR (1) KR910009421B1 (ko)
DE (1) DE3886657D1 (ko)

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US4969828A (en) * 1989-05-17 1990-11-13 Amp Incorporated Electrical socket for TAB IC's
JPH0727927B2 (ja) 1990-03-12 1995-03-29 株式会社東芝 テープキャリア
US5138429A (en) * 1990-08-30 1992-08-11 Hewlett-Packard Company Precisely aligned lead frame using registration traces and pads
GB2257827B (en) * 1991-07-17 1995-05-03 Lsi Logic Europ Support for semiconductor bond wires
US5340772A (en) * 1992-07-17 1994-08-23 Lsi Logic Corporation Method of increasing the layout efficiency of dies on a wafer and increasing the ratio of I/O area to active area per die
US5532934A (en) * 1992-07-17 1996-07-02 Lsi Logic Corporation Floorplanning technique using multi-partitioning based on a partition cost factor for non-square shaped partitions
US5349236A (en) * 1992-07-21 1994-09-20 Mitsui Toatsu Chemicals, Incorporated Reusable fixture for carrier tape
JP2878929B2 (ja) * 1993-06-03 1999-04-05 株式会社東芝 半導体装置
US5561086A (en) * 1993-06-18 1996-10-01 Lsi Logic Corporation Techniques for mounting semiconductor dies in die-receiving areas having support structure having notches
US5578870A (en) * 1995-08-03 1996-11-26 Precision Connector Designs, Inc. Top loading test socket for ball grid arrays
US5647750A (en) * 1995-11-30 1997-07-15 The Whitaker Corporation Socket for a tape carrier package
CA2377464A1 (en) * 2001-05-03 2002-11-03 Michio Ikura Low temperature stable diesel oil/alcohol mixtures
DE10260849B4 (de) 2002-12-23 2017-05-24 Robert Bosch Gmbh Meßfühler
CN112008175B (zh) * 2020-09-03 2021-12-14 深圳市芯链芯数据技术有限公司 一种集成电路封装焊线机压板结构

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US4007479A (en) * 1976-03-29 1977-02-08 Honeywell Information Systems, Inc. Fixture for an integrated circuit chip
JPS5320766A (en) * 1976-08-10 1978-02-25 Toshiba Corp Film carrier production for lead frames
US4069496A (en) * 1976-12-30 1978-01-17 Honeywell Information Systems Inc. Reusable fixture for an integrated circuit chip
JPS54147780A (en) * 1978-05-11 1979-11-19 Seiko Instr & Electronics Ltd Carrier tape
JPS5834952A (ja) * 1981-08-26 1983-03-01 Nec Corp 半導体装置用テ−プキヤリア
EP0087796B1 (de) * 1982-03-02 1989-05-17 Siemens Aktiengesellschaft Filmträger für ein elektrisches Leiterbild
DE3207458C1 (de) * 1982-03-02 1983-06-09 Siemens AG, 1000 Berlin und 8000 München Halterung fuer die Einzelverarbeitung von filmmotierten integrierten Schaltkreisen
JPS59158545A (ja) * 1983-02-28 1984-09-08 Nec Corp リ−ドフレ−ム
JPS6190453A (ja) * 1984-10-09 1986-05-08 Nec Corp フイルムキャリヤーテープ
US4547794A (en) * 1984-10-17 1985-10-15 Amdahl Corporation Reusable fixture for holding a segment of a flexible strip
US4696526A (en) * 1985-07-26 1987-09-29 Intel Corporation Carrier for tape automated bonded semiconductor device
JPS62234337A (ja) * 1986-04-04 1987-10-14 Hitachi Cable Ltd 半導体装置用フイルムキヤリア
JPS6373531A (ja) * 1986-09-16 1988-04-04 Nec Corp キヤリア・テ−プ

Also Published As

Publication number Publication date
EP0311513B1 (en) 1993-12-29
JPH0628273B2 (ja) 1994-04-13
EP0311513A3 (en) 1990-10-24
US4937655A (en) 1990-06-26
JPH0193138A (ja) 1989-04-12
EP0311513A2 (en) 1989-04-12
DE3886657D1 (de) 1994-02-10
KR910009421B1 (ko) 1991-11-15

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