JPS5320766A - Film carrier production for lead frames - Google Patents

Film carrier production for lead frames

Info

Publication number
JPS5320766A
JPS5320766A JP9444776A JP9444776A JPS5320766A JP S5320766 A JPS5320766 A JP S5320766A JP 9444776 A JP9444776 A JP 9444776A JP 9444776 A JP9444776 A JP 9444776A JP S5320766 A JPS5320766 A JP S5320766A
Authority
JP
Japan
Prior art keywords
lead frames
film carrier
carrier production
piercing
positioning holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9444776A
Other languages
Japanese (ja)
Inventor
Minoru Nemoto
Kakuo Mihara
Hideo Kawai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9444776A priority Critical patent/JPS5320766A/en
Publication of JPS5320766A publication Critical patent/JPS5320766A/en
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To eliminate the position deviation between lead frame patterns and semiconductor pellets by piercing feed holes and positioning holes separately and piercing the positioning holes simultaneously with the windows for accepting and holding semiconductor pellets.
COPYRIGHT: (C)1978,JPO&Japio
JP9444776A 1976-08-10 1976-08-10 Film carrier production for lead frames Pending JPS5320766A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9444776A JPS5320766A (en) 1976-08-10 1976-08-10 Film carrier production for lead frames

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9444776A JPS5320766A (en) 1976-08-10 1976-08-10 Film carrier production for lead frames

Publications (1)

Publication Number Publication Date
JPS5320766A true JPS5320766A (en) 1978-02-25

Family

ID=14110504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9444776A Pending JPS5320766A (en) 1976-08-10 1976-08-10 Film carrier production for lead frames

Country Status (1)

Country Link
JP (1) JPS5320766A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0193138A (en) * 1987-10-05 1989-04-12 Fujitsu Ltd Ic holding film and carrier loaded therewith

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4939378A (en) * 1972-08-11 1974-04-12

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4939378A (en) * 1972-08-11 1974-04-12

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0193138A (en) * 1987-10-05 1989-04-12 Fujitsu Ltd Ic holding film and carrier loaded therewith
JPH0628273B2 (en) * 1987-10-05 1994-04-13 富士通株式会社 IC support film and carrier mounting it

Similar Documents

Publication Publication Date Title
JPS5381073A (en) Oroduction of resin seal type semiconductor device and lead frame used the same
JPS51115775A (en) Semiconductor apparatus
JPS51128417A (en) A method for stabilizing active vitamin d3 derivatives
JPS5320766A (en) Film carrier production for lead frames
JPS5372456A (en) Glass sealing semiconductor device
JPS5373969A (en) Lead frame for semicinductor
JPS5334430A (en) Memory unit
JPS525273A (en) Transistor
JPS5325360A (en) Production of semiconductor device
JPS53142877A (en) Manufacture for compound semiconductor device
JPS53106572A (en) Lead frame for semiconductor device
JPS5252370A (en) Fabrication of glass-sealed semiconductor device
JPS5323575A (en) Production of semicondu ctor device
JPS5287982A (en) Resin molding method of semiconductor elements
JPS532071A (en) Manufacture of semiconductor device
JPS51138166A (en) Production method of semiconductor device
JPS5310968A (en) Pellet bonding method
JPS53108368A (en) Manufacture for resin seal type semiconductor device and its lead frame for its manufacture
JPS5211860A (en) Liquid phase epitaxial device
JPS5313873A (en) Tape carrier
JPS51131277A (en) Semi-conductor unit manufacturing process
JPS5247884A (en) Method for preparing stabilized polyolefin
JPS53144671A (en) Production of semiconductor device
JPS51151071A (en) Manufacturing method of a semiconductor apparatus
JPS5218176A (en) Production method of semiconductor device