KR100304241B1 - 웨이퍼 방출 방법 및 장치 - Google Patents

웨이퍼 방출 방법 및 장치 Download PDF

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Publication number
KR100304241B1
KR100304241B1 KR1019940004577A KR19940004577A KR100304241B1 KR 100304241 B1 KR100304241 B1 KR 100304241B1 KR 1019940004577 A KR1019940004577 A KR 1019940004577A KR 19940004577 A KR19940004577 A KR 19940004577A KR 100304241 B1 KR100304241 B1 KR 100304241B1
Authority
KR
South Korea
Prior art keywords
wafer
support
power supply
polarity
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019940004577A
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English (en)
Korean (ko)
Other versions
KR940022782A (ko
Inventor
쥴리안가스길브레이크
웨일린투
Original Assignee
브라이언 알. 바흐맨
액셀리스 테크놀로지스, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 브라이언 알. 바흐맨, 액셀리스 테크놀로지스, 인크. filed Critical 브라이언 알. 바흐맨
Publication of KR940022782A publication Critical patent/KR940022782A/ko
Application granted granted Critical
Publication of KR100304241B1 publication Critical patent/KR100304241B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
KR1019940004577A 1993-03-10 1994-03-09 웨이퍼 방출 방법 및 장치 Expired - Fee Related KR100304241B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US029,154 1993-03-10
US08/029,154 US5444597A (en) 1993-01-15 1993-03-10 Wafer release method and apparatus

Publications (2)

Publication Number Publication Date
KR940022782A KR940022782A (ko) 1994-10-21
KR100304241B1 true KR100304241B1 (ko) 2001-11-30

Family

ID=21847544

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940004577A Expired - Fee Related KR100304241B1 (ko) 1993-03-10 1994-03-09 웨이퍼 방출 방법 및 장치

Country Status (8)

Country Link
US (1) US5444597A (enExample)
EP (1) EP0615281B1 (enExample)
JP (1) JPH077074A (enExample)
KR (1) KR100304241B1 (enExample)
CN (1) CN1052112C (enExample)
CA (1) CA2118619C (enExample)
DE (1) DE69426163T2 (enExample)
TW (1) TW312034B (enExample)

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US5463525A (en) * 1993-12-20 1995-10-31 International Business Machines Corporation Guard ring electrostatic chuck
US5467249A (en) * 1993-12-20 1995-11-14 International Business Machines Corporation Electrostatic chuck with reference electrode
EP0871843B1 (en) * 1994-10-17 2003-05-14 Varian Semiconductor Equipment Associates Inc. Mounting member and method for clamping a flat thin conductive workpiece
US5737175A (en) * 1996-06-19 1998-04-07 Lam Research Corporation Bias-tracking D.C. power circuit for an electrostatic chuck
JPH1014266A (ja) * 1996-06-21 1998-01-16 Sony Corp 静電チャック装置及び静電チャックを用いたウエハの保持方法及び静電チャックからのウエハの脱着方法
US5793192A (en) * 1996-06-28 1998-08-11 Lam Research Corporation Methods and apparatuses for clamping and declamping a semiconductor wafer in a wafer processing system
US5818682A (en) * 1996-08-13 1998-10-06 Applied Materials, Inc. Method and apparatus for optimizing a dechucking period used to dechuck a workpiece from an electrostatic chuck
JP3245369B2 (ja) * 1996-11-20 2002-01-15 東京エレクトロン株式会社 被処理体を静電チャックから離脱する方法及びプラズマ処理装置
US6075375A (en) * 1997-06-11 2000-06-13 Applied Materials, Inc. Apparatus for wafer detection
US5933314A (en) * 1997-06-27 1999-08-03 Lam Research Corp. Method and an apparatus for offsetting plasma bias voltage in bi-polar electro-static chucks
US5886865A (en) * 1998-03-17 1999-03-23 Applied Materials, Inc. Method and apparatus for predicting failure of an eletrostatic chuck
US5969934A (en) * 1998-04-10 1999-10-19 Varian Semiconductor Equipment Associats, Inc. Electrostatic wafer clamp having low particulate contamination of wafers
US6790375B1 (en) * 1998-09-30 2004-09-14 Lam Research Corporation Dechucking method and apparatus for workpieces in vacuum processors
US6125025A (en) * 1998-09-30 2000-09-26 Lam Research Corporation Electrostatic dechucking method and apparatus for dielectric workpieces in vacuum processors
US6965506B2 (en) * 1998-09-30 2005-11-15 Lam Research Corporation System and method for dechucking a workpiece from an electrostatic chuck
US6113165A (en) * 1998-10-02 2000-09-05 Taiwan Semiconductor Manufacturing Co., Ltd. Self-sensing wafer holder and method of using
US6238160B1 (en) * 1998-12-02 2001-05-29 Taiwan Semiconductor Manufacturing Company, Ltd' Method for transporting and electrostatically chucking a semiconductor wafer or the like
US6236555B1 (en) * 1999-04-19 2001-05-22 Applied Materials, Inc. Method for rapidly dechucking a semiconductor wafer from an electrostatic chuck utilizing a hysteretic discharge cycle
US6257001B1 (en) * 1999-08-24 2001-07-10 Lucent Technologies, Inc. Cryogenic vacuum pump temperature sensor
US6496053B1 (en) * 1999-10-13 2002-12-17 International Business Machines Corporation Corrosion insensitive fusible link using capacitance sensing for semiconductor devices
US6362946B1 (en) 1999-11-02 2002-03-26 Varian Semiconductor Equipment Associates, Inc. Electrostatic wafer clamp having electrostatic seal for retaining gas
US6538873B1 (en) 1999-11-02 2003-03-25 Varian Semiconductor Equipment Associates, Inc. Active electrostatic seal and electrostatic vacuum pump
US6307728B1 (en) * 2000-01-21 2001-10-23 Applied Materials, Inc. Method and apparatus for dechucking a workpiece from an electrostatic chuck
US6468384B1 (en) * 2000-11-09 2002-10-22 Novellus Systems, Inc. Predictive wafer temperature control system and method
JP3935367B2 (ja) * 2002-02-06 2007-06-20 キヤノン株式会社 表示素子駆動回路用の電源回路、表示装置及びカメラ
DE10214272B4 (de) * 2002-03-28 2004-09-02 Forschungszentrum Jülich GmbH Halterung für einen Wafer
US6710360B2 (en) 2002-07-10 2004-03-23 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter
US6774373B2 (en) * 2002-07-29 2004-08-10 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter
US6900444B2 (en) * 2002-07-29 2005-05-31 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter
TWI304158B (en) * 2003-01-15 2008-12-11 Asml Netherlands Bv Detection assembly and lithographic projection apparatus provided with such a detection assembly
US6740894B1 (en) 2003-02-21 2004-05-25 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter utilizing a linear scan motor
US7100954B2 (en) 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
US7072165B2 (en) * 2003-08-18 2006-07-04 Axcelis Technologies, Inc. MEMS based multi-polar electrostatic chuck
US6947274B2 (en) * 2003-09-08 2005-09-20 Axcelis Technologies, Inc. Clamping and de-clamping semiconductor wafers on an electrostatic chuck using wafer inertial confinement by applying a single-phase square wave AC clamping voltage
US7072166B2 (en) * 2003-09-12 2006-07-04 Axcelis Technologies, Inc. Clamping and de-clamping semiconductor wafers on a J-R electrostatic chuck having a micromachined surface by using force delay in applying a single-phase square wave AC clamping voltage
US6946403B2 (en) * 2003-10-28 2005-09-20 Axcelis Technologies, Inc. Method of making a MEMS electrostatic chuck
US6794664B1 (en) 2003-12-04 2004-09-21 Axcelis Technologies, Inc. Umbilical cord facilities connection for an ion beam implanter
US7245357B2 (en) * 2003-12-15 2007-07-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN1655022A (zh) * 2004-02-14 2005-08-17 鸿富锦精密工业（深圳）有限公司 基板贴合装置
US6987272B2 (en) * 2004-03-05 2006-01-17 Axcelis Technologies, Inc. Work piece transfer system for an ion beam implanter
US7030395B2 (en) * 2004-08-06 2006-04-18 Axcelis Technologies, Inc. Workpiece support structure for an ion beam implanter featuring spherical sliding seal vacuum feedthrough
US7982195B2 (en) * 2004-09-14 2011-07-19 Axcelis Technologies, Inc. Controlled dose ion implantation
KR100994299B1 (ko) 2005-12-06 2010-11-12 가부시키가이샤 크리에이티브 테크놀러지 정전척용 전극 시트 및 정전척
US7629597B2 (en) * 2006-08-18 2009-12-08 Axcelis Technologies, Inc. Deposition reduction system for an ion implanter
US8013981B2 (en) 2007-06-14 2011-09-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101295776B1 (ko) * 2007-08-02 2013-08-12 삼성전자주식회사 직류 및 교류 전압들을 교대로 사용하는 웨이퍼의 디척킹방법 및 이를 채택하는 반도체 소자의 제조 장치
CN102144285B (zh) 2008-09-04 2013-01-02 创意科技股份有限公司 静电吸盘装置和基片的吸附状态判断方法
JP5957287B2 (ja) * 2012-05-10 2016-07-27 株式会社アルバック 給電装置
US9543110B2 (en) 2013-12-20 2017-01-10 Axcelis Technologies, Inc. Reduced trace metals contamination ion source for an ion implantation system
US20150357151A1 (en) 2014-06-10 2015-12-10 Axcelis Technologies, Inc. Ion implantation source with textured interior surfaces
CN108231515B (zh) * 2018-01-11 2019-10-11 上海华虹宏力半导体制造有限公司 减薄后的硅片背面注入工艺中的传送方法
US11280811B2 (en) * 2019-06-17 2022-03-22 Advanced Energy Industries, Inc. High side current monitor
CN112133665B (zh) * 2020-09-27 2025-07-04 北京京仪自动化装备技术股份有限公司 传送机械手
JP2024067609A (ja) * 2022-11-07 2024-05-17 ローム株式会社 半導体装置
CN119843252A (zh) * 2024-12-27 2025-04-18 江苏微导纳米科技股份有限公司 沉积系统和晶圆位置监测方法

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JPS6216540A (ja) * 1985-07-15 1987-01-24 Canon Inc ウエハ搬送装置
US4962441A (en) * 1989-04-10 1990-10-09 Applied Materials, Inc. Isolated electrostatic wafer blade clamp
EP0460955A1 (en) * 1990-06-08 1991-12-11 Varian Associates, Inc. Clamping a workpiece utilizing polyphase clamping voltage
US5117121A (en) * 1989-04-25 1992-05-26 Toto Ltd. Method of and apparatus for applying voltage to electrostatic chuck

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EP0460955A1 (en) * 1990-06-08 1991-12-11 Varian Associates, Inc. Clamping a workpiece utilizing polyphase clamping voltage

Also Published As

Publication number Publication date
DE69426163D1 (de) 2000-11-30
DE69426163T2 (de) 2001-05-23
CA2118619A1 (en) 1994-09-11
JPH077074A (ja) 1995-01-10
EP0615281A1 (en) 1994-09-14
US5444597A (en) 1995-08-22
TW312034B (enExample) 1997-08-01
KR940022782A (ko) 1994-10-21
CN1095526A (zh) 1994-11-23
CN1052112C (zh) 2000-05-03
CA2118619C (en) 2000-04-04
EP0615281B1 (en) 2000-10-25

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