JPH09214066A - 一体化レーザ・ベース光源 - Google Patents

一体化レーザ・ベース光源

Info

Publication number
JPH09214066A
JPH09214066A JP9011035A JP1103597A JPH09214066A JP H09214066 A JPH09214066 A JP H09214066A JP 9011035 A JP9011035 A JP 9011035A JP 1103597 A JP1103597 A JP 1103597A JP H09214066 A JPH09214066 A JP H09214066A
Authority
JP
Japan
Prior art keywords
light beam
laser
light
vcsel
intensity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9011035A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09214066A5 (enExample
Inventor
Richard R Baldwin
リチャード・アール・ボールドウイン
Scott W Corzine
スコット・ダブリュ・コルツィン
William D Holland
ウイリアム・ディー・ホーランド
Leif Eric Larson
レイフ・エリック・ラーソン
David M Sears
デイヴィッド・エム・シアーズ
Michael R T Tan
マイケル・アール・ティー・タン
Shih-Yuan Wang
シー−ユアン・ウオン
T Yuen Albert
アルバート・ティー・ユエン
Tao Zhang
タオ・ツァン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24399899&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH09214066(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JPH09214066A publication Critical patent/JPH09214066A/ja
Publication of JPH09214066A5 publication Critical patent/JPH09214066A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H01S5/0262—Photo-diodes, e.g. transceiver devices, bidirectional devices
    • H01S5/0264—Photo-diodes, e.g. transceiver devices, bidirectional devices for monitoring the laser-output
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
JP9011035A 1996-01-25 1997-01-24 一体化レーザ・ベース光源 Pending JPH09214066A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/599,504 US5809050A (en) 1996-01-25 1996-01-25 Integrated controlled intensity laser-based light source using diffraction, scattering and transmission
US599,504 1996-01-25

Publications (2)

Publication Number Publication Date
JPH09214066A true JPH09214066A (ja) 1997-08-15
JPH09214066A5 JPH09214066A5 (enExample) 2004-12-16

Family

ID=24399899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9011035A Pending JPH09214066A (ja) 1996-01-25 1997-01-24 一体化レーザ・ベース光源

Country Status (4)

Country Link
US (1) US5809050A (enExample)
EP (1) EP0786838B1 (enExample)
JP (1) JPH09214066A (enExample)
DE (1) DE69700605D1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004072072A (ja) * 2002-06-10 2004-03-04 Nichia Chem Ind Ltd 半導体レーザ装置
JP2011233549A (ja) * 2010-04-23 2011-11-17 Ricoh Co Ltd 光デバイス、光走査装置及び画像形成装置
JP2012151441A (ja) * 2010-12-28 2012-08-09 Ricoh Co Ltd 光デバイス、光走査装置及び画像形成装置
JP2021190463A (ja) * 2020-05-26 2021-12-13 日亜化学工業株式会社 発光装置

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JPH1051067A (ja) * 1996-04-29 1998-02-20 Motorola Inc 垂直空洞面放出レーザ用反射型パワ−監視システム
US6061374A (en) * 1997-02-07 2000-05-09 Coherent, Inc. Laser diode integrating enclosure and detector
US6027256A (en) * 1997-02-07 2000-02-22 Coherent, Inc. Composite laser diode enclosure and method for making the same
CA2297898A1 (en) * 1997-07-25 1999-02-04 Cielo Communications, Inc. Semiconductor laser power monitoring arrangements and method
CA2298491C (en) 1997-07-25 2009-10-06 Nichia Chemical Industries, Ltd. Nitride semiconductor device
DE19735925A1 (de) * 1997-08-08 1999-02-25 Siemens Ag Optische Sendeeinrichtung
US5943357A (en) * 1997-08-18 1999-08-24 Motorola, Inc. Long wavelength vertical cavity surface emitting laser with photodetector for automatic power control and method of fabrication
JP3792040B2 (ja) * 1998-03-06 2006-06-28 松下電器産業株式会社 双方向光半導体装置
DE19838350B4 (de) 1998-08-14 2004-04-15 Infineon Technologies Ag Optische Sendeeinrichtung
CA2306845C (en) 1998-08-31 2005-05-03 Digital Optics Corporation Diffractive vertical cavity surface emitting laser power monitor and system
US6588949B1 (en) 1998-12-30 2003-07-08 Honeywell Inc. Method and apparatus for hermetically sealing photonic devices
JP3770014B2 (ja) 1999-02-09 2006-04-26 日亜化学工業株式会社 窒化物半導体素子
ATE452445T1 (de) 1999-03-04 2010-01-15 Nichia Corp Nitridhalbleiterlaserelement
WO2000057522A1 (en) * 1999-03-19 2000-09-28 Cielo Communications, Inc. Vcsel power monitoring system using plastic encapsulation techniques
US6272988B1 (en) 1999-04-14 2001-08-14 Heidelberger Druckmaschinen Ag Device for cleaning bearer surfaces on rotating cylinders
US6233263B1 (en) * 1999-06-04 2001-05-15 Bandwidth9 Monitoring and control assembly for wavelength stabilized optical system
US7009692B2 (en) * 1999-08-06 2006-03-07 Lumenis Inc. Arrangement for monitoring the power delivery of a photon channeling element
US6580739B1 (en) 1999-09-02 2003-06-17 Agility Communications, Inc. Integrated opto-electronic wavelength converter assembly
US6624000B1 (en) 1999-09-02 2003-09-23 Agility Communications, Inc. Method for making a monolithic wavelength converter assembly
US6600845B1 (en) * 1999-10-18 2003-07-29 Digital Optics Corporation Integrated parallel transmitter
US6792178B1 (en) 2000-01-12 2004-09-14 Finisar Corporation Fiber optic header with integrated power monitor
DE10003087A1 (de) * 2000-01-25 2001-09-13 Infineon Technologies Ag Anordnung für ein optoelektronisches Sende- und Empfangsmodul
US6888169B2 (en) * 2000-09-29 2005-05-03 Optical Communication Products, Inc. High speed optical subassembly with ceramic carrier
US6526076B2 (en) 2000-12-15 2003-02-25 Agilent Technologies, Inc. Integrated parallel channel optical monitoring for parallel optics transmitter
TW499049U (en) * 2001-08-03 2002-08-11 Hon Hai Prec Ind Co Ltd Light source assembly
US6549687B1 (en) * 2001-10-26 2003-04-15 Lake Shore Cryotronics, Inc. System and method for measuring physical, chemical and biological stimuli using vertical cavity surface emitting lasers with integrated tuner
US6903379B2 (en) * 2001-11-16 2005-06-07 Gelcore Llc GaN based LED lighting extraction efficiency using digital diffractive phase grating
US7061025B2 (en) 2003-03-10 2006-06-13 Mccolloch Lawrence R Optoelectronic device packaging assemblies and methods of making the same
US6888988B2 (en) 2003-03-14 2005-05-03 Agilent Technologies, Inc. Small form factor all-polymer optical device with integrated dual beam path based on total internal reflection optical turn
US6836578B2 (en) * 2003-04-14 2004-12-28 Lake Shore Cryotronics, Inc. System and method for measuring physical stimuli using vertical cavity surface emitting lasers with integrated tuning means
KR100531416B1 (ko) * 2003-09-17 2005-11-29 엘지.필립스 엘시디 주식회사 Ｓｌｓ 장비 및 이를 이용한 실리콘 결정화 방법
US7403640B2 (en) * 2003-10-27 2008-07-22 Hewlett-Packard Development Company, L.P. System and method for employing an object-oriented motion detector to capture images
US7693197B2 (en) * 2003-10-31 2010-04-06 Hewlett-Packard Development Company, L.P. Laser scanning apparatuses, laser scanning methods and article manufacture
DE10354780A1 (de) 2003-11-21 2005-06-30 Schott Ag Refraktiv-diffraktive Hybridlinse, insbesondere zur Strahlformung von Hochleistungsdiodenlasern
US7165896B2 (en) 2004-02-12 2007-01-23 Hymite A/S Light transmitting modules with optical power monitoring
US7333684B2 (en) * 2004-03-25 2008-02-19 Integrated Crystal Technology Incorporated Stack-integrated package of optical transceiver for single core full duplex fiber communications
US7250590B2 (en) * 2004-07-16 2007-07-31 Infineon Technologies Fiber Optics Gmbh Optoelectronic arrangement and a method for controlling the output power of a transmission component
US7286581B2 (en) * 2004-08-20 2007-10-23 Avago Technologies Fiber Ip (Singapore) Pte Ltd Self-monitoring light emitting apparatus
US7850374B2 (en) 2005-01-14 2010-12-14 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optical transmitter module with an integrated lens and method for making the module
US7767947B2 (en) * 2005-09-20 2010-08-03 Downing Jr John P Semiconductor light source with optical feedback
JP2008124428A (ja) * 2006-10-19 2008-05-29 Seiko Epson Corp 光源装置及び画像表示装置
JP2008244101A (ja) * 2007-03-27 2008-10-09 Canon Inc モニタリング方法およびモニタリング機能を有するｖｃｓｅｌアレイ
US7889993B2 (en) * 2007-08-17 2011-02-15 Avago Technologies Fiber Ip (Singapore) Pte. Ltd Optical transceiver module having a front facet reflector and methods for making and using a front facet reflector
TW200947895A (en) * 2008-05-08 2009-11-16 Truelight Corp Tri-wavelength bi-directional fiber communication system
TWI362769B (en) 2008-05-09 2012-04-21 Univ Nat Chiao Tung Light emitting device and fabrication method therefor
JP2013504200A (ja) * 2009-09-04 2013-02-04 スペクトラルス・コーポレイション 周期的に分極された非線形材料の、効率がよくコンパクトな可視マイクロチップレーザ光源
US8483571B2 (en) 2010-06-30 2013-07-09 Avago Technologies General Ip (Singapore) Pte. Ltd. Optical beam splitter for use in an optoelectronic module, and a method for performing optical beam splitting in an optoelectronic module
US8502452B2 (en) 2010-07-28 2013-08-06 Usl Technologies, Llc High-stability light source system and method of manufacturing
KR102452484B1 (ko) * 2017-08-11 2022-10-11 삼성전자주식회사 발광소자 패키지 및 발광소자 패키지 모듈
CN110275381B (zh) * 2019-06-26 2021-09-21 业成科技（成都）有限公司 结构光发射模组及应用其的深度感测设备
US11631963B2 (en) * 2019-09-18 2023-04-18 Freedom Photonics Llc Optical device with coating for operation in multiple environments
JP7075016B2 (ja) * 2019-10-18 2022-05-25 日亜化学工業株式会社 光源装置
WO2021083487A1 (en) * 2019-10-28 2021-05-06 MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. Laser system and method for driving a laser system
US12224387B2 (en) 2020-12-24 2025-02-11 Nichia Corporation Light emitting device
EP4282042A1 (en) * 2021-01-21 2023-11-29 Google LLC Integrated laser package with light intensity monitoring
CN113013722A (zh) * 2021-02-09 2021-06-22 北京航空航天大学 一种小型化激光器模组
CN117724256A (zh) * 2024-01-04 2024-03-19 捷普科技(武汉)有限公司 分光片及光功率监测系统

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004072072A (ja) * 2002-06-10 2004-03-04 Nichia Chem Ind Ltd 半導体レーザ装置
JP2011233549A (ja) * 2010-04-23 2011-11-17 Ricoh Co Ltd 光デバイス、光走査装置及び画像形成装置
JP2012151441A (ja) * 2010-12-28 2012-08-09 Ricoh Co Ltd 光デバイス、光走査装置及び画像形成装置
JP2021190463A (ja) * 2020-05-26 2021-12-13 日亜化学工業株式会社 発光装置
JP2024160395A (ja) * 2020-05-26 2024-11-13 日亜化学工業株式会社 発光装置

Also Published As

Publication number Publication date
EP0786838A3 (en) 1997-10-08
EP0786838B1 (en) 1999-10-13
DE69700605D1 (de) 1999-11-18
EP0786838A2 (en) 1997-07-30
US5809050A (en) 1998-09-15

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