DE69700605D1 - Laserlichtquelle mit streuendem Element - Google Patents
Laserlichtquelle mit streuendem ElementInfo
- Publication number
- DE69700605D1 DE69700605D1 DE69700605T DE69700605T DE69700605D1 DE 69700605 D1 DE69700605 D1 DE 69700605D1 DE 69700605 T DE69700605 T DE 69700605T DE 69700605 T DE69700605 T DE 69700605T DE 69700605 D1 DE69700605 D1 DE 69700605D1
- Authority
- DE
- Germany
- Prior art keywords
- light source
- laser light
- scattering element
- scattering
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0262—Photo-diodes, e.g. transceiver devices, bidirectional devices
- H01S5/0264—Photo-diodes, e.g. transceiver devices, bidirectional devices for monitoring the laser-output
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/02234—Resin-filled housings; the housings being made of resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
- H01S5/423—Arrays of surface emitting lasers having a vertical cavity
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/599,504 US5809050A (en) | 1996-01-25 | 1996-01-25 | Integrated controlled intensity laser-based light source using diffraction, scattering and transmission |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69700605D1 true DE69700605D1 (de) | 1999-11-18 |
Family
ID=24399899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69700605T Expired - Lifetime DE69700605D1 (de) | 1996-01-25 | 1997-01-24 | Laserlichtquelle mit streuendem Element |
Country Status (4)
Country | Link |
---|---|
US (1) | US5809050A (de) |
EP (1) | EP0786838B1 (de) |
JP (1) | JPH09214066A (de) |
DE (1) | DE69700605D1 (de) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1051067A (ja) * | 1996-04-29 | 1998-02-20 | Motorola Inc | 垂直空洞面放出レーザ用反射型パワ−監視システム |
US6061374A (en) * | 1997-02-07 | 2000-05-09 | Coherent, Inc. | Laser diode integrating enclosure and detector |
US6027256A (en) * | 1997-02-07 | 2000-02-22 | Coherent, Inc. | Composite laser diode enclosure and method for making the same |
WO1999005758A1 (en) * | 1997-07-25 | 1999-02-04 | Cielo Communications, Inc. | Semiconductor laser power monitoring arrangements and method |
EP1014455B1 (de) | 1997-07-25 | 2006-07-12 | Nichia Corporation | Halbleitervorrichtung aus einer nitridverbindung |
DE19735925A1 (de) * | 1997-08-08 | 1999-02-25 | Siemens Ag | Optische Sendeeinrichtung |
US5943357A (en) * | 1997-08-18 | 1999-08-24 | Motorola, Inc. | Long wavelength vertical cavity surface emitting laser with photodetector for automatic power control and method of fabrication |
JP3792040B2 (ja) * | 1998-03-06 | 2006-06-28 | 松下電器産業株式会社 | 双方向光半導体装置 |
DE19838350B4 (de) | 1998-08-14 | 2004-04-15 | Infineon Technologies Ag | Optische Sendeeinrichtung |
WO2000013051A1 (en) | 1998-08-31 | 2000-03-09 | Digital Optics Corporation | Diffractive vertical cavity surface emitting laser power monitor and system |
US6588949B1 (en) | 1998-12-30 | 2003-07-08 | Honeywell Inc. | Method and apparatus for hermetically sealing photonic devices |
JP3770014B2 (ja) | 1999-02-09 | 2006-04-26 | 日亜化学工業株式会社 | 窒化物半導体素子 |
KR100683877B1 (ko) | 1999-03-04 | 2007-02-15 | 니치아 카가쿠 고교 가부시키가이샤 | 질화물 반도체 레이저소자 |
WO2000057522A1 (en) * | 1999-03-19 | 2000-09-28 | Cielo Communications, Inc. | Vcsel power monitoring system using plastic encapsulation techniques |
US6272988B1 (en) | 1999-04-14 | 2001-08-14 | Heidelberger Druckmaschinen Ag | Device for cleaning bearer surfaces on rotating cylinders |
US6233263B1 (en) * | 1999-06-04 | 2001-05-15 | Bandwidth9 | Monitoring and control assembly for wavelength stabilized optical system |
US7009692B2 (en) * | 1999-08-06 | 2006-03-07 | Lumenis Inc. | Arrangement for monitoring the power delivery of a photon channeling element |
US6580739B1 (en) | 1999-09-02 | 2003-06-17 | Agility Communications, Inc. | Integrated opto-electronic wavelength converter assembly |
US6624000B1 (en) | 1999-09-02 | 2003-09-23 | Agility Communications, Inc. | Method for making a monolithic wavelength converter assembly |
US6600845B1 (en) * | 1999-10-18 | 2003-07-29 | Digital Optics Corporation | Integrated parallel transmitter |
US6792178B1 (en) | 2000-01-12 | 2004-09-14 | Finisar Corporation | Fiber optic header with integrated power monitor |
DE10003087A1 (de) * | 2000-01-25 | 2001-09-13 | Infineon Technologies Ag | Anordnung für ein optoelektronisches Sende- und Empfangsmodul |
WO2002027874A2 (en) * | 2000-09-29 | 2002-04-04 | Cielo Communications, Inc. | High speed optical subassembly with ceramic carrier |
US6526076B2 (en) | 2000-12-15 | 2003-02-25 | Agilent Technologies, Inc. | Integrated parallel channel optical monitoring for parallel optics transmitter |
TW499049U (en) * | 2001-08-03 | 2002-08-11 | Hon Hai Prec Ind Co Ltd | Light source assembly |
US6549687B1 (en) * | 2001-10-26 | 2003-04-15 | Lake Shore Cryotronics, Inc. | System and method for measuring physical, chemical and biological stimuli using vertical cavity surface emitting lasers with integrated tuner |
US6903379B2 (en) * | 2001-11-16 | 2005-06-07 | Gelcore Llc | GaN based LED lighting extraction efficiency using digital diffractive phase grating |
JP4645008B2 (ja) * | 2002-06-10 | 2011-03-09 | 日亜化学工業株式会社 | 半導体レーザ装置 |
US7061025B2 (en) | 2003-03-10 | 2006-06-13 | Mccolloch Lawrence R | Optoelectronic device packaging assemblies and methods of making the same |
US6888988B2 (en) | 2003-03-14 | 2005-05-03 | Agilent Technologies, Inc. | Small form factor all-polymer optical device with integrated dual beam path based on total internal reflection optical turn |
US6836578B2 (en) * | 2003-04-14 | 2004-12-28 | Lake Shore Cryotronics, Inc. | System and method for measuring physical stimuli using vertical cavity surface emitting lasers with integrated tuning means |
KR100531416B1 (ko) * | 2003-09-17 | 2005-11-29 | 엘지.필립스 엘시디 주식회사 | Sls 장비 및 이를 이용한 실리콘 결정화 방법 |
US7403640B2 (en) * | 2003-10-27 | 2008-07-22 | Hewlett-Packard Development Company, L.P. | System and method for employing an object-oriented motion detector to capture images |
US7693197B2 (en) * | 2003-10-31 | 2010-04-06 | Hewlett-Packard Development Company, L.P. | Laser scanning apparatuses, laser scanning methods and article manufacture |
DE10354780A1 (de) * | 2003-11-21 | 2005-06-30 | Schott Ag | Refraktiv-diffraktive Hybridlinse, insbesondere zur Strahlformung von Hochleistungsdiodenlasern |
US7165896B2 (en) * | 2004-02-12 | 2007-01-23 | Hymite A/S | Light transmitting modules with optical power monitoring |
US7333684B2 (en) * | 2004-03-25 | 2008-02-19 | Integrated Crystal Technology Incorporated | Stack-integrated package of optical transceiver for single core full duplex fiber communications |
US7250590B2 (en) * | 2004-07-16 | 2007-07-31 | Infineon Technologies Fiber Optics Gmbh | Optoelectronic arrangement and a method for controlling the output power of a transmission component |
US7286581B2 (en) * | 2004-08-20 | 2007-10-23 | Avago Technologies Fiber Ip (Singapore) Pte Ltd | Self-monitoring light emitting apparatus |
US7850374B2 (en) | 2005-01-14 | 2010-12-14 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Optical transmitter module with an integrated lens and method for making the module |
US7767947B2 (en) * | 2005-09-20 | 2010-08-03 | Downing Jr John P | Semiconductor light source with optical feedback |
JP2008124428A (ja) * | 2006-10-19 | 2008-05-29 | Seiko Epson Corp | 光源装置及び画像表示装置 |
JP2008244101A (ja) * | 2007-03-27 | 2008-10-09 | Canon Inc | モニタリング方法およびモニタリング機能を有するvcselアレイ |
US7889993B2 (en) * | 2007-08-17 | 2011-02-15 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd | Optical transceiver module having a front facet reflector and methods for making and using a front facet reflector |
TW200947895A (en) * | 2008-05-08 | 2009-11-16 | Truelight Corp | Tri-wavelength bi-directional fiber communication system |
TWI362769B (en) | 2008-05-09 | 2012-04-21 | Univ Nat Chiao Tung | Light emitting device and fabrication method therefor |
EP2474074A1 (de) * | 2009-09-04 | 2012-07-11 | Spectralus Corporation | Effiziente und kompakte sichtbare mikrochip-laserquelle mit periodisch gepolten, nichtlinearen materialien |
JP5601014B2 (ja) * | 2010-04-23 | 2014-10-08 | 株式会社リコー | 光デバイス、光走査装置及び画像形成装置 |
US8483571B2 (en) | 2010-06-30 | 2013-07-09 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optical beam splitter for use in an optoelectronic module, and a method for performing optical beam splitting in an optoelectronic module |
US8502452B2 (en) | 2010-07-28 | 2013-08-06 | Usl Technologies, Llc | High-stability light source system and method of manufacturing |
JP2012151441A (ja) * | 2010-12-28 | 2012-08-09 | Ricoh Co Ltd | 光デバイス、光走査装置及び画像形成装置 |
KR102452484B1 (ko) * | 2017-08-11 | 2022-10-11 | 삼성전자주식회사 | 발광소자 패키지 및 발광소자 패키지 모듈 |
CN110275381B (zh) * | 2019-06-26 | 2021-09-21 | 业成科技(成都)有限公司 | 结构光发射模组及应用其的深度感测设备 |
US11631963B2 (en) * | 2019-09-18 | 2023-04-18 | Freedom Photonics Llc | Optical device with coating for operation in multiple environments |
JP7075016B2 (ja) * | 2019-10-18 | 2022-05-25 | 日亜化学工業株式会社 | 光源装置 |
WO2021083487A1 (en) * | 2019-10-28 | 2021-05-06 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Laser system and method for driving a laser system |
JP2021190463A (ja) * | 2020-05-26 | 2021-12-13 | 日亜化学工業株式会社 | 発光装置 |
CN113013722A (zh) * | 2021-02-09 | 2021-06-22 | 北京航空航天大学 | 一种小型化激光器模组 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS58153388A (ja) * | 1982-03-09 | 1983-09-12 | Toshiba Corp | 半導体レ−ザ出力光モニタ−方法 |
JPS6086887A (ja) * | 1983-10-19 | 1985-05-16 | Matsushita Electric Ind Co Ltd | 半導体レ−ザ装置 |
JPS6088486A (ja) * | 1983-10-20 | 1985-05-18 | Matsushita Electric Ind Co Ltd | 半導体レ−ザ装置 |
FR2581768B1 (fr) * | 1985-05-10 | 1987-09-04 | Thomson Csf | Composant optoelectrique bidirectionnel formant coupleur optique |
DE3687162D1 (de) * | 1985-12-10 | 1993-01-07 | Siemens Ag | Integriert-optischer multiplex-demultiplex-modul fuer die optische nachrichtenuebertragung. |
JPS62269374A (ja) * | 1986-05-16 | 1987-11-21 | Mitsubishi Electric Corp | 半導体レ−ザ装置 |
JPS6384184A (ja) * | 1986-09-29 | 1988-04-14 | Matsushita Electric Ind Co Ltd | 半導体レ−ザ装置 |
JPH01256189A (ja) * | 1988-04-06 | 1989-10-12 | Matsushita Electric Ind Co Ltd | 半導体レーザー |
JPH0290585A (ja) * | 1988-09-27 | 1990-03-30 | Nec Corp | レーザ装置 |
JPH02106989A (ja) * | 1988-10-17 | 1990-04-19 | Mitsubishi Electric Corp | 半導体レーザ装置 |
JPH02165684A (ja) * | 1988-12-20 | 1990-06-26 | Toshiba Corp | 半導体レーザ装置 |
JPH0324783A (ja) * | 1989-06-22 | 1991-02-01 | Ricoh Co Ltd | 半導体レーザ装置 |
JPH0376033A (ja) * | 1989-08-17 | 1991-04-02 | Mitsubishi Electric Corp | 半導体レーザ装置 |
JPH03189935A (ja) * | 1989-12-20 | 1991-08-19 | Hitachi Ltd | 半導体レーザとそれを用いた光情報装置 |
JPH04199890A (ja) * | 1990-11-29 | 1992-07-21 | Mitsubishi Electric Corp | 半導体レーザ装置 |
JPH05164925A (ja) * | 1991-12-16 | 1993-06-29 | Sharp Corp | 光集積回路、光ピックアップおよび光情報処理装置 |
JP2908657B2 (ja) * | 1992-05-18 | 1999-06-21 | 株式会社リコー | 半導体レーザアレイ記録装置 |
JPH05327122A (ja) * | 1992-05-20 | 1993-12-10 | Nec Corp | 半導体レーザ装置 |
US5247167A (en) * | 1992-08-06 | 1993-09-21 | International Business Machines Corporation | Multiple beam power monitoring system and method with radiation detection and focusing means of overlapping beams |
JPH06209138A (ja) * | 1993-01-08 | 1994-07-26 | Seiko Epson Corp | 光素子およびその製造方法およびその実装方法 |
JPH06216406A (ja) * | 1993-01-14 | 1994-08-05 | Sony Corp | 光送信器 |
JPH079698A (ja) * | 1993-06-21 | 1995-01-13 | Ricoh Co Ltd | マルチビーム光源装置 |
US5579328A (en) * | 1995-08-10 | 1996-11-26 | Northern Telecom Limited | Digital control of laser diode power levels |
-
1996
- 1996-01-25 US US08/599,504 patent/US5809050A/en not_active Expired - Fee Related
-
1997
- 1997-01-24 EP EP97300441A patent/EP0786838B1/de not_active Expired - Lifetime
- 1997-01-24 JP JP9011035A patent/JPH09214066A/ja active Pending
- 1997-01-24 DE DE69700605T patent/DE69700605D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5809050A (en) | 1998-09-15 |
JPH09214066A (ja) | 1997-08-15 |
EP0786838B1 (de) | 1999-10-13 |
EP0786838A3 (de) | 1997-10-08 |
EP0786838A2 (de) | 1997-07-30 |
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Legal Events
Date | Code | Title | Description |
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8332 | No legal effect for de |