JPH1135893A - シート状ホットメルト接着剤、および半導体装置 - Google Patents

シート状ホットメルト接着剤、および半導体装置

Info

Publication number
JPH1135893A
JPH1135893A JP9197914A JP19791497A JPH1135893A JP H1135893 A JPH1135893 A JP H1135893A JP 9197914 A JP9197914 A JP 9197914A JP 19791497 A JP19791497 A JP 19791497A JP H1135893 A JPH1135893 A JP H1135893A
Authority
JP
Japan
Prior art keywords
sheet
melt adhesive
hot
semiconductor device
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9197914A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1135893A5 (https=
Inventor
Kimio Yamakawa
君男 山川
Minoru Isshiki
実 一色
Yoshiko Otani
淑子 大谷
Katsutoshi Mine
勝利 峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26478770&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH1135893(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Dow Corning Toray Silicone Co Ltd filed Critical Dow Corning Toray Silicone Co Ltd
Priority to JP9197914A priority Critical patent/JPH1135893A/ja
Priority to US09/082,889 priority patent/US6231974B1/en
Publication of JPH1135893A publication Critical patent/JPH1135893A/ja
Priority to US09/812,860 priority patent/US6498400B2/en
Publication of JPH1135893A5 publication Critical patent/JPH1135893A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07339—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by cooling, e.g. thermoplastics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
JP9197914A 1997-05-22 1997-07-08 シート状ホットメルト接着剤、および半導体装置 Pending JPH1135893A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP9197914A JPH1135893A (ja) 1997-05-22 1997-07-08 シート状ホットメルト接着剤、および半導体装置
US09/082,889 US6231974B1 (en) 1997-05-22 1998-05-21 Hot-melt adhesive sheet and semiconductor devices
US09/812,860 US6498400B2 (en) 1997-05-22 2001-03-21 Semiconductor devices

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9-148642 1997-05-22
JP14864297 1997-05-22
JP9197914A JPH1135893A (ja) 1997-05-22 1997-07-08 シート状ホットメルト接着剤、および半導体装置

Publications (2)

Publication Number Publication Date
JPH1135893A true JPH1135893A (ja) 1999-02-09
JPH1135893A5 JPH1135893A5 (https=) 2005-05-12

Family

ID=26478770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9197914A Pending JPH1135893A (ja) 1997-05-22 1997-07-08 シート状ホットメルト接着剤、および半導体装置

Country Status (2)

Country Link
US (2) US6231974B1 (https=)
JP (1) JPH1135893A (https=)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001019936A (ja) * 1999-07-08 2001-01-23 Dow Corning Toray Silicone Co Ltd 接着剤、および半導体装置
JP2005244189A (ja) * 2004-01-27 2005-09-08 Sekisui Chem Co Ltd 半導体チップ接合用接着性樹脂シート及び半導体装置
JP2007227950A (ja) * 2000-01-19 2007-09-06 Hitachi Chem Co Ltd 半導体用接着フィルム、半導体用接着フィルム付きリードフレーム及びこれを用いた半導体装置
JP2009054893A (ja) * 2007-08-28 2009-03-12 Panasonic Electric Works Co Ltd 発光装置
JP2010162828A (ja) * 2009-01-19 2010-07-29 Kanematsu Nnk Corp 蓄光剤入りの木材及び蓄光剤入り木材の製造方法
JP2011083895A (ja) * 2009-10-13 2011-04-28 Toray Ind Inc シート接合用熱接着フィルム
JP2012126762A (ja) * 2010-12-13 2012-07-05 Sekisui Chem Co Ltd 熱伝導性接着剤
US10598408B2 (en) 2014-02-17 2020-03-24 Savo-Solar Oy Solar thermal absorber element
JP2021512039A (ja) * 2018-01-31 2021-05-13 サン−ゴバン グラス フランス 電気的に制御可能な装置を有する積層グレージング及びその製造方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030038356A1 (en) * 2001-08-24 2003-02-27 Derderian James M Semiconductor devices including stacking spacers thereon, assemblies including the semiconductor devices, and methods
DE10151036A1 (de) * 2001-10-16 2003-05-08 Siemens Ag Isolator für ein organisches Elektronikbauteil
US20060255446A1 (en) * 2001-10-26 2006-11-16 Staktek Group, L.P. Stacked modules and method
US7105360B2 (en) * 2002-03-08 2006-09-12 International Business Machines Corporation Low temperature melt-processing of organic-inorganic hybrid
US6919646B2 (en) * 2002-03-12 2005-07-19 Nec Electronics Corporation Semiconductor device with contacting electrodes
US20050121806A1 (en) * 2003-12-04 2005-06-09 White Electronic Designs Corporation Method for attaching circuit elements
JP4839041B2 (ja) * 2005-08-29 2011-12-14 東レ・ダウコーニング株式会社 絶縁性液状ダイボンディング剤および半導体装置
US7696056B2 (en) 2008-05-02 2010-04-13 Micron Technology, Inc. Methods of forming capacitors
US7618874B1 (en) * 2008-05-02 2009-11-17 Micron Technology, Inc. Methods of forming capacitors
KR20140113717A (ko) * 2012-02-15 2014-09-24 코니카 미놀타 가부시키가이샤 기능성 필름 및 그의 제조 방법, 및 상기 기능성 필름을 포함하는 전자 디바이스
JP2018537395A (ja) 2015-11-24 2018-12-20 コーニング インコーポレイテッド 粒子膜開始薄肉レーザ溶接部を有する封止デバイスハウジングおよび関連の方法
US10786651B2 (en) 2017-03-07 2020-09-29 Talon Medical, LLC Steerable guide catheter
WO2023083472A1 (de) * 2021-11-15 2023-05-19 Lohmann Gmbh & Co. Kg Klebeband

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4624724A (en) 1985-01-17 1986-11-25 General Electric Company Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base
US5670251A (en) * 1990-02-14 1997-09-23 Particle Interconnect Corporation Patternable particle filled adhesive matrix for forming patterned structures between joined surfaces
US5538771A (en) * 1991-06-28 1996-07-23 Furukawa Electric Co., Ltd. Semiconductor wafer-securing adhesive tape
US5523137A (en) * 1991-07-24 1996-06-04 Tomoegawa Paper Co., Ltd. Adhesive paper for tape automated bonding
US5707730A (en) * 1993-12-20 1998-01-13 Tomoegawa Paper Co. Ltd. Adhesive for semiconductor device and reinforcing material using the same
JP2896754B2 (ja) * 1995-06-08 1999-05-31 株式会社巴川製紙所 電子部品用接着テープ
US5710097A (en) * 1996-06-27 1998-01-20 Minnesota Mining And Manufacturing Company Process and materials for imagewise placement of uniform spacers in flat panel displays

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001019936A (ja) * 1999-07-08 2001-01-23 Dow Corning Toray Silicone Co Ltd 接着剤、および半導体装置
JP2007227950A (ja) * 2000-01-19 2007-09-06 Hitachi Chem Co Ltd 半導体用接着フィルム、半導体用接着フィルム付きリードフレーム及びこれを用いた半導体装置
JP2005244189A (ja) * 2004-01-27 2005-09-08 Sekisui Chem Co Ltd 半導体チップ接合用接着性樹脂シート及び半導体装置
JP2009054893A (ja) * 2007-08-28 2009-03-12 Panasonic Electric Works Co Ltd 発光装置
JP2010162828A (ja) * 2009-01-19 2010-07-29 Kanematsu Nnk Corp 蓄光剤入りの木材及び蓄光剤入り木材の製造方法
JP2011083895A (ja) * 2009-10-13 2011-04-28 Toray Ind Inc シート接合用熱接着フィルム
JP2012126762A (ja) * 2010-12-13 2012-07-05 Sekisui Chem Co Ltd 熱伝導性接着剤
US10598408B2 (en) 2014-02-17 2020-03-24 Savo-Solar Oy Solar thermal absorber element
JP2021512039A (ja) * 2018-01-31 2021-05-13 サン−ゴバン グラス フランス 電気的に制御可能な装置を有する積層グレージング及びその製造方法

Also Published As

Publication number Publication date
US20010018124A1 (en) 2001-08-30
US6231974B1 (en) 2001-05-15
US6498400B2 (en) 2002-12-24

Similar Documents

Publication Publication Date Title
JPH1135893A (ja) シート状ホットメルト接着剤、および半導体装置
US6017776A (en) Method of attaching a leadframe to singulated semiconductor dice
EP0332402B1 (en) Connection construction and method of manufacturing the same
US5989942A (en) Method for fabricating semiconductor device
CN1327476C (zh) 半导体器件及其制造方法
JP2001019936A (ja) 接着剤、および半導体装置
US7169648B2 (en) Process for producing a semiconductor device
JP3225906B2 (ja) 表面弾性波素子の実装構造および実装方法
KR20010049733A (ko) 접착제 및 반도체 장치
JPS58207645A (ja) 半導体装置
JP2806348B2 (ja) 半導体素子の実装構造及びその製造方法
KR100614564B1 (ko) 언더필 수지와 초음파를 이용한 칩 범프 및 기판 패드의접합방법
JPS62132331A (ja) 半導体装置の製造方法
JPH012331A (ja) 半導体装置の製造方法
JP3764137B2 (ja) ヒートシンクの実装方法
JPH02101753A (ja) 半導体チップの取付構造
EP0687000A1 (en) Method for bonding integrated circuit chips to substrates
KR20040045388A (ko) 반도체 패키지와 그의 제조방법
JP3490990B2 (ja) フリップチップ実装方法
JPH04150061A (ja) 半導体装置
JPH0360135A (ja) 半導体装置
JPH08148612A (ja) 半導体装置およびその製造方法
Czarnowski et al. Evaluation of area bonding conductive adhesives for flip chip attach of area bonded die
JP2519903B2 (ja) 半導体装置の製造方法
JP2000223532A (ja) Ｉｃチップの接続方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040625

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040625

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060526

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060606

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20061017