KR900001987B1 - 집적회로용 패케이지 - Google Patents

집적회로용 패케이지 Download PDF

Info

Publication number
KR900001987B1
KR900001987B1 KR1019860006353A KR860006353A KR900001987B1 KR 900001987 B1 KR900001987 B1 KR 900001987B1 KR 1019860006353 A KR1019860006353 A KR 1019860006353A KR 860006353 A KR860006353 A KR 860006353A KR 900001987 B1 KR900001987 B1 KR 900001987B1
Authority
KR
South Korea
Prior art keywords
ridges
plcc
solvent
ridge
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019860006353A
Other languages
English (en)
Korean (ko)
Other versions
KR870002643A (ko
Inventor
가즈또 쯔지
쯔요시 아오끼
미찌오 오노
리끼오 스지우라
Original Assignee
후지쓰가부시끼가이샤
야마모도 다꾸마
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지쓰가부시끼가이샤, 야마모도 다꾸마 filed Critical 후지쓰가부시끼가이샤
Publication of KR870002643A publication Critical patent/KR870002643A/ko
Application granted granted Critical
Publication of KR900001987B1 publication Critical patent/KR900001987B1/ko
Expired legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1019860006353A 1985-08-10 1986-08-01 집적회로용 패케이지 Expired KR900001987B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1985122952U JPH0325410Y2 (enExample) 1985-08-10 1985-08-10
JP60-122952 1985-08-10

Publications (2)

Publication Number Publication Date
KR870002643A KR870002643A (ko) 1987-04-06
KR900001987B1 true KR900001987B1 (ko) 1990-03-30

Family

ID=14848683

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860006353A Expired KR900001987B1 (ko) 1985-08-10 1986-08-01 집적회로용 패케이지

Country Status (5)

Country Link
US (1) US4724280A (enExample)
EP (1) EP0212521B1 (enExample)
JP (1) JPH0325410Y2 (enExample)
KR (1) KR900001987B1 (enExample)
DE (1) DE3679473D1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5005070A (en) * 1988-12-19 1991-04-02 Hewlett-Packard Company Soldering interconnect method and apparatus for semiconductor packages
US4989069A (en) * 1990-01-29 1991-01-29 Motorola, Inc. Semiconductor package having leads that break-away from supports
US6072239A (en) * 1995-11-08 2000-06-06 Fujitsu Limited Device having resin package with projections
US6159770A (en) * 1995-11-08 2000-12-12 Fujitsu Limited Method and apparatus for fabricating semiconductor device
US6329711B1 (en) 1995-11-08 2001-12-11 Fujitsu Limited Semiconductor device and mounting structure
US6376921B1 (en) 1995-11-08 2002-04-23 Fujitsu Limited Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
JP3026426B2 (ja) * 1996-08-29 2000-03-27 沖電気工業株式会社 樹脂封止型半導体装置とその製造方法及びその金型構造
JP3842444B2 (ja) 1998-07-24 2006-11-08 富士通株式会社 半導体装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
US4089575A (en) * 1976-09-27 1978-05-16 Amp Incorporated Connector for connecting a circuit element to the surface of a substrate
US4495376A (en) * 1981-07-27 1985-01-22 Texas Instruments Incorporated Carrier for integrated circuit
US4465898A (en) * 1981-07-27 1984-08-14 Texas Instruments Incorporated Carrier for integrated circuit
US4463217A (en) * 1981-09-14 1984-07-31 Texas Instruments Incorporated Plastic surface mounted high pinout integrated circuit package
JPS58169948A (ja) * 1982-03-30 1983-10-06 Fujitsu Ltd 樹脂封止型半導体装置

Also Published As

Publication number Publication date
US4724280A (en) 1988-02-09
DE3679473D1 (de) 1991-07-04
JPH0325410Y2 (enExample) 1991-06-03
JPS6249245U (enExample) 1987-03-26
EP0212521A1 (en) 1987-03-04
EP0212521B1 (en) 1991-05-29
KR870002643A (ko) 1987-04-06

Similar Documents

Publication Publication Date Title
US5886398A (en) Molded laminate package with integral mold gate
KR910007103B1 (ko) 도선형성 및 도선 없는 부품에 도선을 접착시키는 방법
KR900007230B1 (ko) 반도체 장치용 리드프레임
KR900001987B1 (ko) 집적회로용 패케이지
KR890013754A (ko) 면내장 플라스틱 패키지형 반도체 집적회로 장치 및 그 제조방법과 그 내장방법 및 내장구조
EP0553463B1 (en) Electronic package with enhanced heat sinking and method of making same
US5981873A (en) Printed circuit board for ball grid array semiconductor package
EP0548496A1 (en) A mold and a method for manufacturing semiconductor devices of plastics incorporating an exposed heat sink of metal for inspecting the soldered joint
WO1987004008A1 (en) Lead finishing for a surface mount package
KR100406499B1 (ko) 반도체패키지의 몰딩장비 및 이를 이용한 몰딩방법
KR900003885Y1 (ko) 집적회로용 패키지
JPS58134454A (ja) リ−ドボンデイング構造
KR100439188B1 (ko) 반도체 패키지 몰딩장치
JPH04298094A (ja) 電子部品の樹脂封止実装方法
JPH04290237A (ja) プラスチックｉｃパッケージの成形方法
KR940005712B1 (ko) 잭 타입 아이씨 패키지(jack-type ic package)
JPH0637127A (ja) 半導体パッケージ及びその製造方法
JPH0364049A (ja) 混成集積回路装置
JPH09260828A (ja) 電子部品
KR960002091B1 (ko) 반도체 패키지
KR960005385Y1 (ko) 에폭시 몰딩용 지그
KR20090049730A (ko) 반도체 몰드금형의 세정용 더미
JPH0837366A (ja) 電子部品搭載用基板の半田接合方法及びその半田接合装置
JPH11265965A (ja) 混成集積回路装置およびその製造方法
JPH0513484A (ja) 半導体装置の製造方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

St.27 status event code: A-2-2-Q10-Q13-nap-PG1605

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 19950304

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 19960331

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 19960331

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000