JPS53104168A - Semiconductor pellet bonding method - Google Patents

Semiconductor pellet bonding method

Info

Publication number
JPS53104168A
JPS53104168A JP1820077A JP1820077A JPS53104168A JP S53104168 A JPS53104168 A JP S53104168A JP 1820077 A JP1820077 A JP 1820077A JP 1820077 A JP1820077 A JP 1820077A JP S53104168 A JPS53104168 A JP S53104168A
Authority
JP
Japan
Prior art keywords
bonding method
semiconductor pellet
pellet bonding
wafer
pellets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1820077A
Other languages
English (en)
Inventor
Tsutomu Mimata
Masakazu Ozawa
Kaoru Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1820077A priority Critical patent/JPS53104168A/ja
Publication of JPS53104168A publication Critical patent/JPS53104168A/ja
Pending legal-status Critical Current

Links

JP1820077A 1977-02-23 1977-02-23 Semiconductor pellet bonding method Pending JPS53104168A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1820077A JPS53104168A (en) 1977-02-23 1977-02-23 Semiconductor pellet bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1820077A JPS53104168A (en) 1977-02-23 1977-02-23 Semiconductor pellet bonding method

Publications (1)

Publication Number Publication Date
JPS53104168A true JPS53104168A (en) 1978-09-11

Family

ID=11964984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1820077A Pending JPS53104168A (en) 1977-02-23 1977-02-23 Semiconductor pellet bonding method

Country Status (1)

Country Link
JP (1) JPS53104168A (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS583240A (ja) * 1981-06-29 1983-01-10 Fujitsu Ltd 集積回路装置の製造方法
JPS58103150A (ja) * 1981-12-16 1983-06-20 Matsushita Electric Ind Co Ltd 半導体基板の製造方法
JPS58103151A (ja) * 1981-12-16 1983-06-20 Matsushita Electric Ind Co Ltd 半導体基板の検査方法
JPS58106842A (ja) * 1981-12-18 1983-06-25 Matsushita Electric Ind Co Ltd 半導体装置の検査方法
JPS61100941A (ja) * 1984-10-23 1986-05-19 Hitachi Ltd 半導体素子の検査データ分析装置
JPS6276728A (ja) * 1985-09-30 1987-04-08 Toshiba Corp 半導体ペレツトマウント装置
JPS62169342A (ja) * 1986-01-21 1987-07-25 Mitsubishi Electric Corp メモリｉｃテスト装置
JPH01236640A (ja) * 1988-03-17 1989-09-21 Tokyo Electron Ltd 半導体チップの外観検査装置
JPH10229088A (ja) * 1997-02-17 1998-08-25 Fujitsu Ltd 半導体部材の検査方法及び装置及び半導体製造装置及び半導体部材
JP2006128336A (ja) * 2004-10-28 2006-05-18 New Japan Radio Co Ltd 半導体装置の検査方法

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6329822B2 (ja) * 1981-06-29 1988-06-15 Fujitsu Ltd
JPS583240A (ja) * 1981-06-29 1983-01-10 Fujitsu Ltd 集積回路装置の製造方法
JPS58103150A (ja) * 1981-12-16 1983-06-20 Matsushita Electric Ind Co Ltd 半導体基板の製造方法
JPS58103151A (ja) * 1981-12-16 1983-06-20 Matsushita Electric Ind Co Ltd 半導体基板の検査方法
JPS58106842A (ja) * 1981-12-18 1983-06-25 Matsushita Electric Ind Co Ltd 半導体装置の検査方法
JPS6152571B2 (ja) * 1981-12-18 1986-11-13 Matsushita Electric Ind Co Ltd
JPS61100941A (ja) * 1984-10-23 1986-05-19 Hitachi Ltd 半導体素子の検査データ分析装置
JPH0370903B2 (ja) * 1984-10-23 1991-11-11 Hitachi Ltd
JPS6276728A (ja) * 1985-09-30 1987-04-08 Toshiba Corp 半導体ペレツトマウント装置
JPH0812879B2 (ja) * 1985-09-30 1996-02-07 株式会社東芝 半導体ペレットマウント装置
JPS62169342A (ja) * 1986-01-21 1987-07-25 Mitsubishi Electric Corp メモリｉｃテスト装置
JPH0618230B2 (ja) * 1986-01-21 1994-03-09 三菱電機株式会社 メモリｉｃテスト装置
JPH01236640A (ja) * 1988-03-17 1989-09-21 Tokyo Electron Ltd 半導体チップの外観検査装置
JPH10229088A (ja) * 1997-02-17 1998-08-25 Fujitsu Ltd 半導体部材の検査方法及び装置及び半導体製造装置及び半導体部材
JP2006128336A (ja) * 2004-10-28 2006-05-18 New Japan Radio Co Ltd 半導体装置の検査方法

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