JPH077074A - ウエハを解放する方法及び装置 - Google Patents

ウエハを解放する方法及び装置

Info

Publication number
JPH077074A
JPH077074A JP6674094A JP6674094A JPH077074A JP H077074 A JPH077074 A JP H077074A JP 6674094 A JP6674094 A JP 6674094A JP 6674094 A JP6674094 A JP 6674094A JP H077074 A JPH077074 A JP H077074A
Authority
JP
Japan
Prior art keywords
wafer
electrodes
support
power supply
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6674094A
Other languages
English (en)
Japanese (ja)
Inventor
Julian G Blake
ガスキル ブレイク ジュリアン
Weilin Tu
チュー ベイリン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eaton Corp
Original Assignee
Eaton Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eaton Corp filed Critical Eaton Corp
Publication of JPH077074A publication Critical patent/JPH077074A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
JP6674094A 1993-03-10 1994-03-10 ウエハを解放する方法及び装置 Pending JPH077074A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US029154 1993-03-10
US08/029,154 US5444597A (en) 1993-01-15 1993-03-10 Wafer release method and apparatus

Publications (1)

Publication Number Publication Date
JPH077074A true JPH077074A (ja) 1995-01-10

Family

ID=21847544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6674094A Pending JPH077074A (ja) 1993-03-10 1994-03-10 ウエハを解放する方法及び装置

Country Status (8)

Country Link
US (1) US5444597A (enExample)
EP (1) EP0615281B1 (enExample)
JP (1) JPH077074A (enExample)
KR (1) KR100304241B1 (enExample)
CN (1) CN1052112C (enExample)
CA (1) CA2118619C (enExample)
DE (1) DE69426163T2 (enExample)
TW (1) TW312034B (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007514325A (ja) * 2003-12-15 2007-05-31 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置およびデバイス製造方法
WO2007066572A1 (ja) 2005-12-06 2007-06-14 Creative Technology Corporation 静電チャック用電極シート及び静電チャック
JP2009010369A (ja) * 2007-06-14 2009-01-15 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
WO2010026893A1 (ja) 2008-09-04 2010-03-11 株式会社クリエイティブ テクノロジー 静電チャック装置及び基板の吸着状態判別方法
JP2013235991A (ja) * 2012-05-10 2013-11-21 Ulvac Japan Ltd 給電装置

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5684669A (en) * 1995-06-07 1997-11-04 Applied Materials, Inc. Method for dechucking a workpiece from an electrostatic chuck
US5463525A (en) * 1993-12-20 1995-10-31 International Business Machines Corporation Guard ring electrostatic chuck
US5467249A (en) * 1993-12-20 1995-11-14 International Business Machines Corporation Electrostatic chuck with reference electrode
EP0871843B1 (en) * 1994-10-17 2003-05-14 Varian Semiconductor Equipment Associates Inc. Mounting member and method for clamping a flat thin conductive workpiece
US5737175A (en) * 1996-06-19 1998-04-07 Lam Research Corporation Bias-tracking D.C. power circuit for an electrostatic chuck
JPH1014266A (ja) * 1996-06-21 1998-01-16 Sony Corp 静電チャック装置及び静電チャックを用いたウエハの保持方法及び静電チャックからのウエハの脱着方法
US5793192A (en) * 1996-06-28 1998-08-11 Lam Research Corporation Methods and apparatuses for clamping and declamping a semiconductor wafer in a wafer processing system
US5818682A (en) * 1996-08-13 1998-10-06 Applied Materials, Inc. Method and apparatus for optimizing a dechucking period used to dechuck a workpiece from an electrostatic chuck
JP3245369B2 (ja) * 1996-11-20 2002-01-15 東京エレクトロン株式会社 被処理体を静電チャックから離脱する方法及びプラズマ処理装置
US6075375A (en) * 1997-06-11 2000-06-13 Applied Materials, Inc. Apparatus for wafer detection
US5933314A (en) * 1997-06-27 1999-08-03 Lam Research Corp. Method and an apparatus for offsetting plasma bias voltage in bi-polar electro-static chucks
US5886865A (en) * 1998-03-17 1999-03-23 Applied Materials, Inc. Method and apparatus for predicting failure of an eletrostatic chuck
US5969934A (en) * 1998-04-10 1999-10-19 Varian Semiconductor Equipment Associats, Inc. Electrostatic wafer clamp having low particulate contamination of wafers
US6790375B1 (en) * 1998-09-30 2004-09-14 Lam Research Corporation Dechucking method and apparatus for workpieces in vacuum processors
US6125025A (en) * 1998-09-30 2000-09-26 Lam Research Corporation Electrostatic dechucking method and apparatus for dielectric workpieces in vacuum processors
US6965506B2 (en) * 1998-09-30 2005-11-15 Lam Research Corporation System and method for dechucking a workpiece from an electrostatic chuck
US6113165A (en) * 1998-10-02 2000-09-05 Taiwan Semiconductor Manufacturing Co., Ltd. Self-sensing wafer holder and method of using
US6238160B1 (en) * 1998-12-02 2001-05-29 Taiwan Semiconductor Manufacturing Company, Ltd' Method for transporting and electrostatically chucking a semiconductor wafer or the like
US6236555B1 (en) * 1999-04-19 2001-05-22 Applied Materials, Inc. Method for rapidly dechucking a semiconductor wafer from an electrostatic chuck utilizing a hysteretic discharge cycle
US6257001B1 (en) * 1999-08-24 2001-07-10 Lucent Technologies, Inc. Cryogenic vacuum pump temperature sensor
US6496053B1 (en) * 1999-10-13 2002-12-17 International Business Machines Corporation Corrosion insensitive fusible link using capacitance sensing for semiconductor devices
US6362946B1 (en) 1999-11-02 2002-03-26 Varian Semiconductor Equipment Associates, Inc. Electrostatic wafer clamp having electrostatic seal for retaining gas
US6538873B1 (en) 1999-11-02 2003-03-25 Varian Semiconductor Equipment Associates, Inc. Active electrostatic seal and electrostatic vacuum pump
US6307728B1 (en) * 2000-01-21 2001-10-23 Applied Materials, Inc. Method and apparatus for dechucking a workpiece from an electrostatic chuck
US6468384B1 (en) * 2000-11-09 2002-10-22 Novellus Systems, Inc. Predictive wafer temperature control system and method
JP3935367B2 (ja) * 2002-02-06 2007-06-20 キヤノン株式会社 表示素子駆動回路用の電源回路、表示装置及びカメラ
DE10214272B4 (de) * 2002-03-28 2004-09-02 Forschungszentrum Jülich GmbH Halterung für einen Wafer
US6710360B2 (en) 2002-07-10 2004-03-23 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter
US6774373B2 (en) * 2002-07-29 2004-08-10 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter
US6900444B2 (en) * 2002-07-29 2005-05-31 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter
TWI304158B (en) * 2003-01-15 2008-12-11 Asml Netherlands Bv Detection assembly and lithographic projection apparatus provided with such a detection assembly
US6740894B1 (en) 2003-02-21 2004-05-25 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter utilizing a linear scan motor
US7100954B2 (en) 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
US7072165B2 (en) * 2003-08-18 2006-07-04 Axcelis Technologies, Inc. MEMS based multi-polar electrostatic chuck
US6947274B2 (en) * 2003-09-08 2005-09-20 Axcelis Technologies, Inc. Clamping and de-clamping semiconductor wafers on an electrostatic chuck using wafer inertial confinement by applying a single-phase square wave AC clamping voltage
US7072166B2 (en) * 2003-09-12 2006-07-04 Axcelis Technologies, Inc. Clamping and de-clamping semiconductor wafers on a J-R electrostatic chuck having a micromachined surface by using force delay in applying a single-phase square wave AC clamping voltage
US6946403B2 (en) * 2003-10-28 2005-09-20 Axcelis Technologies, Inc. Method of making a MEMS electrostatic chuck
US6794664B1 (en) 2003-12-04 2004-09-21 Axcelis Technologies, Inc. Umbilical cord facilities connection for an ion beam implanter
CN1655022A (zh) * 2004-02-14 2005-08-17 鸿富锦精密工业（深圳）有限公司 基板贴合装置
US6987272B2 (en) * 2004-03-05 2006-01-17 Axcelis Technologies, Inc. Work piece transfer system for an ion beam implanter
US7030395B2 (en) * 2004-08-06 2006-04-18 Axcelis Technologies, Inc. Workpiece support structure for an ion beam implanter featuring spherical sliding seal vacuum feedthrough
US7982195B2 (en) * 2004-09-14 2011-07-19 Axcelis Technologies, Inc. Controlled dose ion implantation
US7629597B2 (en) * 2006-08-18 2009-12-08 Axcelis Technologies, Inc. Deposition reduction system for an ion implanter
KR101295776B1 (ko) * 2007-08-02 2013-08-12 삼성전자주식회사 직류 및 교류 전압들을 교대로 사용하는 웨이퍼의 디척킹방법 및 이를 채택하는 반도체 소자의 제조 장치
US9543110B2 (en) 2013-12-20 2017-01-10 Axcelis Technologies, Inc. Reduced trace metals contamination ion source for an ion implantation system
US20150357151A1 (en) 2014-06-10 2015-12-10 Axcelis Technologies, Inc. Ion implantation source with textured interior surfaces
CN108231515B (zh) * 2018-01-11 2019-10-11 上海华虹宏力半导体制造有限公司 减薄后的硅片背面注入工艺中的传送方法
US11280811B2 (en) * 2019-06-17 2022-03-22 Advanced Energy Industries, Inc. High side current monitor
CN112133665B (zh) * 2020-09-27 2025-07-04 北京京仪自动化装备技术股份有限公司 传送机械手
JP2024067609A (ja) * 2022-11-07 2024-05-17 ローム株式会社 半導体装置
CN119843252A (zh) * 2024-12-27 2025-04-18 江苏微导纳米科技股份有限公司 沉积系统和晶圆位置监测方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4184188A (en) * 1978-01-16 1980-01-15 Veeco Instruments Inc. Substrate clamping technique in IC fabrication processes
US4384918A (en) * 1980-09-30 1983-05-24 Fujitsu Limited Method and apparatus for dry etching and electrostatic chucking device used therein
GB2147459A (en) * 1983-09-30 1985-05-09 Philips Electronic Associated Electrostatic chuck for semiconductor wafers
JPS6216540A (ja) * 1985-07-15 1987-01-24 Canon Inc ウエハ搬送装置
JPS63257481A (ja) * 1987-04-14 1988-10-25 Abisare:Kk 静電保持装置
EP0297227B1 (en) * 1987-04-14 1993-03-17 Abisare Co., Ltd. Machine unit having retaining device using static electricity
US5103367A (en) * 1987-05-06 1992-04-07 Unisearch Limited Electrostatic chuck using A.C. field excitation
US4962441A (en) * 1989-04-10 1990-10-09 Applied Materials, Inc. Isolated electrostatic wafer blade clamp
JP2779950B2 (ja) * 1989-04-25 1998-07-23 東陶機器株式会社 静電チャックの電圧印加方法および電圧印加装置
US5173834A (en) * 1989-06-02 1992-12-22 Roland Dg Corporation Electrostatic attraction apparatus
US5179498A (en) * 1990-05-17 1993-01-12 Tokyo Electron Limited Electrostatic chuck device
EP0460954B1 (en) * 1990-06-08 1994-09-21 Varian Associates, Inc. Clamping a workpiece
EP0460955A1 (en) * 1990-06-08 1991-12-11 Varian Associates, Inc. Clamping a workpiece utilizing polyphase clamping voltage
US5325261A (en) * 1991-05-17 1994-06-28 Unisearch Limited Electrostatic chuck with improved release
US5184398A (en) * 1991-08-30 1993-02-09 Texas Instruments Incorporated In-situ real-time sheet resistance measurement method
US5315473A (en) * 1992-01-21 1994-05-24 Applied Materials, Inc. Isolated electrostatic chuck and excitation method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007514325A (ja) * 2003-12-15 2007-05-31 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置およびデバイス製造方法
WO2007066572A1 (ja) 2005-12-06 2007-06-14 Creative Technology Corporation 静電チャック用電極シート及び静電チャック
US7881036B2 (en) 2005-12-06 2011-02-01 Creative Technology Corporation Electrode sheet for electrostatic chuck, and electrostatic chuck
JP2009010369A (ja) * 2007-06-14 2009-01-15 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
US8013981B2 (en) 2007-06-14 2011-09-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2010026893A1 (ja) 2008-09-04 2010-03-11 株式会社クリエイティブ テクノロジー 静電チャック装置及び基板の吸着状態判別方法
JP2013235991A (ja) * 2012-05-10 2013-11-21 Ulvac Japan Ltd 給電装置

Also Published As

Publication number Publication date
DE69426163D1 (de) 2000-11-30
DE69426163T2 (de) 2001-05-23
CA2118619A1 (en) 1994-09-11
EP0615281A1 (en) 1994-09-14
US5444597A (en) 1995-08-22
TW312034B (enExample) 1997-08-01
KR940022782A (ko) 1994-10-21
KR100304241B1 (ko) 2001-11-30
CN1095526A (zh) 1994-11-23
CN1052112C (zh) 2000-05-03
CA2118619C (en) 2000-04-04
EP0615281B1 (en) 2000-10-25

Similar Documents

Publication Publication Date Title
JPH077074A (ja) ウエハを解放する方法及び装置
US5436790A (en) Wafer sensing and clamping monitor
CN100524682C (zh) 移开晶片的方法及静电吸盘装置
US5737177A (en) Apparatus and method for actively controlling the DC potential of a cathode pedestal
US5452177A (en) Electrostatic wafer clamp
CN101006630B (zh) 等离子体加工中确定正确的平均偏置补偿电压的方法
US5103367A (en) Electrostatic chuck using A.C. field excitation
US9076831B2 (en) Substrate clamping system and method for operating the same
JPH1074826A (ja) 静電チャックから被加工物を解放する方法および装置
US7869185B2 (en) Method of de-chucking wafer using direct voltage and alternating voltage, and apparatus for fabricating semiconductor device using the same
WO2002009172A1 (en) Workpiece holding mechanism
WO1998000861A1 (en) Methods and apparatuses for clamping and declamping a semiconductor wafer in a wafer processing system
US20040182311A1 (en) Semiconductor processing apparatus having semiconductor wafer mounting
JPH08191099A (ja) 静電チャック及びその製造方法
JPH0878512A (ja) 静電吸着装置及び方法
JPH09260472A (ja) 静電チャック
JPH118291A (ja) 静電吸着装置
JPH10284471A (ja) ドライエッチング装置
JPH07211769A (ja) プラズマ処理方法および装置
JPH05136254A (ja) 静電吸着装置
JPH077071A (ja) 静電チャック
JPH0786380A (ja) 静電チャック
JP4365300B2 (ja) プラズマ処理装置およびプラズマ処理方法