JPH1064714A5 - - Google Patents

Info

Publication number
JPH1064714A5
JPH1064714A5 JP1996222437A JP22243796A JPH1064714A5 JP H1064714 A5 JPH1064714 A5 JP H1064714A5 JP 1996222437 A JP1996222437 A JP 1996222437A JP 22243796 A JP22243796 A JP 22243796A JP H1064714 A5 JPH1064714 A5 JP H1064714A5
Authority
JP
Japan
Prior art keywords
emi
active element
control component
component according
oxide coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1996222437A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1064714A (ja
JP3608063B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP22243796A external-priority patent/JP3608063B2/ja
Priority to JP22243796A priority Critical patent/JP3608063B2/ja
Priority to CNB971911215A priority patent/CN1154125C/zh
Priority to US09/065,030 priority patent/US6310285B1/en
Priority to PCT/JP1997/002940 priority patent/WO1998008234A1/ja
Priority to KR10-1998-0702877A priority patent/KR100453982B1/ko
Priority to EP97935870A priority patent/EP0859378B1/en
Priority to DE69719950T priority patent/DE69719950T2/de
Priority to TW086112823A priority patent/TW354843B/zh
Publication of JPH1064714A publication Critical patent/JPH1064714A/ja
Publication of JPH1064714A5 publication Critical patent/JPH1064714A5/ja
Publication of JP3608063B2 publication Critical patent/JP3608063B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP22243796A 1996-08-23 1996-08-23 Ｅｍｉ対策部品及びそれを備えた能動素子 Expired - Lifetime JP3608063B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP22243796A JP3608063B2 (ja) 1996-08-23 1996-08-23 Ｅｍｉ対策部品及びそれを備えた能動素子
DE69719950T DE69719950T2 (de) 1996-08-23 1997-08-25 Emi schutzteil und vorrichtung damit
US09/065,030 US6310285B1 (en) 1996-08-23 1997-08-25 EMI preventive part and active device with the same
PCT/JP1997/002940 WO1998008234A1 (en) 1996-08-23 1997-08-25 Emi preventive part and active device with the same
KR10-1998-0702877A KR100453982B1 (ko) 1996-08-23 1997-08-25 Emi방지부품및그를구비한능동소자
EP97935870A EP0859378B1 (en) 1996-08-23 1997-08-25 Emi preventive part and active device with the same
CNB971911215A CN1154125C (zh) 1996-08-23 1997-08-25 抗电磁干扰元件及拥有该元件的有源器件
TW086112823A TW354843B (en) 1996-08-23 1997-09-05 Anti EMI component and active device having it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22243796A JP3608063B2 (ja) 1996-08-23 1996-08-23 Ｅｍｉ対策部品及びそれを備えた能動素子

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004010254A Division JP2004221602A (ja) 2004-01-19 2004-01-19 Ｅｍｉ対策部品及びそれを備えた能動素子

Publications (3)

Publication Number Publication Date
JPH1064714A JPH1064714A (ja) 1998-03-06
JPH1064714A5 true JPH1064714A5 (enExample) 2004-08-26
JP3608063B2 JP3608063B2 (ja) 2005-01-05

Family

ID=16782392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22243796A Expired - Lifetime JP3608063B2 (ja) 1996-08-23 1996-08-23 Ｅｍｉ対策部品及びそれを備えた能動素子

Country Status (8)

Country Link
US (1) US6310285B1 (enExample)
EP (1) EP0859378B1 (enExample)
JP (1) JP3608063B2 (enExample)
KR (1) KR100453982B1 (enExample)
CN (1) CN1154125C (enExample)
DE (1) DE69719950T2 (enExample)
TW (1) TW354843B (enExample)
WO (1) WO1998008234A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6507101B1 (en) * 1999-03-26 2003-01-14 Hewlett-Packard Company Lossy RF shield for integrated circuits
JP2001168575A (ja) * 1999-12-08 2001-06-22 Sony Corp 電波吸収体及びその製造方法
JP2001210518A (ja) * 2000-01-24 2001-08-03 Tokin Corp 磁気損失材料とその製造方法およびそれを用いた高周波電流抑制体
JP2001223493A (ja) * 2000-02-08 2001-08-17 Sony Corp 電波吸収体
JP2001291989A (ja) * 2000-04-04 2001-10-19 Tokin Corp 金属筐体を備えた電子部品
JP4271825B2 (ja) * 2000-04-04 2009-06-03 Ｎｅｃトーキン株式会社 半導体ベアチップおよび半導体ウエーハ
JP4398056B2 (ja) * 2000-04-04 2010-01-13 Ｎｅｃトーキン株式会社 樹脂モールド体
JP2002319787A (ja) 2001-02-15 2002-10-31 Sumitomo Electric Ind Ltd 電磁波吸収材料
JP4883855B2 (ja) * 2001-09-03 2012-02-22 京セラ株式会社 電磁波吸収体の製造方法および電磁波吸収体
US6846985B2 (en) 2002-01-22 2005-01-25 Nanoset, Llc Magnetically shielded assembly
US6906256B1 (en) * 2002-01-22 2005-06-14 Nanoset, Llc Nanomagnetic shielding assembly
JP2003273571A (ja) * 2002-03-18 2003-09-26 Fujitsu Ltd 素子間干渉電波シールド型高周波モジュール
JP2005128771A (ja) * 2003-10-23 2005-05-19 Fujitsu Ltd データファイルシステム、データアクセスサーバ、およびデータアクセスプログラム
US20060285851A1 (en) * 2005-06-16 2006-12-21 Jiaxi Kan Optical transceivers and methods to reduce interference in optical transceivers
CN101521193A (zh) * 2008-02-28 2009-09-02 乾坤科技股份有限公司 电子封装结构
JP5512566B2 (ja) * 2011-01-31 2014-06-04 株式会社東芝 半導体装置
US9881877B2 (en) 2016-03-31 2018-01-30 Tdk Corporation Electronic circuit package using composite magnetic sealing material
US10242954B2 (en) 2016-12-01 2019-03-26 Tdk Corporation Electronic circuit package having high composite shielding effect
US9972579B1 (en) 2016-11-16 2018-05-15 Tdk Corporation Composite magnetic sealing material and electronic circuit package using the same
US9818518B2 (en) 2016-03-31 2017-11-14 Tdk Corporation Composite magnetic sealing material
US9907179B2 (en) 2016-04-25 2018-02-27 Tdk Corporation Electronic circuit package
US10403582B2 (en) 2017-06-23 2019-09-03 Tdk Corporation Electronic circuit package using composite magnetic sealing material

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5391397A (en) * 1977-01-21 1978-08-11 Hitachi Ltd Material with high permeability
US5506054A (en) * 1982-01-13 1996-04-09 The United States Of America As Represented By The Secretary Of The Air Force Ultra high frequency absorbing material capable of resisting a high temperature environment and method for fabricating it
JP2687124B2 (ja) * 1987-09-29 1997-12-08 ティーディーケイ株式会社 磁気シールド用粉末及び磁気シールド材
JPH04360594A (ja) * 1991-06-07 1992-12-14 Toshiba Corp ノイズ抑制素子およびノイズ抑制プリント基板
US5789064A (en) * 1992-02-28 1998-08-04 Valente; Thomas J. Electromagnetic radiation absorbing and shielding compositions
JPH05304018A (ja) * 1992-04-28 1993-11-16 Sony Corp モールド材料及びその製造方法
CA2092371C (en) * 1993-03-24 1999-06-29 Boris L. Livshits Integrated circuit packaging
US5508888A (en) * 1994-05-09 1996-04-16 At&T Global Information Solutions Company Electronic component lead protector
EP0692840A1 (en) 1994-07-11 1996-01-17 Nippon Paint Co., Ltd. Wide bandwidth electromagnetic wave absorbing material
JPH08213226A (ja) * 1995-02-03 1996-08-20 Murata Mfg Co Ltd 樹脂成形品
JPH0927693A (ja) * 1995-07-12 1997-01-28 Tdk Corp 磁気シールド用軟磁性粉末および磁気シールド材
JPH0993034A (ja) 1995-09-22 1997-04-04 Tokin Corp 複合磁性体及びその製造方法ならびに電磁干渉抑制体

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