TW354843B - Anti EMI component and active device having it - Google Patents

Anti EMI component and active device having it

Info

Publication number
TW354843B
TW354843B TW086112823A TW86112823A TW354843B TW 354843 B TW354843 B TW 354843B TW 086112823 A TW086112823 A TW 086112823A TW 86112823 A TW86112823 A TW 86112823A TW 354843 B TW354843 B TW 354843B
Authority
TW
Taiwan
Prior art keywords
active device
emi component
countermeasure component
emi countermeasure
anti emi
Prior art date
Application number
TW086112823A
Other languages
English (en)
Chinese (zh)
Inventor
Mituharu Sato
Koji Kamei
Shigeyoshi Yoshida
Original Assignee
Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp filed Critical Tokin Corp
Application granted granted Critical
Publication of TW354843B publication Critical patent/TW354843B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/33—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials mixtures of metallic and non-metallic particles; metallic particles having oxide skin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526—Electromagnetic shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/281—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials
    • H10W42/287—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials materials for magnetic shielding, e.g. ferromagnetic materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter
    • Y10T428/24413—Metal or metal compound

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Soft Magnetic Materials (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Aerials With Secondary Devices (AREA)
  • Hard Magnetic Materials (AREA)
TW086112823A 1996-08-23 1997-09-05 Anti EMI component and active device having it TW354843B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22243796A JP3608063B2 (ja) 1996-08-23 1996-08-23 Ｅｍｉ対策部品及びそれを備えた能動素子

Publications (1)

Publication Number Publication Date
TW354843B true TW354843B (en) 1999-03-21

Family

ID=16782392

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086112823A TW354843B (en) 1996-08-23 1997-09-05 Anti EMI component and active device having it

Country Status (8)

Country Link
US (1) US6310285B1 (enExample)
EP (1) EP0859378B1 (enExample)
JP (1) JP3608063B2 (enExample)
KR (1) KR100453982B1 (enExample)
CN (1) CN1154125C (enExample)
DE (1) DE69719950T2 (enExample)
TW (1) TW354843B (enExample)
WO (1) WO1998008234A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6507101B1 (en) * 1999-03-26 2003-01-14 Hewlett-Packard Company Lossy RF shield for integrated circuits
JP2001168575A (ja) * 1999-12-08 2001-06-22 Sony Corp 電波吸収体及びその製造方法
JP2001210518A (ja) * 2000-01-24 2001-08-03 Tokin Corp 磁気損失材料とその製造方法およびそれを用いた高周波電流抑制体
JP2001223493A (ja) * 2000-02-08 2001-08-17 Sony Corp 電波吸収体
JP4398056B2 (ja) * 2000-04-04 2010-01-13 Ｎｅｃトーキン株式会社 樹脂モールド体
JP2001291989A (ja) * 2000-04-04 2001-10-19 Tokin Corp 金属筐体を備えた電子部品
JP4271825B2 (ja) * 2000-04-04 2009-06-03 Ｎｅｃトーキン株式会社 半導体ベアチップおよび半導体ウエーハ
JP2002319787A (ja) * 2001-02-15 2002-10-31 Sumitomo Electric Ind Ltd 電磁波吸収材料
JP4883855B2 (ja) * 2001-09-03 2012-02-22 京セラ株式会社 電磁波吸収体の製造方法および電磁波吸収体
US6846985B2 (en) 2002-01-22 2005-01-25 Nanoset, Llc Magnetically shielded assembly
US6906256B1 (en) * 2002-01-22 2005-06-14 Nanoset, Llc Nanomagnetic shielding assembly
JP2003273571A (ja) * 2002-03-18 2003-09-26 Fujitsu Ltd 素子間干渉電波シールド型高周波モジュール
JP2005128771A (ja) * 2003-10-23 2005-05-19 Fujitsu Ltd データファイルシステム、データアクセスサーバ、およびデータアクセスプログラム
US20060285851A1 (en) * 2005-06-16 2006-12-21 Jiaxi Kan Optical transceivers and methods to reduce interference in optical transceivers
CN101521193A (zh) * 2008-02-28 2009-09-02 乾坤科技股份有限公司 电子封装结构
JP5512566B2 (ja) * 2011-01-31 2014-06-04 株式会社東芝 半導体装置
US9881877B2 (en) 2016-03-31 2018-01-30 Tdk Corporation Electronic circuit package using composite magnetic sealing material
US9972579B1 (en) * 2016-11-16 2018-05-15 Tdk Corporation Composite magnetic sealing material and electronic circuit package using the same
US9818518B2 (en) 2016-03-31 2017-11-14 Tdk Corporation Composite magnetic sealing material
US10242954B2 (en) 2016-12-01 2019-03-26 Tdk Corporation Electronic circuit package having high composite shielding effect
US9907179B2 (en) 2016-04-25 2018-02-27 Tdk Corporation Electronic circuit package
US10403582B2 (en) 2017-06-23 2019-09-03 Tdk Corporation Electronic circuit package using composite magnetic sealing material

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5391397A (en) * 1977-01-21 1978-08-11 Hitachi Ltd Material with high permeability
US5506054A (en) * 1982-01-13 1996-04-09 The United States Of America As Represented By The Secretary Of The Air Force Ultra high frequency absorbing material capable of resisting a high temperature environment and method for fabricating it
JP2687124B2 (ja) * 1987-09-29 1997-12-08 ティーディーケイ株式会社 磁気シールド用粉末及び磁気シールド材
JPH04360594A (ja) * 1991-06-07 1992-12-14 Toshiba Corp ノイズ抑制素子およびノイズ抑制プリント基板
US5789064A (en) * 1992-02-28 1998-08-04 Valente; Thomas J. Electromagnetic radiation absorbing and shielding compositions
JPH05304018A (ja) * 1992-04-28 1993-11-16 Sony Corp モールド材料及びその製造方法
CA2092371C (en) * 1993-03-24 1999-06-29 Boris L. Livshits Integrated circuit packaging
US5508888A (en) * 1994-05-09 1996-04-16 At&T Global Information Solutions Company Electronic component lead protector
US5770304A (en) 1994-07-11 1998-06-23 Nippon Paint Co., Ltd. Wide bandwidth electromagnetic wave absorbing material
JPH08213226A (ja) * 1995-02-03 1996-08-20 Murata Mfg Co Ltd 樹脂成形品
JPH0927693A (ja) * 1995-07-12 1997-01-28 Tdk Corp 磁気シールド用軟磁性粉末および磁気シールド材
JPH0993034A (ja) 1995-09-22 1997-04-04 Tokin Corp 複合磁性体及びその製造方法ならびに電磁干渉抑制体

Also Published As

Publication number Publication date
JP3608063B2 (ja) 2005-01-05
CN1199494A (zh) 1998-11-18
DE69719950T2 (de) 2003-11-06
JPH1064714A (ja) 1998-03-06
EP0859378A4 (en) 2000-04-12
DE69719950D1 (de) 2003-04-24
EP0859378A1 (en) 1998-08-19
EP0859378B1 (en) 2003-03-19
US6310285B1 (en) 2001-10-30
CN1154125C (zh) 2004-06-16
WO1998008234A1 (en) 1998-02-26
KR20000064288A (ko) 2000-11-06
KR100453982B1 (ko) 2005-04-08

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Legal Events

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MK4A Expiration of patent term of an invention patent