JPH10104174A - 電気接続検査装置 - Google Patents

電気接続検査装置

Info

Publication number
JPH10104174A
JPH10104174A JP9241418A JP24141897A JPH10104174A JP H10104174 A JPH10104174 A JP H10104174A JP 9241418 A JP9241418 A JP 9241418A JP 24141897 A JP24141897 A JP 24141897A JP H10104174 A JPH10104174 A JP H10104174A
Authority
JP
Japan
Prior art keywords
image
ray
linear
cross
detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP9241418A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10104174A5 (OSRAM
Inventor
John A Adams
ジョン・エー・アダムス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JPH10104174A publication Critical patent/JPH10104174A/ja
Publication of JPH10104174A5 publication Critical patent/JPH10104174A5/ja
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G01N23/046—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using tomography, e.g. computed tomography [CT]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G01N23/044—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using laminography or tomosynthesis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/40—Imaging
    • G01N2223/419—Imaging computed tomograph

Landscapes

  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Pulmonology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Theoretical Computer Science (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP9241418A 1996-09-13 1997-09-05 電気接続検査装置 Ceased JPH10104174A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/713,379 US5687209A (en) 1995-04-11 1996-09-13 Automatic warp compensation for laminographic circuit board inspection
US713-379 1996-09-13

Publications (2)

Publication Number Publication Date
JPH10104174A true JPH10104174A (ja) 1998-04-24
JPH10104174A5 JPH10104174A5 (OSRAM) 2005-06-09

Family

ID=24865904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9241418A Ceased JPH10104174A (ja) 1996-09-13 1997-09-05 電気接続検査装置

Country Status (3)

Country Link
US (1) US5687209A (OSRAM)
JP (1) JPH10104174A (OSRAM)
DE (1) DE19723074C2 (OSRAM)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005512707A (ja) * 2001-12-21 2005-05-12 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ オブジェクト内のターゲットの位置を突き止める方法
JP2006275626A (ja) * 2005-03-28 2006-10-12 Nagoya Electric Works Co Ltd Ｘ線検査装置、ｘ線検査方法およびｘ線検査プログラム
WO2009078415A1 (ja) * 2007-12-17 2009-06-25 Uni-Hite System Corporation Ｘ線検査装置および方法
US7723708B2 (en) 2004-07-30 2010-05-25 Canon Kabushiki Kaisha Optical semiconductor device in which an electromagnetic wave is generated in a region of an applied electric field
KR101096366B1 (ko) * 2009-11-27 2011-12-20 한국원자력연구원 스테레오 엑스레이 투과검사 시스템
JP2012503768A (ja) * 2008-09-24 2012-02-09 クロメック リミテッド Ｘ線撮影データ判読
JP2021060204A (ja) * 2019-10-03 2021-04-15 株式会社 システムスクエア 検査装置
JP2023053558A (ja) * 2021-10-01 2023-04-13 株式会社サキコーポレーション 検査装置

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JPH09172299A (ja) * 1995-12-20 1997-06-30 Matsushita Electric Ind Co Ltd 基板認識装置
US5646733A (en) 1996-01-29 1997-07-08 Medar, Inc. Scanning phase measuring method and system for an object at a vision station
US6028910A (en) * 1998-01-19 2000-02-22 Foster-Miller, Inc. High resolution areal tomosynthesis
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US6201850B1 (en) 1999-01-26 2001-03-13 Agilent Technologies, Inc. Enhanced thickness calibration and shading correction for automatic X-ray inspection
US6292530B1 (en) * 1999-04-29 2001-09-18 General Electric Company Method and apparatus for reconstructing image data acquired by a tomosynthesis x-ray imaging system
US7013038B1 (en) * 1999-11-08 2006-03-14 Teradyne, Inc. Method for inspecting a BGA joint
US6996265B1 (en) * 1999-11-08 2006-02-07 Teradyne, Inc. Inspection method utilizing vertical slice imaging
JP3517388B2 (ja) * 2000-06-14 2004-04-12 新光電気工業株式会社 バンプの検査方法及びバンプの検査装置
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US6373917B1 (en) * 2000-08-30 2002-04-16 Agilent Technologies, Inc. Z-axis elimination in an X-ray laminography system using image magnification for Z plane adjustment
US6671349B1 (en) 2000-11-13 2003-12-30 Olganix Corporation Tomosynthesis system and registration method
US6748046B2 (en) * 2000-12-06 2004-06-08 Teradyne, Inc. Off-center tomosynthesis
US7562350B2 (en) * 2000-12-15 2009-07-14 Ricoh Company, Ltd. Processing system and method using recomposable software
US6324249B1 (en) 2001-03-21 2001-11-27 Agilent Technologies, Inc. Electronic planar laminography system and method
DE10160398B4 (de) * 2001-12-10 2004-11-11 Dieffenbacher Gmbh + Co. Kg Verfahren und Vorrichtung zur Prüfung einer Matte aus Biomassepartikeln
US6853744B2 (en) * 2001-12-14 2005-02-08 Agilent Technologies, Inc. System and method for confirming electrical connection defects
US6847900B2 (en) * 2001-12-17 2005-01-25 Agilent Technologies, Inc. System and method for identifying solder joint defects
US6850589B2 (en) * 2002-03-27 2005-02-01 Agilent Technologies, Inc. Tomography of curved surfaces
JP4184694B2 (ja) * 2002-04-05 2008-11-19 株式会社ブリヂストン タイヤのｘ線検査方法及びその装置
US7092484B1 (en) 2002-06-14 2006-08-15 Iowa State University Research Foundation, Inc. Model-assisted reconstruction of volumetric data
WO2004049256A2 (en) * 2002-11-13 2004-06-10 Digitome Corporation Ray tracing kernel calibration
US6738450B1 (en) 2002-12-10 2004-05-18 Agilent Technologies, Inc. System and method for cost-effective classification of an object under inspection
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DE102005020149A1 (de) * 2005-04-29 2006-11-09 Yxlon International X-Ray Gmbh Verfahren zur automatischen Fehlererkennung in Prüfteilen mittels einer Röntgenprüfanlage
US7225051B1 (en) * 2005-08-04 2007-05-29 Magnecomp Corporation Closed-loop feedback for maximizing Cpk in progressive forming operations
US20070189460A1 (en) * 2006-02-15 2007-08-16 Buck Dean C Precise x-ray inspection system
WO2007121989A2 (de) * 2006-04-25 2007-11-01 Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschunge E.V. Vorrichtung und verfahren zum erzeugen einer zweidimensionalen darstellung eines beliebig innerhalb eines objekts angeordneten objektabschnitts
US20080089567A1 (en) * 2006-10-11 2008-04-17 Eliasson Tracy K Artifact reduction in an x-ray imaging system
US7529336B2 (en) * 2007-05-31 2009-05-05 Test Research, Inc. System and method for laminography inspection
US8331525B2 (en) 2007-10-01 2012-12-11 Pratt & Whitney Rocketdyne, Inc. Characteristic X-ray computed laminography system for home made explosives (HME) detection
JP5559471B2 (ja) * 2008-11-11 2014-07-23 浜松ホトニクス株式会社 放射線検出装置、放射線画像取得システム、放射線検査システム、及び放射線検出方法
EP2256069A1 (en) * 2009-05-29 2010-12-01 Mettler-Toledo Safeline X-Ray Limited Conveyor chain for a radiographic inspection system and radiographic inspection system
JP5559551B2 (ja) * 2010-01-19 2014-07-23 株式会社サキコーポレーション 検査装置
WO2012169374A1 (ja) * 2011-06-08 2012-12-13 村田機械株式会社 ワーク処理システム
US9733193B2 (en) * 2015-03-12 2017-08-15 Proton Products International Limited Measurement of industrial products manufactured by extrusion techniques

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005512707A (ja) * 2001-12-21 2005-05-12 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ オブジェクト内のターゲットの位置を突き止める方法
US7723708B2 (en) 2004-07-30 2010-05-25 Canon Kabushiki Kaisha Optical semiconductor device in which an electromagnetic wave is generated in a region of an applied electric field
JP2006275626A (ja) * 2005-03-28 2006-10-12 Nagoya Electric Works Co Ltd Ｘ線検査装置、ｘ線検査方法およびｘ線検査プログラム
WO2009078415A1 (ja) * 2007-12-17 2009-06-25 Uni-Hite System Corporation Ｘ線検査装置および方法
JP2012503768A (ja) * 2008-09-24 2012-02-09 クロメック リミテッド Ｘ線撮影データ判読
JP2014222249A (ja) * 2008-09-24 2014-11-27 クロメック リミテッド Ｘ線撮影データ判読
KR101096366B1 (ko) * 2009-11-27 2011-12-20 한국원자력연구원 스테레오 엑스레이 투과검사 시스템
JP2021060204A (ja) * 2019-10-03 2021-04-15 株式会社 システムスクエア 検査装置
JP2023053558A (ja) * 2021-10-01 2023-04-13 株式会社サキコーポレーション 検査装置

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DE19723074C2 (de) 2002-09-05
US5687209A (en) 1997-11-11

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