JPS54116186A - Integrated circuit and method of fabricating same - Google Patents

Integrated circuit and method of fabricating same

Info

Publication number
JPS54116186A
JPS54116186A JP6443478A JP6443478A JPS54116186A JP S54116186 A JPS54116186 A JP S54116186A JP 6443478 A JP6443478 A JP 6443478A JP 6443478 A JP6443478 A JP 6443478A JP S54116186 A JPS54116186 A JP S54116186A
Authority
JP
Japan
Prior art keywords
integrated circuit
fabricating same
fabricating
same
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6443478A
Other languages
Japanese (ja)
Other versions
JPH0113222B2 (en
Inventor
Jiei Zashio Jiyon
Shii Rai Hangu
Toshishige Andou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JPS54116186A publication Critical patent/JPS54116186A/en
Publication of JPH0113222B2 publication Critical patent/JPH0113222B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits
    • H01L27/11803—Masterslice integrated circuits using field effect technology
    • H01L27/11807—CMOS gate arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP6443478A 1977-05-31 1978-05-31 Integrated circuit and method of fabricating same Granted JPS54116186A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US80190777A 1977-05-31 1977-05-31
US84747877A 1977-11-01 1977-11-01

Publications (2)

Publication Number Publication Date
JPS54116186A true JPS54116186A (en) 1979-09-10
JPH0113222B2 JPH0113222B2 (en) 1989-03-03

Family

ID=27122394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6443478A Granted JPS54116186A (en) 1977-05-31 1978-05-31 Integrated circuit and method of fabricating same

Country Status (6)

Country Link
JP (1) JPS54116186A (en)
CA (1) CA1106980A (en)
DE (1) DE2823555A1 (en)
FR (1) FR2393427A1 (en)
GB (1) GB1604550A (en)
NL (1) NL185431C (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5591856A (en) * 1978-12-29 1980-07-11 Ibm Semiconductor integrated circuit chip structure
JPS57114269A (en) * 1980-12-29 1982-07-16 Ibm Method of designing multibus circuit
JPS5832445A (en) * 1981-08-20 1983-02-25 Nec Corp Integrated circuit device and manufacture thereof
JPS5857749A (en) * 1981-10-01 1983-04-06 Seiko Epson Corp Semiconductor device
JP2020174223A (en) * 2020-07-28 2020-10-22 ソニー株式会社 Semiconductor integrated circuit
USRE48831E1 (en) 2009-08-28 2021-11-23 Sony Group Corporation Semiconductor integrated circuit

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495834A1 (en) * 1980-12-05 1982-06-11 Cii Honeywell Bull INTEGRATED CIRCUIT DEVICE OF HIGH DENSITY
JPS5890758A (en) * 1981-11-25 1983-05-30 Mitsubishi Electric Corp Complementary type integrated circuit device
JPS58111347A (en) * 1981-12-24 1983-07-02 Matsushita Electric Ind Co Ltd Semiconductor device
JPH0669142B2 (en) * 1983-04-15 1994-08-31 株式会社日立製作所 Semiconductor integrated circuit device
US4737836A (en) * 1983-12-30 1988-04-12 International Business Machines Corporation VLSI integrated circuit having parallel bonding areas
JPH0758761B2 (en) * 1983-12-30 1995-06-21 インターナショナル・ビジネス・マシーンズ・コーポレーション Semiconductor integrated circuit chip
KR910005605B1 (en) * 1987-06-08 1991-07-31 Fujitsu Ltd Master-slice type semiconductor device imbeded multi gate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50134385A (en) * 1974-04-09 1975-10-24
JPS5314469U (en) * 1976-07-16 1978-02-06

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3983619A (en) * 1968-01-26 1976-10-05 Hitachi, Ltd. Large scale integrated circuit array of unit cells and method of manufacturing same
JPS492796B1 (en) * 1969-02-28 1974-01-22
NL176029C (en) * 1973-02-01 1985-02-01 Philips Nv INTEGRATED LOGIC CIRCUIT WITH COMPLEMENTARY TRANSISTORS.
GB1440512A (en) * 1973-04-30 1976-06-23 Rca Corp Universal array using complementary transistors
JPS5314469B2 (en) * 1974-05-17 1978-05-17
US3999214A (en) * 1974-06-26 1976-12-21 Ibm Corporation Wireable planar integrated circuit chip structure
CA1024661A (en) * 1974-06-26 1978-01-17 International Business Machines Corporation Wireable planar integrated circuit chip structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50134385A (en) * 1974-04-09 1975-10-24
JPS5314469U (en) * 1976-07-16 1978-02-06

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5591856A (en) * 1978-12-29 1980-07-11 Ibm Semiconductor integrated circuit chip structure
JPS57114269A (en) * 1980-12-29 1982-07-16 Ibm Method of designing multibus circuit
JPS5832445A (en) * 1981-08-20 1983-02-25 Nec Corp Integrated circuit device and manufacture thereof
JPS5857749A (en) * 1981-10-01 1983-04-06 Seiko Epson Corp Semiconductor device
USRE48831E1 (en) 2009-08-28 2021-11-23 Sony Group Corporation Semiconductor integrated circuit
JP2020174223A (en) * 2020-07-28 2020-10-22 ソニー株式会社 Semiconductor integrated circuit

Also Published As

Publication number Publication date
FR2393427A1 (en) 1978-12-29
NL7805833A (en) 1978-12-04
DE2823555A1 (en) 1978-12-07
JPH0113222B2 (en) 1989-03-03
CA1106980A (en) 1981-08-11
FR2393427B1 (en) 1983-09-09
GB1604550A (en) 1981-12-09
NL185431B (en) 1989-11-01
NL185431C (en) 1990-04-02

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